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XCZU19EG-2FFVC1760I Технические параметры

Xilinx Inc.  XCZU19EG-2FFVC1760I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Number of I/Os 512I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Свойство продукта Значение свойства
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status ROHS3 Compliant
Просмотр сходства
XCZU19EG-2FFVC1760I brand manufacturers: Xilinx Inc., Anli stock, XCZU19EG-2FFVC1760I reference price.Xilinx Inc.. XCZU19EG-2FFVC1760I parameters, XCZU19EG-2FFVC1760I Datasheet PDF and pin diagram description download.You can use the XCZU19EG-2FFVC1760I Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCZU19EG-2FFVC1760I pin diagram and circuit diagram and usage method of function,XCZU19EG-2FFVC1760I electronics tutorials.You can download from the Anli.