Memory Connectors - Accessories Products For Sale - PDF - Connectors, Interconnects -Page20

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Memory Connectors - Accessories

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Factory Lead Time	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Board Mounting Option	Access Time-Max	Body Length	Brand	Clock Frequency-Max (fCLK)	Contact Finish Mating	Contact Materials	Country of Origin	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Insulator Material	Manufacturer	Manufacturer Part Number	Manufacturer Series	Maximum Clock Rate	Memory Types	Mfr	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number Of Connectors	Number of I/O Lines	Number of Rows Loaded	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Samacsys Description	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Supply Voltage-Nom (Vsup)	Turn-off Time	Turn-on Time	Usage Level	Operating Temperature	Series	JESD-609 Code	Pbfree Code	ECCN Code	Connector Type	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Color	Additional Feature	HTS Code	Subcategory	MIL Conformance	DIN Conformance	IEC Conformance	Filter Feature	Mixed Contacts	Option	Total Number of Contacts	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	Reference Standard	JESD-30 Code	Qualification Status	Reliability	Number Of PCB Rows	PCB Contact Pattern	Mating Information	Body Breadth	Contact Gender	UL Flammability Code	Body Depth	Brand Name	Operating Supply Voltage	Rated Current (Signal)	Supply Voltage-Max (Vsup)	Power Supplies	Contact Style	Contact Resistance	Temperature Grade	Supply Voltage-Min (Vsup)	Insulation Resistance	Mating Contact Pitch	Body/Shell Style	Max Supply Voltage	Min Supply Voltage	Termination Type	Memory Size	Dielectric Withstanding Voltage	Number of Ports	Nominal Supply Current	Operating Mode	PCB Contact Row Spacing	Durability	Contact Finish Termination	Contact Pattern	Clock Frequency	Supply Current-Max	Insertion Force-Max	Withdrawl Force-Min	Mating Contact Row Spacing	Access Time	Memory Format	Memory Interface	Data Bus Width	Output Current-Max	Insulator Color	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Insulation	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Max Frequency	Interface IC Type	Screening Level	I/O Type	Memory IC Type	Output Peak Current Limit-Nom	High Side Driver	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Supply Voltage1-Min	Supply Voltage1-Max	Conductor Type	Operating Voltage	Terminal Length	Self Refresh	Product Category	Memory Organization	Length	Width	Plating Thickness	Width (mm)

Изображение	Тип	Марка	Объяснение	Количество	Factory Lead Time	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Board Mounting Option	Access Time-Max	Body Length	Brand	Clock Frequency-Max (fCLK)	Contact Finish Mating	Contact Materials	Country of Origin	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Insulator Material	Manufacturer	Manufacturer Part Number	Manufacturer Series	Maximum Clock Rate	Memory Types	Mfr	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number