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XCZU19EG-L2FFVC1760E Технические параметры

Xilinx Inc.  XCZU19EG-L2FFVC1760E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Surface Mount YES
Number of I/Os 512I/Os
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Свойство продукта Значение свойства
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1760
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status ROHS3 Compliant
Просмотр сходства

XCZU19EG-L2FFVC1760E Документы

XCZU19EG-L2FFVC1760E brand manufacturers: Xilinx Inc., Anli stock, XCZU19EG-L2FFVC1760E reference price.Xilinx Inc.. XCZU19EG-L2FFVC1760E parameters, XCZU19EG-L2FFVC1760E Datasheet PDF and pin diagram description download.You can use the XCZU19EG-L2FFVC1760E Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCZU19EG-L2FFVC1760E pin diagram and circuit diagram and usage method of function,XCZU19EG-L2FFVC1760E electronics tutorials.You can download from the Anli.