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XCZU3CG-L1SFVC784I Технические параметры

Xilinx Inc.  XCZU3CG-L1SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Number of I/Os 252I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC CG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784Terminations
Additional Feature IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)
HTS Code 8542.31.00.01
Свойство продукта Значение свойства
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Speed 500MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant
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XCZU3CG-L1SFVC784I Документы

XCZU3CG-L1SFVC784I brand manufacturers: Xilinx Inc., Anli stock, XCZU3CG-L1SFVC784I reference price.Xilinx Inc.. XCZU3CG-L1SFVC784I parameters, XCZU3CG-L1SFVC784I Datasheet PDF and pin diagram description download.You can use the XCZU3CG-L1SFVC784I Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCZU3CG-L1SFVC784I pin diagram and circuit diagram and usage method of function,XCZU3CG-L1SFVC784I electronics tutorials.You can download from the Anli.