Of Connectors	Number of I/O Lines	Number of Rows Loaded	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Samacsys Description	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Supply Voltage-Nom (Vsup)	Turn-off Time	Turn-on Time	Usage Level	Operating Temperature	Series	JESD-609 Code	Pbfree Code	ECCN Code	Connector Type	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Color	Additional Feature	HTS Code	Subcategory	MIL Conformance	DIN Conformance	IEC Conformance	Filter Feature	Mixed Contacts	Option	Total Number of Contacts	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	Reference Standard	JESD-30 Code	Qualification Status	Reliability	Number Of PCB Rows	PCB Contact Pattern	Mating Information	Body Breadth	Contact Gender	UL Flammability Code	Body Depth	Brand Name	Operating Supply Voltage	Rated Current (Signal)	Supply Voltage-Max (Vsup)	Power Supplies	Contact Style	Contact Resistance	Temperature Grade	Supply Voltage-Min (Vsup)	Insulation Resistance	Mating Contact Pitch	Body/Shell Style	Max Supply Voltage	Min Supply Voltage	Termination Type	Memory Size	Dielectric Withstanding Voltage	Number of Ports	Nominal Supply Current	Operating Mode	PCB Contact Row Spacing	Durability	Contact Finish Termination	Contact Pattern	Clock Frequency	Supply Current-Max	Insertion Force-Max	Withdrawl Force-Min	Mating Contact Row Spacing	Access Time	Memory Format	Memory Interface	Data Bus Width	Output Current-Max	Insulator Color	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Insulation	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Max Frequency	Interface IC Type	Screening Level	I/O Type	Memory IC Type	Output Peak Current Limit-Nom	High Side Driver	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Supply Voltage1-Min	Supply Voltage1-Max	Conductor Type	Operating Voltage	Terminal Length	Self Refresh	Product Category	Memory Organization	Length	Width	Plating Thickness	Width (mm)
	Mfr. Тип IS43R16320E-5TL-TR Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	512M, 2.5V, Ddr 32Mx16, 200Mhz, 66 Pin Tsop Ii (400 Mil) Rohs, T& Сборник данных Сравнение	Min.:1 Mult.:1	8 Weeks	-	Surface Mount	66-TSSOP (0.400, 10.16mm Width)	YES	-	66-TSOP II	66	-	0.7 ns	-	-	-	-	-	-	-	INTEGRATED SILICON SOLUTION INC	-	-	IS43R16320E-5TL-TR	-	200 MHz	Volatile	ISSI, Integrated Silicon Solution Inc	-	Surface Mount	-	-	16 Bit	-	33554432 words	32000000	70 °C	-	Tape & Reel (TR)	PLASTIC/EPOXY	TSOP2	TSOP2,	-	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Active	-	Active	NOT SPECIFIED	4.72	Compliant	Yes	-	TSOP-II	-	-	-	2.5 V	-	-	Commercial grade	0 to 70 °C	-	-	-	-	-	DDR SDRAM	-	70 °C	0 °C	-	AUTO/SELF REFRESH	-	-	-	-	-	-	-	-	-	2.3V ~ 2.7V	DUAL	GULL WING	NOT SPECIFIED	1	0.65 mm	compliant	66	-	R-PDSO-G66	-	-	-	-	-	-	-	-	-	-	2.5, 2.6 V	-	2.7 V	-	-	-	COMMERCIAL	2.3 V	-	-	-	-	-	-	512Mbit	-	1	-	SYNCHRONOUS	-	-	-	-	200 MHz	-	-	-	-	700 ps	DRAM	SSTL_2	16 Bit	-	-	32MX16	-	1.2 mm	16	15ns	-	13 Bit	-	512 Mbit	-	536870912 bit	200 MHz	-	Commercial	-	DDR DRAM	-	-	-	-	-	FOUR BANK PAGE BURST	-	-	-	-	-	YES	-	32M x 16	22.22 mm	10.16 mm	-	-
