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XCZU2EG-3SFVC784E Технические параметры
Xilinx Inc. XCZU2EG-3SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | ||
| Factory Lead Time | 25 Weeks | |
| Package / Case | 784-BFBGA, FCBGA | |
| Surface Mount | YES | |
| Number of I/Os | 252I/Os | |
| Operating Temperature | 0°C~100°C TJ | |
| Packaging | Tray | |
| Series | Zynq® UltraScale+™ MPSoC EG | |
| Published | 2013 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Number of Terminations | 784Terminations | |
| HTS Code | 8542.31.00.01 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Supply Voltage | 0.9V | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B784 | |
| Speed | 600MHz, 667MHz, 1.5GHz | |
| RAM Size | 256KB | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
| Peripherals | DMA, WDT | |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MCU, FPGA | |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
XCZU2EG-3SFVC784E Документы
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