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XC6SLX100-L1FGG676I Технические параметры
Xilinx Inc. XC6SLX100-L1FGG676I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Factory Lead Time | 10 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 676-BGA | |
| Number of Pins | 676Pins | |
| Number of I/Os | 480I/Os | |
| Operating Temperature | -40°C~100°C TJ | |
| Packaging | Tray | |
| Series | Spartan®-6 LX | |
| Published | 2008 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 676Terminations | |
| ECCN Code | 3A991.D | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 1.14V~1.26V | |
| Terminal Position | BOTTOM |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Supply Voltage | 1V | |
| Terminal Pitch | 1mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XC6SLX100 | |
| Pin Count | 676 | |
| Number of Outputs | 480Outputs | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 1V | |
| Power Supplies | 12.5/3.3V | |
| RAM Size | 603kB | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 101261Logic Elements/Cells | |
| Total RAM Bits | 4939776 | |
| Number of LABs/CLBs | 7911LABs/CLBs | |
| Number of Registers | 126576Registers | |
| Combinatorial Delay of a CLB-Max | 0.46 ns | |
| Length | 27mm | |
| Height Seated (Max) | 2.44mm | |
| Width | 27mm | |
| RoHS Status | ROHS3 Compliant |
XC6SLX100-L1FGG676I Документы
- DatasheetsSpartan-6 FPGA Datasheet Spartan-6 Family Overview XC6SLX100-L1FGG676I-Xilinx-datasheet-13696830.pdf
- Environmental InformationXilinx RoHS3
- PCN Design/SpecificationFG(G) and BG(G) Wire Bond 25/Jan/2013
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