IS43R16320E-5TL-TR Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип IS43DR32801A-5BBLI-TR Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	DRAM 256M (8Mx32) 200MHz DDR2 1.8v Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	126	-	0.6 ns	-	-	200 MHz	-	-	-	-	INTEGRATED SILICON SOLUTION INC	-	-	IS43DR32801A-5BBLI-TR	-	-	-	-	-	-	-	-	-	-	8388608 words	8000000	85 °C	-40 °C	-	PLASTIC/EPOXY	FBGA	-	BGA126,12X16,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete	-	-	-	5.84	-	Yes	-	-	-	-	-	1.8 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	-	-	0.8 mm	compliant	-	-	R-PBGA-B126	Not Qualified	-	-	-	-	-	-	-	-	-	-	-	-	1.8 V	-	-	INDUSTRIAL	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.43 mA	-	-	-	-	-	-	-	-	-	8MX32	3-STATE	-	32	-	-	-	-	-	0.008 A	268435456 bit	-	-	-	COMMON	DDR DRAM	-	-	8192	4,8	4,8	-	-	-	-	-	-	-	-	-	-	-	-	-
IS43DR32801A-5BBLI-TR Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип IS46DR16320B-37CBLA2 Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	DRAM 512M (32Mx16) 267MHz DDR2 1.8v Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	84	-	0.5 ns	-	-	266 MHz	-	-	-	-	INTEGRATED SILICON SOLUTION INC	-	-	IS46DR16320B-37CBLA2	-	-	-	-	-	-	-	-	-	-	33554432 words	32000000	105 °C	-40 °C	-	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	DSBGA	-	-	5.64	-	Yes	-	-	-	-	-	1.8 V	-	-	Automotive grade	-	-	-	-	EAR99	-	-	-	-	-	-	AUTO/SELF REFRESH	8542.32.00.28	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	-	1	0.8 mm	compliant	84	-	R-PBGA-B84	Not Qualified	-	-	-	-	-	-	-	-	-	-	-	1.9 V	1.8 V	-	-	INDUSTRIAL	1.7 V	-	-	-	-	-	-	-	-	1	-	SYNCHRONOUS	-	-	-	-	-	0.335 mA	-	-	-	-	-	-	-	-	-	32MX16	3-STATE	1.2 mm	16	-	-	-	-	-	0.008 A	536870912 bit	-	-	AEC-Q100	COMMON	DDR DRAM	-	-	8192	4,8	4,8	FOUR BANK PAGE BURST	-	-	-	-	-	YES	-	-	13 mm	10.5 mm	-	-
IS46DR16320B-37CBLA2 Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип V62/16623-01XE Anlielectronics Тип	Texas Instruments	Complete DDR2, DDR3 and DDR3L Memory Power Solution Synchronous Buck Controller, 2-A LDO, Buffered Reference Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	16	-	-	-	-	-	-	-	-	-	Texas INC	-	-	V62/16623-01XE	-	-	-	-	2	-	-	-	-	-	-	-	125 °C	-55 °C	-	PLASTIC/EPOXY	SOP	SOP,	-	RECTANGULAR	SMALL OUTLINE	Active	-	-	-	1.82	-	Yes	-	-	5.5 V	2.25 V	5 V	-	0.11 µs	0.11 µs	-	-	-	e4	Yes	-	-	-	Nickel/Palladium/Gold (Ni/Pd/Au)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	DUAL	GULL WING	-	1	1.27 mm	compliant	-	-	R-PDSO-G16	-	-	-	-	-	-	-	-	-	Texas	-	-	-	-	-	-	MILITARY	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	5 A	-	-	-	2.65 mm	-	-	-	-	-	-	-	-	-	AND GATE BASED IGBT/MOSFET DRIVER	-	-	-	5 A	NO	-	-	-	-	15 V	30 V	-	-	-	-	-	-	10.3 mm	7.5 mm	-	-
