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XC7Z035-2FFG900E Технические параметры

Xilinx Inc.  XC7Z035-2FFG900E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 900-BBGA, FCBGA
Number of I/Os 130I/Os
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900Terminations
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Свойство продукта Значение свойства
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 100 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 2
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800Registers
Length 31mm
Height Seated (Max) 3.35mm
Width 31mm
RoHS Status ROHS3 Compliant
Просмотр сходства

XC7Z035-2FFG900E Документы

XC7Z035-2FFG900E brand manufacturers: Xilinx Inc., Anli stock, XC7Z035-2FFG900E reference price.Xilinx Inc.. XC7Z035-2FFG900E parameters, XC7Z035-2FFG900E Datasheet PDF and pin diagram description download.You can use the XC7Z035-2FFG900E Embedded - System On Chip (SoC), DSP Datesheet PDF, find XC7Z035-2FFG900E pin diagram and circuit diagram and usage method of function,XC7Z035-2FFG900E electronics tutorials.You can download from the Anli.