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XCZU4CG-L2FBVB900E Технические параметры

Xilinx Inc.  XCZU4CG-L2FBVB900E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Number of I/Os 204I/Os
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC CG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900Terminations
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Свойство продукта Значение свойства
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Speed 500MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status ROHS3 Compliant
Просмотр сходства

XCZU4CG-L2FBVB900E Документы

XCZU4CG-L2FBVB900E brand manufacturers: Xilinx Inc., Anli stock, XCZU4CG-L2FBVB900E reference price.Xilinx Inc.. XCZU4CG-L2FBVB900E parameters, XCZU4CG-L2FBVB900E Datasheet PDF and pin diagram description download.You can use the XCZU4CG-L2FBVB900E Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCZU4CG-L2FBVB900E pin diagram and circuit diagram and usage method of function,XCZU4CG-L2FBVB900E electronics tutorials.You can download from the Anli.