V62/16623-01XE Texas Instruments RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип 175758-1 Anlielectronics Тип	TE Connectivity	AMP MEMORY CARD HDR ASSY 40P Сборник данных Сравнение	Min.:1 Mult.:1	-	-	BOARD	-	-	-	-	-	HOLE .138-.163	-	2.283 inch	-	-	NOT SPECIFIED	BRASS	-	-	TE CONNECTIVITY LTD	GLASS FILLED POLYBUTYLENE TEREPHTHALATE	-	175758-1	-	-	-	-	-	-	RIGHT ANGLE	ONE	-	1	-	-	70 °C	-10 °C	-	-	-	-	-	-	-	Obsolete	-	-	-	5.92	-	No	-	-	-	-	-	-	-	-	-	-	-	e0	No	EAR99	PCMCIA CONNECTOR	-	-	-	-	-	-	8536.69.40.40	-	NO	NO	NO	NO	NO	-	40	-	-	-	-	-	2 mm	compliant	-	UL	-	-	COMMERCIAL	2	STAGGERED	175564-1	0.236 inch	MALE	94V-0	1.28 inch	AMP	-	0.5 A	-	-	RND PIN-SKT	60 mΩ	-	-	100000000 Ω	0.039 inch	RECEPTACLE	-	-	SOLDER	-	100VAC V	1	-	-	2.0066 mm	5000 Cycles	Tin/Lead (Sn/Pb)	RECTANGULAR	-	-	.278 N	.139 N	-	-	-	-	-	-	BLACK	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.11 inch	-	-	-	-	-	12u inch	-
175758-1 TE Connectivity RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип 10003526-120CALF Anlielectronics Тип	AMPHENOL FCI ASIA PTE LTD	Memory Card Connectors Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 3.3V, 2.2mm s/o, Left Push Rod Eject, 9.5mm Eject Travel Сборник данных Сравнение	Min.:1 Mult.:1	-	-	BOARD	-	-	-	-	-	-	-	-	-	-	GOLD (10) OVER NICKEL	COPPER ALLOY	-	-	FCI	-	-	10003526-120CALF	10003526	-	-	-	-	-	RIGHT ANGLE	-	-	2	-	-	-	-	-	-	-	LEAD FREE	-	-	-	Obsolete	-	-	-	5.77	-	-	-	-	-	-	-	-	-	-	-	-	-	e3	-	-	PCMCIA CONNECTOR	-	-	-	-	-	-	-	-	NO	NO	NO	NO	NO	GENERAL PURPOSE	68	-	-	-	-	-	1 mm	unknown	-	-	-	-	-	-	-	-	-	MALE	94V-0	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	SURFACE MOUNT	-	-	-	-	-	-	-	TIN (98) OVER NICKEL	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
10003526-120CALF AMPHENOL FCI ASIA PTE LTD RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W3E32M72SR-266BM Anlielectronics Тип	Microsemi	DRAM Memory Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	208	-	0.75 ns	-	-	-	-	-	-	-	MICROSEMI CORP	-	-	W3E32M72SR-266BM	-	-	-	-	-	-	-	-	-	-	33554432 words	32000000	125 °C	-55 °C	-	PLASTIC/EPOXY	BGA	BGA,	-	RECTANGULAR	GRID ARRAY	Transferred	-	-	-	5.58	-	-	-	-	-	-	-	2.5 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED	-	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	-	1	1 mm	unknown	-	-	R-PBGA-B208	-	-	-	-	-	-	-	-	-	-	-	-	2.7 V	-	-	-	MILITARY	2.3 V	-	-	-	-	-	-	-	-	1	-	SYNCHRONOUS	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	32MX72	-	2.77 mm	72	-	-	-	-	-	-	2415919104 bit	-	-	-	-	DDR DRAM	-	-	-	-	-	FOUR BANK PAGE BURST	-	-	-	-	-	YES	-	-	25.1 mm	16.1 mm	-	-
W3E32M72SR-266BM Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип WEDPN16M64V-133B2I Anlielectronics Тип	Microchip	16M X 64 Sdram Module W/registered Buffers, 3.3V, 100 Mhz, 2 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	219	-	5.5 ns	-	-	-	-	-	-	-	WHITE ELECTRONIC DESIGNS CORP	-	-	WEDPN16M64V-133B2I	-	-	-	-	-	-	-	-	-	-	16777216 words	16000000	85 °C	-40 °C	-	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Transferred	-	-	NOT SPECIFIED	5.66	-	No	-	-	-	-	-	3.3 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	AUTO/SELF REFRESH	-	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	unknown	-	-	S-PBGA-B219	Not Qualified	-	-	-	-	-	-	-	-	-	-	-	3.6 V	-	-	-	INDUSTRIAL	3 V	-	-	-	-	-	-	-	-	1	-	SYNCHRONOUS	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	16MX64	-	-	64	-	-	-	-	-	-	1073741824 bit	-	-	-	-	SYNCHRONOUS DRAM	-	-	-	-	-	MULTI BANK PAGE BURST	-	-	-	-	-	YES	-	-	-	-	-	-
