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XC7Z035-1FBG676C Технические параметры

Xilinx Inc.  XC7Z035-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 676-BBGA, FCBGA
Number of I/Os 130I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676Terminations
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Свойство продукта Значение свойства
JESD-30 Code S-PBGA-B676
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 120 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800Registers
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Length 27mm
Height Seated (Max) 2.54mm
Width 27mm
RoHS Status ROHS3 Compliant

XC7Z035-1FBG676C Документы

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