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Xilinx Inc. XC7Z035-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Свойство продукта | Значение свойства | |
---|---|---|
Классификация | Embedded - System On Chip (SoC) | |
Марка | ||
Factory Lead Time | 10 Weeks | |
Contact Plating | Copper, Silver, Tin | |
Mount | Surface Mount | |
Package / Case | 676-BBGA, FCBGA | |
Number of I/Os | 130I/Os | |
Operating Temperature | 0°C~85°C TJ | |
Packaging | Tray | |
Series | Zynq®-7000 | |
Published | 2010 | |
JESD-609 Code | e1 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 676Terminations | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Supply Voltage | 1V | |
Frequency | 667MHz | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Свойство продукта | Значение свойства | |
---|---|---|
JESD-30 Code | S-PBGA-B676 | |
Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | |
Max Supply Voltage | 1.05V | |
Min Supply Voltage | 950mV | |
RAM Size | 256KB | |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
Peripherals | DMA | |
Propagation Delay | 120 ps | |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Architecture | MCU, FPGA | |
Core Architecture | ARM | |
Boundary Scan | YES | |
Speed Grade | 1 | |
RAM (words) | 256000 | |
Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells | |
Number of Registers | 343800Registers | |
Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB | |
Length | 27mm | |
Height Seated (Max) | 2.54mm | |
Width | 27mm | |
RoHS Status | ROHS3 Compliant |