WEDPN16M64V-133B2I Microchip RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W634GG6MB15I Anlielectronics Тип	Winbond Electronics Corporation	DRAM 4G DDR3 SDRAM, x16, 667MHz, Industrial Temp, T&R Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	96	-	-	-	-	-	-	-	-	-	WINBOND ELECTRONICS CORP	-	-	W634GG6MB15I	-	-	-	-	-	-	-	-	-	-	268435456 words	256000000	95 °C	-40 °C	-	PLASTIC/EPOXY	VFBGA	VFBGA,	-	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Not Recommended	-	-	-	5.63	-	Yes	-	-	-	-	-	1.5 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	AUTO/SELF REFRESH	-	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	-	1	0.8 mm	compliant	-	-	R-PBGA-B96	-	-	-	-	-	-	-	-	-	-	-	-	1.575 V	-	-	-	INDUSTRIAL	1.425 V	-	-	-	-	-	-	-	-	1	-	SYNCHRONOUS	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	256MX16	-	1 mm	16	-	-	-	-	-	-	4294967296 bit	-	-	-	-	DDR DRAM	-	-	-	-	-	MULTI BANK PAGE BURST	-	-	-	-	-	YES	-	-	13 mm	9 mm	-	-
W634GG6MB15I Winbond Electronics Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип NT5TU64M16HG-BE Anlielectronics Тип	Nanya	DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin BGA Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	84	-	0.35 ns	-	-	533 MHz	-	-	-	-	NANYA TECHNOLOGY CORP	-	-	NT5TU64M16HG-BE	-	-	-	-	-	-	-	-	-	-	67108864 words	64000000	85 °C	-	-	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	-	-	NOT SPECIFIED	5.65	-	Yes	-	-	-	-	-	1.8 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	AUTO/SELF REFRESH	-	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant	-	-	R-PBGA-B84	Not Qualified	-	-	-	-	-	-	-	-	-	-	-	1.9 V	1.8 V	-	-	OTHER	1.7 V	-	-	-	-	-	-	-	-	1	-	SYNCHRONOUS	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	64MX16	3-STATE	1.2 mm	16	-	-	-	-	-	-	1073741824 bit	-	-	-	COMMON	DDR DRAM	-	-	8192	4,8	4,8	MULTI BANK PAGE BURST	-	-	-	-	-	YES	-	-	12.5 mm	8 mm	-	-
NT5TU64M16HG-BE Nanya RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип 92791-001LF Anlielectronics Тип	FCI	PCMCIA Mechanism, 0 mm s/o, without Eject, with EMI Clip Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	AU ON NI	PHOSPHOR BRONZE	US	-	FCI	-	Amphenol FCi	92791-001LF	92791	-	-	-	-	-	RIGHT ANGLE	ONE	-	-	-	-	-	-	-	-	-	-	-	-	-	Obsolete	-	-	-	5.77	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	EAR99	PCMCIA CONNECTOR	-	-	-	-	Red	-	8536.69.40.40	Headers and Edge Type Connectors	-	-	-	-	-	-	68	-	-	-	-	-	-	compliant	-	UL	-	-	COMMERCIAL	-	-	-	-	MALE	-	-	-	-	-	-	-	-	40 mΩ	-	-	100000000 Ω	-	-	-	-	-	-	500VAC V	1	-	-	-	10000 Cycles	-	-	-	-	-	-	-	-	-	-	-	-	BLACK	-	-	-	-	-	Yes	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	AL C Str-Size;CU C Str-Size;CU C Fex-Size	600 V	-	-	-	-	-	-	20u inch	60 mm
