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- XC2S150-6FG456C
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XC2S150-6FG456C Технические параметры
Xilinx Inc. XC2S150-6FG456C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Factory Lead Time | 10 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 456-BBGA | |
| Number of Pins | 456Pins | |
| Number of I/Os | 260I/Os | |
| Operating Temperature | 0°C~85°C TJ | |
| Packaging | Tray | |
| Series | Spartan®-II | |
| Published | 2004 | |
| JESD-609 Code | e0 | |
| Pbfree Code | no | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 456Terminations | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 2.375V~2.625V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Peak Reflow Temperature (Cel) | 225 | |
| Supply Voltage | 2.5V | |
| Terminal Pitch | 1mm | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XC2S150 | |
| Pin Count | 456 | |
| Number of Outputs | 260Outputs | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 2.5V | |
| RAM Size | 6kB | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 3888Logic Elements/Cells | |
| Total RAM Bits | 49152 | |
| Number of Gates | 150000Gates | |
| Number of LABs/CLBs | 864LABs/CLBs | |
| Speed Grade | 6 | |
| Number of CLBs | 864CLBs | |
| Length | 23mm | |
| Width | 23mm | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
XC2S150-6FG456C Документы
- DatasheetsSpartan-II FPGA Family
- PCN Design/SpecificationFG(G) and BG(G) Wire Bond 25/Jan/2013
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