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- XC2S200-6FGG256C
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XC2S200-6FGG256C Технические параметры
Xilinx Inc. XC2S200-6FGG256C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Factory Lead Time | 10 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 256-BGA | |
| Number of Pins | 256Pins | |
| Number of I/Os | 176I/Os | |
| Operating Temperature | 0°C~85°C TJ | |
| Packaging | Tray | |
| Series | Spartan®-II | |
| Published | 2008 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 256Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 2.375V~2.625V | |
| Terminal Position | BOTTOM |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 2.5V | |
| Terminal Pitch | 1mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XC2S200 | |
| Pin Count | 256 | |
| Number of Outputs | 284Outputs | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 2.5V | |
| RAM Size | 7kB | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 5292Logic Elements/Cells | |
| Total RAM Bits | 57344 | |
| Number of Gates | 200000Gates | |
| Number of LABs/CLBs | 1176LABs/CLBs | |
| Speed Grade | 6 | |
| Length | 17mm | |
| Height Seated (Max) | 2mm | |
| Width | 17mm | |
| RoHS Status | ROHS3 Compliant |
XC2S200-6FGG256C Документы
- DatasheetsSpartan-II FPGA Family
- Environmental InformationXilinx RoHS3
- PCN Assembly/OriginAssembly Site Addition 01/Jun/2015
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