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XC7Z010-2CLG400E Технические параметры
Xilinx Inc. XC7Z010-2CLG400E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | ||
| Factory Lead Time | 10 Weeks | |
| Contact Plating | Copper, Silver, Tin | |
| Package / Case | 400-LFBGA, CSPBGA | |
| Surface Mount | YES | |
| Number of Pins | 400Pins | |
| Number of I/Os | 130I/Os | |
| Operating Temperature | 0°C~100°C TJ | |
| Packaging | Tray | |
| Series | Zynq®-7000 | |
| Published | 2010 | |
| JESD-609 Code | e1 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 400Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 1V |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Pitch | 0.8mm | |
| Frequency | 766MHz | |
| Base Part Number | XC7Z010 | |
| Operating Supply Voltage | 1V | |
| Supply Voltage-Max (Vsup) | 1.05V | |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | |
| RAM Size | 256KB | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Peripherals | DMA | |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MCU, FPGA | |
| Data Bus Width | 32b | |
| Core Architecture | ARM | |
| Boundary Scan | YES | |
| Speed Grade | -2 | |
| RAM (words) | 256000 | |
| Primary Attributes | Artix™-7 FPGA, 28K Logic Cells | |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB | |
| Length | 17mm | |
| Height Seated (Max) | 1.6mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
XC7Z010-2CLG400E Документы
- DatasheetsZynq-7000 User Guide Zynq-7000 SoC Specification Zynq-7000 All Programmable SoC Overview
- PCN Assembly/OriginAdditional Wafer Fabrication 16/Dec/2013
- Environmental InformationXilinx RoHS3
- PCN Design/SpecificationZynq-7000 AP Requirement 28/Sep/2015
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