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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Package / Case | Supplier Device Package | Brand | Cache Memory | Chipsets | Description/Function | Dimensions | Factory Pack QuantityFactory Pack Quantity | I2C Bus Support | Installed RAM | Interface Type | Manufacturer | Maximum Operating Temperature | Maximum RAM Capacity | Memory Card Interface | Memory Types | Minimum Operating Temperature | Number of CPU Cores | Panel Cutout | PCIe | Processor Brand | Processor Series | Processor Type | RoHS | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Temperature Coefficient | Resistance | Composition | Power (Watts) | Subcategory | Frequency | Operating Supply Voltage | Failure Rate | Memory Size | Architecture | Product Type | Ethernet | USB | Form Factor | GPIO | SATA | Video Outputs | Features | Product Category | Height Seated (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. ТипET876-335LVAnlielectronics Тип | iBASE Technology |
System-On-Modules - SOM COM Express (Type 10) CPU Module with Intel Celeron N3350 (2.4GHz) on board, 4GB DDR3L memory on board with ECC, support LVDS & DDI x1, Optional heat spreader (RoHS2)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | SoC Integrated | - | 84 mm x 55 mm | - | - | 4 GB | Audio, Ethernet, I2C, RS-232, SATA, USB | - | + 60 C | 4 GB | - | DDR3L | - 20 C | - | - | - | Intel | N3350 | Celeron | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.4 GHz | - | - | 4 GB | - | - | - | - | COM Express Type 10 | - | - | - | - | - | - | ||
| ET876-335LV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипET876-X5QLVAnlielectronics Тип | iBASE Technology |
System-On-Modules - SOM COM Express (Type 10) CPU Module with Intel Atom x5/ E3940 (1.8GHz) on board,4GB DDR3L memory on board with ECC, support LVDS & DDI x1, Optional heat spreader (RoHS2)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | SoC Integrated | - | 84 mm x 55 mm | - | - | 4 GB | Audio, Ethernet, I2C, RS-232, SATA, USB | - | + 85 C | 4 GB | - | DDR3L | - 40 C | - | - | - | Intel | x5/E3940 | Atom | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8 GHz | - | - | 4 GB | - | - | - | - | COM Express Type 10 | - | - | - | - | - | - | ||
| ET876-X5QLV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипET876-X7LVAnlielectronics Тип | iBASE Technology |
System-On-Modules - SOM COM Express (Type 10) CPU Module with Intel Atom x7/ E3950 (2.0GHz) on board, 4GB DDR3L memory on board with ECC, support LVDS & DDI x1, Optional heat spreader (RoHS2)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | SoC Integrated | - | 84 mm x 55 mm | 1 | - | 4 GB | Audio, Ethernet, I2C, RS-232, SATA, USB | - | + 85 C | 4 GB | - | DDR3L | - 40 C | - | - | - | Intel | x7/E3950 | Atom x7-E3950 | - | - | - | - | - | - | - | - | - | - | - | - | - | 2 GHz | 12 V | - | 4 GB | - | - | - | - | COM Express Type 10 | - | - | - | - | - | - | ||
| ET876-X7LV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипRM-F6DU-SMCAnlielectronics Тип | iBASE Technology |
System-On-Modules - SOM RISC,SMARC,iMX6 Duo,1GB DDR3 LAN,80mm x 50mm,4GB eMMC(v1.1)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Axial | Axial | IBASE | - | - | - | - | 1 | - | - | - | IBASE | - | - | - | - | - | - | - | - | - | - | - | Details | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | 422 Ohms | Metal Film | 0.125W, 1/8W | Computing | - | - | S (0.001%) | - | - | System-On-Modules - SOM | - | - | - | - | - | - | Military, Moisture Resistant, Weldable | System-On-Modules - SOM | -- | ||
