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XCZU3EG-2SFVA625I Технические параметры

Xilinx Inc.  XCZU3EG-2SFVA625I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Number of I/Os 180I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 625Terminations
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Свойство продукта Значение свойства
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B625
Supply Voltage-Max (Vsup) 0.876V
Supply Voltage-Min (Vsup) 0.825V
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant
Просмотр сходства

XCZU3EG-2SFVA625I Документы

XCZU3EG-2SFVA625I brand manufacturers: Xilinx Inc., Anli stock, XCZU3EG-2SFVA625I reference price.Xilinx Inc.. XCZU3EG-2SFVA625I parameters, XCZU3EG-2SFVA625I Datasheet PDF and pin diagram description download.You can use the XCZU3EG-2SFVA625I Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCZU3EG-2SFVA625I pin diagram and circuit diagram and usage method of function,XCZU3EG-2SFVA625I electronics tutorials.You can download from the Anli.