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XC7Z035-1FFG900I Технические параметры

Xilinx Inc.  XC7Z035-1FFG900I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Factory Lead Time 10 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Number of Pins 900Pins
Number of I/Os 130I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Свойство продукта Значение свойства
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Operating Supply Voltage 1V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 130 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800Registers
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.35mm
RoHS Status ROHS3 Compliant
Просмотр сходства
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