| RM-F6DU-SMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипRM-F600-SMCAnlielectronics Тип | iBASE Technology |
SOM Module Dual Core i.MX6DL ARM Cortex A9 eMMC
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | 4 | - | - | - | - | - | 2 | - | - | 2 | Round | 1x PCIex1 | - | - | - | - | -20 to 60 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ARM | - | One 10/100/1000 | 2 USB2.0 Host/1 USB2.0 OTG | - | 12 | 1 SATA | 1 HDMI, 1 LVDS 24 bit | - | - | - | ||
| RM-F600-SMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипET876-420LVAnlielectronics Тип | iBASE Technology |
System-On-Modules - SOM COM Express (Type 10) CPU Module with Intel Pentium N4200 (2.5GHz) on board, 4GB DDR3L memory on board with ECC, support LVDS & DDI x1, Optional heat spreader (RoHS2)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | SoC Integrated | - | 84 mm x 55 mm | - | - | 4 GB | Audio, Ethernet, I2C, RS-232, SATA, USB | - | + 60 C | 4 GB | - | DDR3L | - 20 C | - | - | - | Intel | N4200 | Pentium | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5 GHz | - | - | 4 GB | - | - | - | - | COM Express Type 10 | - | - | - | - | - | - | ||
| ET876-420LV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипET876-X5LVAnlielectronics Тип | iBASE Technology |
System-On-Modules - SOM COM Express (Type 10) CPU Module with Intel Atom x5/ E3930 (1.8GHz) on board, 4GB DDR3L memory on board with ECC, support LVDS & DDI x1, Optional heat spreader (RoHS2)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | SoC Integrated | - | 84 mm x 55 mm | - | - | 4 GB | Audio, Ethernet, I2C, RS-232, SATA, USB | - | + 85 C | 4 GB | - | DDR3L | - 40 C | - | - | - | Intel | x5/E3940 | Atom | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8 GHz | - | - | 4 GB | - | - | - | - | COM Express Type 10 | - | - | - | - | - | - | ||
| ET876-X5LV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипRM-F6SO-SMCAnlielectronics Тип | iBASE Technology |
System-On-Modules - SOM RISC,SMARC,iMX6 Solo,1G DDR3 LAN,80mm x 50mm,4GB eMMC
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | 512 kB | - | SMARC module with Freescale i.MX6 Solo Cortex-A9 1GHz SoC | 82 mm x 50 mm | 1 | - | - | CAN, CSI, I2C, LAN, MMC/SDIO, PCI-E, SDPIF, SPI, UART, USB | - | + 60 C | - | - | DDR3 | - 20 C | - | - | - | Freescale | - | i.MX 6 | Details | - | - | - | - | - | - | - | - | - | - | - | - | 1 GHz | - | - | 1 GB | - | - | - | - | SMARC | - | - | - | - | - | - | ||
| RM-F6SO-SMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипRM-F6SO1-SMCAnlielectronics Тип | iBASE Technology |
System-On-Modules - SOM SMARC,iMX6 Solo CPU,Wide-Temp 1GB DDR3,4GB eMMC(-40c 85c)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Axial | Axial | IBASE | - | - | - | - | 1 | - | - | - | IBASE | - | - | - | - | - | - | - | - | - | - | - | Details | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±25ppm/°C | 45.9 kOhms | Metal Film | 0.125W, 1/8W | Computing | - | - | S (0.001%) | - | - | System-On-Modules - SOM | - | - | - | - | - | - | Military, Moisture Resistant, Weldable | System-On-Modules - SOM | -- | ||
| RM-F6SO1-SMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипRM-F6DU1-SMCAnlielectronics Тип | iBASE Technology |
System-On-Modules - SOM SMARC,iMX6 Dual CPU,Wide-Temp 1G DD3,4GB eMMC (-40c 85c)(1.1
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | IBASE | - | - | - | - | 1 | - | - | - | IBASE | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | - | - | - | - | - | - | - | - | - | Computing | - | - | - | - | - | System-On-Modules - SOM | - | - | - | - | - | - | - | System-On-Modules - SOM | - | ||
| RM-F6DU1-SMC |
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