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XC3S400AN-4FTG256I Технические параметры
Xilinx Inc. XC3S400AN-4FTG256I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Factory Lead Time | 16 Weeks | |
| Package / Case | 256-LBGA | |
| Mounting Type | Surface Mount | |
| Mount | Surface Mount | |
| Number of Pins | 256Pins | |
| Number of I/Os | 195I/Os | |
| Series | Spartan®-3AN | |
| Published | 1999 | |
| Packaging | Tray | |
| Operating Temperature | -40°C~100°C TJ | |
| JESD-609 Code | e1 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 256Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Voltage - Supply | 1.14V~1.26V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 1.2V |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Pitch | 1mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XC3S400AN | |
| Pin Count | 256 | |
| Number of Outputs | 160Outputs | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 1.2V | |
| Power Supplies | 1.21.2/3.33.3V | |
| RAM Size | 45kB | |
| Clock Frequency | 667MHz | |
| Propagation Delay | 4.88 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 8064Logic Elements/Cells | |
| Total RAM Bits | 368640 | |
| Number of Gates | 400000Gates | |
| Speed Grade | 4 | |
| Number of Registers | 896Registers | |
| Combinatorial Delay of a CLB-Max | 0.71 ns | |
| Number of CLBs | 896CLBs | |
| Height Seated (Max) | 1.55mm | |
| Width | 17mm | |
| Length | 17mm | |
| RoHS Status | ROHS3 Compliant |
XC3S400AN-4FTG256I Документы
- DatasheetsSpartan-3AN FPGA Datasheet Spartan-3AN FPGA User Guide Spartan-3AN Brochure
- PCN Design/SpecificationFG(G) and BG(G) Wire Bond 25/Jan/2013
- PCN OtherWafer Fab Transfer/Copper Wire 05/May/2014
- Environmental InformationXilinx RoHS3
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