92791-001LF FCI RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип EDF8132A1MC-GD-F-D Anlielectronics Тип	Micron	DRAM Chip Mobile LPDDR3 SDRAM 8G-Bit 256Mx32 1.2V/1.8V 178-Pin VFBGA Tray Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	178	-	-	-	-	-	-	-	-	-	MICRON TECHNOLOGY INC	-	-	EDF8132A1MC-GD-F-D	-	-	-	-	-	-	-	-	-	-	268435456 words	256000000	-	-	-	PLASTIC/EPOXY	VFBGA	VFBGA,	-	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	-	-	-	5.8	-	-	-	-	-	-	-	1.2 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM	-	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	-	1	0.8 mm	unknown	-	-	R-PBGA-B178	-	-	-	-	-	-	-	-	-	-	-	-	1.3 V	-	-	-	-	1.14 V	-	-	-	-	-	-	-	-	1	-	SYNCHRONOUS	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	256MX32	-	0.9 mm	32	-	-	-	-	-	-	8589934592 bit	-	-	-	-	DDR DRAM	-	-	-	-	-	DUAL BANK PAGE BURST	-	-	-	-	-	YES	-	-	12 mm	11.5 mm	-	-
EDF8132A1MC-GD-F-D Micron RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип IS42VM32100C-75BLI Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	DRAM Chip Mobile LP SDRAM 32M-Bit 1M x 32 1.8V 90-Pin TFBGA Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	-	-	-	YES	-	-	90	-	6 ns	-	-	133 MHz	-	-	-	-	INTEGRATED SILICON SOLUTION INC	-	-	IS42VM32100C-75BLI	-	-	-	-	3	-	-	-	-	-	1048576 words	1000000	85 °C	-40 °C	-	PLASTIC/EPOXY	TFBGA	TFBGA, BGA90,9X15,32	BGA90,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	-	40	5.56	-	Yes	-	-	-	-	-	1.8 V	-	-	-	-	-	e1	Yes	EAR99	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	AUTO/SELF REFRESH	8542.32.00.02	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	260	1	0.8 mm	compliant	90	-	R-PBGA-B90	Not Qualified	-	-	-	-	-	-	-	-	-	-	-	1.95 V	1.8 V	-	-	INDUSTRIAL	1.7 V	-	-	-	-	-	-	-	-	1	-	SYNCHRONOUS	-	-	-	-	-	0.07 mA	-	-	-	-	-	-	-	-	-	1MX32	3-STATE	1.2 mm	32	-	-	-	-	-	0.00001 A	33554432 bit	-	-	-	COMMON	SYNCHRONOUS DRAM	-	-	4096	1,2,4,8,FP	1,2,4,8	DUAL BANK PAGE BURST	-	-	-	-	-	YES	-	-	13 mm	8 mm	-	-
IS42VM32100C-75BLI Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип IS42S16160D-6BI Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	DRAM Chip SDRAM 256M-Bit 16M x 16 3.3V 54-Pin TFBGA Сборник данных Сравнение	Min.:1 Mult.:1	13 Weeks, 6 Days	Surface Mount	-	-	YES	54	-	54	-	5.4 ns	-	-	166 MHz	-	-	-	-	INTEGRATED SILICON SOLUTION INC	-	-	IS42S16160D-6BI	-	-	-	-	3	-	-	-	-	-	16777216 words	16000000	85 °C	-40 °C	-	PLASTIC/EPOXY	TFBGA	13 X 8 MM, 0.80 MM PITCH, MS-207, TFBGA-54	BGA54,9X9,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	DSBGA	-	NOT SPECIFIED	5.28	Non-Compliant	No	-	-	-	-	-	3.3 V	-	-	-	-	-	e0	No	EAR99	-	-	Tin/Lead (Sn/Pb)	85 °C	-40 °C	-	AUTO/SELF REFRESH	8542.32.00.24	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown	54	-	R-PBGA-B54	Not Qualified	-	-	-	-	-	-	-	-	-	3.3 V	-	3.6 V	3.3 V	-	-	INDUSTRIAL	3 V	-	-	-	3.6 V	3 V	-	32 MB	-	1	180 mA	SYNCHRONOUS	-	-	-	-	-	0.18 mA	-	-	-	5.4 ns	-	-	16 b	-	-	16MX16	3-STATE	1.2 mm	16	-	-	15 b	-	256 Mb	0.003 A	268435456 bit	166 MHz	-	-	COMMON	SYNCHRONOUS DRAM	-	-	8192	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	-	-	-	-	-	YES	-	-	13 mm	8 mm	-	-
