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Xilinx Inc. XCZU19EG-2FFVC1760I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Свойство продукта | Значение свойства | |
---|---|---|
Классификация | Embedded - System On Chip (SoC) | |
Марка | ||
Factory Lead Time | 11 Weeks | |
Package / Case | 1760-BBGA, FCBGA | |
Number of I/Os | 512I/Os | |
Operating Temperature | -40°C~100°C TJ | |
Packaging | Tray | |
Series | Zynq® UltraScale+™ MPSoC EG | |
Published | 2016 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Свойство продукта | Значение свойства | |
---|---|---|
HTS Code | 8542.31.00.01 | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Speed | 533MHz, 600MHz, 1.3GHz | |
RAM Size | 256KB | |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
Peripherals | DMA, WDT | |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Architecture | MCU, FPGA | |
Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |
RoHS Status | ROHS3 Compliant |