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XE216-512-FB236-I20 Технические параметры
XMOS XE216-512-FB236-I20 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microcontrollers | |
| Марка | XMOS | |
| Factory Lead Time | 12 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 236-LFBGA | |
| Number of Pins | 236Pins | |
| Supplier Device Package | 236-FBGA (10x10) | |
| Memory Types | ROMless | |
| Number of I/Os | 73I/Os | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tray | |
| Series | XE | |
| Published | 2015 | |
| Part Status | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Interface | USB | |
| Oscillator Type | External | |
| Speed | 2000MIPS | |
| RAM Size | 512K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 0.95V~3.6V | |
| Core Processor | XCore | |
| Program Memory Type | ROMless | |
| Core Size | 32-Bit 16-Core | |
| Connectivity | RGMII, USB | |
| Core Architecture | XCore | |
| RoHS Status | ROHS3 Compliant |
XE216-512-FB236-I20 Документы
- DatasheetsXE216-512-FB236 Datasheet xCORE Architecture Flyer xCORE-200 XE Brief
- Environmental InformationXMOS RoHS3
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