IS42S16160D-6BI Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип IS46DR16320B-37CBLA1-TR Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	AUTOMOTIVE (TC: -40 TO 95C), 512M, 1.8V, DDR2, 32MX16, 267M Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	84	-	0.5 ns	-	-	266 MHz	-	-	-	-	INTEGRATED SILICON SOLUTION INC	-	-	IS46DR16320B-37CBLA1-TR	-	-	-	-	1	-	-	-	-	-	33554432 words	32000000	85 °C	-40 °C	-	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	-	-	NOT SPECIFIED	5.84	Compliant	Yes	-	-	-	-	-	1.8 V	-	-	Automotive grade	-	-	e3	Yes	-	-	-	Matte Tin (Sn)	95 °C	-40 °C	-	AUTO/SELF REFRESH	-	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	225	1	0.8 mm	compliant	-	-	R-PBGA-B84	Not Qualified	-	-	-	-	-	-	-	-	-	-	-	1.9 V	1.8 V	-	-	INDUSTRIAL	1.7 V	-	-	-	1.9 V	1.7 V	-	64 MB	-	1	-	SYNCHRONOUS	-	-	-	-	-	0.335 mA	-	-	-	500 ps	-	-	16 b	-	-	32MX16	3-STATE	1.2 mm	16	-	-	-	-	-	0.008 A	536870912 bit	266 MHz	-	AEC-Q100	COMMON	DDR DRAM	-	-	8192	4,8	4,8	FOUR BANK PAGE BURST	-	-	-	-	-	YES	-	-	13 mm	10.5 mm	-	-
IS46DR16320B-37CBLA1-TR Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип IS43R83200B-6TLI-TR Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	DRAM 256M (32Mx8) 333MHz DDR 2.5v Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	INTEGRATED SILICON SOLUTION INC	-	-	IS43R83200B-6TLI-TR	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	,	-	-	-	Obsolete	-	-	-	5.84	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	unknown	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
IS43R83200B-6TLI-TR Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип IS42SM16200C-6BLI-TR Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	DRAM Chip Mobile LP SDRAM 32M-Bit 2M x 16 3.3V 54-Pin TFBGA T/R - Tape and Reel (Alt: IS42SM16200C-6BLI-TR) Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	-	-	-	YES	-	-	54	-	5.5 ns	-	-	166 MHz	-	-	-	-	INTEGRATED SILICON SOLUTION INC	-	-	IS42SM16200C-6BLI-TR	-	-	-	-	1	-	-	-	-	-	2097152 words	2000000	85 °C	-40 °C	-	PLASTIC/EPOXY	TFBGA	TFBGA, BGA54,9X9,32	BGA54,9X9,32	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	-	-	NOT SPECIFIED	5.84	-	Yes	-	-	-	-	-	3.3 V	-	-	-	-	-	e3	Yes	-	-	-	Matte Tin (Sn)	-	-	-	AUTO/SELF REFRESH	-	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	225	1	0.8 mm	compliant	-	-	S-PBGA-B54	Not Qualified	-	-	-	-	-	-	-	-	-	-	-	3.6 V	3.3 V	-	-	INDUSTRIAL	2.7 V	-	-	-	-	-	-	-	-	1	-	SYNCHRONOUS	-	-	-	-	-	0.06 mA	-	-	-	-	-	-	-	-	-	2MX16	3-STATE	1.2 mm	16	-	-	-	-	-	0.00001 A	33554432 bit	-	-	-	COMMON	CACHE DRAM MODULE	-	-	4096	1,2,4,8,FP	1,2,4,8	DUAL BANK PAGE BURST	-	-	-	-	-	YES	-	-	8 mm	8 mm	-	-
IS42SM16200C-6BLI-TR Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип IS43DR83200A-3DBLI-TR Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	DRAM Chip DDR2 SDRAM 256M-Bit 32M x 8 1.8V 60-Pin TWBGA T/R Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	-	-	-	YES	-	-	60	-	0.45 ns	-	-	333 MHz	-	-	-	-	INTEGRATED SILICON SOLUTION INC	-	-	IS43DR83200A-3DBLI-TR	-	-	-	-	-	-	-	-	-	-	33554432 words	32000000	85 °C	-40 °C	-	PLASTIC/EPOXY	TFBGA	TFBGA, BGA60,9X11,32	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	-	-	-	5.84	-	Yes	-	-	-	-	-	1.8 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	AUTO/SELF REFRESH	-	-	-	-	-	-	-	-	-	-	BOTTOM	BALL	-	1	0.8 mm	compliant	-	-	R-PBGA-B60	Not Qualified	-	-	-	-	-	-	-	-	-	-	-	1.9 V	1.8 V	-	-	INDUSTRIAL	1.7 V	-	-	-	-	-	-	-	-	1	-	SYNCHRONOUS	-	-	-	-	-	0.33 mA	-	-	-	-	-	-	-	-	-	32MX8	3-STATE	1.2 mm	8	-	-	-	-	-	0.005 A	268435456 bit	-	-	-	COMMON	DDR DRAM	-	-	8192	4,8	4,8	FOUR BANK PAGE BURST	-	-	-	-	-	YES	-	-	10.5 mm	8 mm	-	-
