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- XCV50-4BG256C
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XCV50-4BG256C Технические параметры
Xilinx Inc. XCV50-4BG256C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - FPGAs (Field Programmable Gate Array) | |
| Марка | ||
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 256-BBGA | |
| Number of Pins | 256Pins | |
| Number of I/Os | 180I/Os | |
| Operating Temperature | 0°C~85°C TJ | |
| Packaging | Tray | |
| Series | Virtex® | |
| Published | 2000 | |
| JESD-609 Code | e0 | |
| Pbfree Code | no | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 256Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 2.375V~2.625V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 225 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Supply Voltage | 2.5V | |
| Terminal Pitch | 1.27mm | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XCV50 | |
| Pin Count | 256 | |
| Number of Outputs | 180Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 1.2/3.62.5V | |
| RAM Size | 4kB | |
| Clock Frequency | 250MHz | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 1728Logic Elements/Cells | |
| Total RAM Bits | 32768 | |
| Number of Gates | 57906Gates | |
| Number of LABs/CLBs | 384LABs/CLBs | |
| Combinatorial Delay of a CLB-Max | 0.8 ns | |
| Number of CLBs | 384CLBs | |
| Length | 27mm | |
| Height Seated (Max) | 2.55mm | |
| Width | 27mm | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
XCV50-4BG256C Документы
- DatasheetsVirtex 2.5 V
- PCN Obsolescence/ EOLSpartan,Virtex FPGA/SCD 18/Oct/2010
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