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- XC2V250-6FGG456C
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XC2V250-6FGG456C Технические параметры
Xilinx Inc. XC2V250-6FGG456C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 456-BBGA | |
| Number of Pins | 456Pins | |
| Number of I/Os | 200I/Os | |
| Operating Temperature | 0°C~85°C TJ | |
| Packaging | Tray | |
| Series | Virtex®-II | |
| Published | 2007 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 456Terminations | |
| ECCN Code | 3A991.D | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 1.425V~1.575V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Supply Voltage | 1.5V | |
| Terminal Pitch | 1mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XC2V250 | |
| Pin Count | 456 | |
| Number of Outputs | 200Outputs | |
| Operating Supply Voltage | 1.5V | |
| Power Supplies | 1.51.5/3.33.3V | |
| RAM Size | 54kB | |
| Clock Frequency | 820MHz | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Total RAM Bits | 442368 | |
| Number of Gates | 250000Gates | |
| Number of LABs/CLBs | 384LABs/CLBs | |
| Speed Grade | 6 | |
| Number of Registers | 3072Registers | |
| Combinatorial Delay of a CLB-Max | 0.35 ns | |
| Number of CLBs | 384CLBs | |
| Length | 23mm | |
| Width | 23mm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant |
XC2V250-6FGG456C Документы
- DatasheetsVirtex-II Platform FPGAs
- PCN Obsolescence/ EOLSpartan, Virtex, XC17V00 24/Apr/2013
- PCN Design/SpecificationFG(G) and BG(G) Wire Bond 25/Jan/2013
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