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XC1765EPDG8C Технические параметры

Xilinx Inc.  XC1765EPDG8C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory - Configuration Proms for FPGAs
Марка
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8Pins
Memory Types PROM
Operating Temperature 0°C~70°C
Packaging Tube
Published 2004
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
Termination Through Hole
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Voltage - Supply 4.75V~5.25V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1Function
Supply Voltage 5V
Свойство продукта Значение свойства
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC1765E
Pin Count 8
Supply Voltage-Max (Vsup) 5.25V
Power Supplies 5V
Supply Voltage-Min (Vsup) 4.75V
Programmable Type OTP
Interface Serial
Memory Size 65kb
Clock Frequency 10MHz
Organization 64KX1
Output Characteristics 3-STATE
Memory Width 1
Density 64 kb
Standby Current-Max 0.00005A
I/O Type COMMON
Length 9.3599mm
Height Seated (Max) 4.5974mm
Width 7.62mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status RoHS Compliant
Просмотр сходства

XC1765EPDG8C Документы

XC1765EPDG8C brand manufacturers: Xilinx Inc., Anli stock, XC1765EPDG8C reference price.Xilinx Inc.. XC1765EPDG8C parameters, XC1765EPDG8C Datasheet PDF and pin diagram description download.You can use the XC1765EPDG8C Memory - Configuration Proms for FPGAs, DSP Datesheet PDF, find XC1765EPDG8C pin diagram and circuit diagram and usage method of function,XC1765EPDG8C electronics tutorials.You can download from the Anli.