IS43DR83200A-3DBLI-TR Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип IS46LQ32128A-062BLA2 Anlielectronics Тип	Integrated Silicon Solution, Inc. (ISSI)	AUTOMOTIVE (TC: -40 TO 105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128MX32, 1600MHZ, 200 BALL BGA (10Mm x 14.5MM) ROHS Сборник данных Сравнение	Min.:1 Mult.:1	24 Weeks	-	Surface Mount	200-WFBGA	YES	-	200-VFBGA (10x14.5)	200	-	-	-	ISSI	-	-	-	-	136	INTEGRATED SILICON SOLUTION INC	-	-	IS46LQ32128A-062BLA2	-	-	Volatile	ISSI, Integrated Silicon Solution Inc	-	-	-	-	-	-	134217728 words	128000000	105 °C	-40 °C	Bulk	PLASTIC/EPOXY	VFBGA	FBGA-200	-	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Active	-	Active	-	5.61	Details	Yes	-	-	-	-	-	-	-	-	-	-40°C ~ 105°C (TC)	Automotive, AEC-Q100	-	-	-	-	-	-	-	-	-	TERM PITCH-MAX	-	Memory & Data Storage	-	-	-	-	-	-	-	1.06V ~ 1.17V, 1.7V ~ 1.95V	BOTTOM	BALL	-	1	0.8 mm	compliant	-	-	R-PBGA-B200	-	-	-	-	-	-	-	-	-	-	-	-	1.95 V	-	-	-	INDUSTRIAL	1.7 V	-	-	-	-	-	-	4Gbit	-	1	-	SYNCHRONOUS	-	-	-	-	1.6 GHz	-	-	-	-	3.5 ns	DRAM	LVSTL	-	-	-	128MX32	-	0.8 mm	32	18ns	-	-	DRAM	-	-	4294967296 bit	-	-	-	-	DDR DRAM	-	-	-	-	-	MULTI BANK PAGE BURST	-	-	-	-	-	-	DRAM	128M x 32	14.5 mm	10 mm	-	-
IS46LQ32128A-062BLA2 Integrated Silicon Solution, Inc. (ISSI) RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип 94208-0011 Anlielectronics Тип	Molex	Memory Card Connectors MEMORY CARD 68P Сборник данных Сравнение	Min.:1 Mult.:1	-	-	BOARD	-	-	-	-	-	-	-	2.26 inch	-	-	TIN	NOT SPECIFIED	-	-	MOLEX LLC	NYLON	-	94208-0011	94208	-	-	-	-	-	STRAIGHT	ONE	-	2	-	-	80 °C	-25 °C	-	-	-	-	-	-	-	Obsolete	-	-	-	5.81	-	Yes	Memory Card Connectors MEMORY CARD 68P	-	-	-	-	-	-	-	-	-	-	e3	-	EAR99	PCMCIA CONNECTOR	-	-	-	-	-	COMPATIBLE WITH PCMCIA/JEIDA, STAGGERED CONFIGURATION	8536.69.40.40	-	NO	NO	NO	NO	NO	GENERAL PURPOSE	68	-	-	-	-	-	1.27 mm	compliant	-	UL	-	-	COMMERCIAL	4	STAGGERED	MULTIPLE MATING PARTS AVAILABLE	0.252 inch	MALE	94V-0	0.591 inch	-	-	0.5 A	-	-	SQ PIN-SKT	40 mΩ	-	-	1000000000 Ω	0.05 inch	RECEPTACLE	-	-	SOLDER	-	500VAC V	1	-	-	1.905 mm	10000 Cycles	TIN	RECTANGULAR	-	-	.5838 N	.0973 N	0.05 inch	-	-	-	-	-	BLACK	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0.11 inch	-	-	-	-	-	-	-
94208-0011 Molex RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Connectors, Interconnects

Memory Connectors - Accessories definition: Memory Connectors - Accessories Product Listing: IS43R16320E-5TL-TR,IS43DR32801A-5BBLI-TR,IS46DR16320B-37CBLA2,V62/16623-01XE,175758-1.Connectors, Interconnects type:Circular Connectors(4156894),Barrel - Audio Connectors(708215),Rectangular Connectors - Headers, Male Pins(575678),Card Edge Connectors - Edgeboard Connectors(554558),D-Sub Connectors(512402) .Memory Connectors - Accessories has 648 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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