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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. ТипMC9S08AW16CFUEAnlielectronics Тип | NXP USA Inc. |
S08 S08 Microcontroller IC 8-Bit 40MHz 16KB (16K x 8) FLASH 64-QFP (14x14)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Surface Mount | 64-QFP | YES | A/D 16x10b | 54 | - | 16384 | - | -40°C~85°C TA | Tray | 2005 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08AW16 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||
| MC9S08AW16CFUE | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMC9S12C32CPBE25Anlielectronics Тип | NXP USA Inc. |
HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 32KB (32K x 8) FLASH 52-LQFP (10x10)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | Surface Mount | 52-LQFP | YES | A/D 8x10b | 35 | - | - | - | -40°C~85°C TA | Tray | 2005 | HCS12 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 40 | MC9S12C32 | S-PQFP-G52 | - | 2.75V | - | - | Internal | 25MHz | 2K x 8 | 2.35V~5.5V | MICROCONTROLLER | - | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | - | 16 | YES | NO | YES | NO | 16 | - | - | - | - | 16 | 1.7mm | 10mm | 10mm | ROHS3 Compliant | ||
| MC9S12C32CPBE25 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMC9S08AW16CPUEAnlielectronics Тип | NXP USA Inc. |
MCU 8-bit HCS08 CISC 16KB Flash 3.3V/5V 64-Pin LQFP Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x10b | 54 | - | 16384 | - | -40°C~85°C TA | Tray | 2006 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08AW16 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
| MC9S08AW16CPUE | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMKL17Z128VFM4Anlielectronics Тип | NXP USA Inc. |
MCU 32-bit Kinetis KL1x ARM Cortex M0 RISC 128KB Flash 1.8V/2.5V/3.3V 32-Pin QFN EP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 13 Weeks | Surface Mount | 32-UFQFN Exposed Pad | YES | A/D 11x16b; D/A 1x12b | 28 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | - | S-XQCC-N32 | - | 3.6V | - | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART | - | - | YES | YES | YES | YES | - | - | - | - | - | - | - | 5mm | 5mm | ROHS3 Compliant | ||
| MKL17Z128VFM4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMIMXRT1021DAF5AAnlielectronics Тип | NXP USA Inc. |
I.MXRT1020 100LQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 14 Weeks | Surface Mount | 100-LQFP | YES | A/D 10x12b | 57 | - | - | - | 0°C~95°C TJ | Tray | - | RT1020 | - | Active | 3 (168 Hours) | 100 | - | - | - | - | QUAD | GULL WING | 260 | - | 0.5mm | 40 | - | - | - | 1.3V | - | 1.25V | Internal/External | 500MHz | 256K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 24MHz | External Program Memory | 32-Bit | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | - | 32 | YES | YES | YES | - | - | - | - | - | - | - | - | 14mm | 14mm | ROHS3 Compliant | ||
| MIMXRT1021DAF5A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMC9S08QE64CFTAnlielectronics Тип | NXP USA Inc. |
S08 S08 Microcontroller IC 8-Bit 50MHz 64KB (64K x 8) FLASH 48-QFN-EP (7x7)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 10x12b | 38 | - | 65536 | - | -40°C~85°C TA | Tray | 2006 | S08 | - | Active | 3 (168 Hours) | 48 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08QE64 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 64KB 64K x 8 | I2C, LINbus, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1mm | 7mm | 7mm | ROHS3 Compliant | ||
| MC9S08QE64CFT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMC9S08QG4CFFERAnlielectronics Тип | NXP USA Inc. |
IC MCU 8BIT 4KB FLASH 16QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Surface Mount | 16-VQFN Exposed Pad | YES | A/D 8x10b | 12 | - | 4096 | - | -40°C~85°C TA | Tape & Reel (TR) | 2005 | S08 | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.8mm | 40 | MC9S08QG4 | S-XQCC-N16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1mm | 5mm | 5mm | ROHS3 Compliant | ||
| MC9S08QG4CFFER | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMC9S08PA4VWJAnlielectronics Тип | NXP USA Inc. |
8-bit Microcontrollers - MCU 8 BIT,low end Core,4k Fl
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | A/D 8x12b | 18 | - | 4096 | - | -40°C~105°C TA | Tube | 2012 | S08 | e3 | Not For New Designs | 3 (168 Hours) | 20 | 3A991.A.2 | Tin (Sn) | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 5V | 1.27mm | 40 | MC9S08PA4 | R-PDSO-G20 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SPI, UART/USART | - | 8 | YES | NO | YES | NO | - | 128 x 8 | - | - | - | - | - | 12.8mm | 7.5mm | ROHS3 Compliant | ||
| MC9S08PA4VWJ | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMKL04Z8VFK4Anlielectronics Тип | NXP USA Inc. |
IC MCU 32BIT 8KB FLASH 24QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 13 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 12x12b | 22 | - | 8192 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL0 | - | Active | 3 (168 Hours) | 24 | 3A991.A.2 | - | 12-BIT ADC AVAILABLE | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL04Z8 | S-XQCC-N24 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 1K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | - | - | CORTEX-M0 | - | - | 1mm | 4mm | 4mm | Non-RoHS Compliant | ||
| MKL04Z8VFK4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMC9S08LL16CLFAnlielectronics Тип | NXP USA Inc. |
S08 S08 Microcontroller IC 8-Bit 20MHz 16KB (16K x 8) FLASH 48-LQFP (7x7)
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 15 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x12b | 31 | - | 16384 | - | -40°C~85°C TA | Tray | 2006 | S08 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | - | - | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MC9S08LL16 | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | - | LCD, LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | - | 8 | YES | NO | YES | NO | - | - | - | - | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
| MC9S08LL16CLF | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипS9KEAZN8AMFKAnlielectronics Тип | NXP USA Inc. |
NXP S9KEAZN8AMFK 32 Bit Microcontroller, Kinetis EA Series, ARM Cortex-M0 , 48 MHz, 8 KB, 1 KB, 24 Pins, QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 20 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 12x12b | 22 | - | - | - | -40°C~125°C TA | Tray | 2013 | Kinetis KEA | - | Active | 3 (168 Hours) | 16 | 3A991.A.2 | - | - | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | - | 40 | - | S-PDSO-G16 | - | 5.5V | - | 2.7V | Internal | 48MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | - | - | YES | NO | YES | YES | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| S9KEAZN8AMFK | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипS9KEAZN32AMLCRAnlielectronics Тип | NXP USA Inc. |
IC MCU 32BIT 32KB FLASH 32LQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 20 Weeks | Surface Mount | 32-LQFP | YES | A/D 16x12b | 28 | 4096 | 32768 | - | -40°C~125°C TA | Tape & Reel (TR) | 2013 | Kinetis KEA | - | Active | 3 (168 Hours) | 32 | 3A991.A.2 | - | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | - | S-PQFP-G32 | - | 5.5V | - | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | - | - | YES | NO | YES | NO | - | 256 x 8 | 8 | - | - | - | - | 7mm | 7mm | ROHS3 Compliant | ||
| S9KEAZN32AMLCR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипS9S12G48F0MLFAnlielectronics Тип | NXP USA Inc. |
16-bit Microcontrollers - MCU 16BIT48kFlash 4KbRAM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 12x10b | 40 | - | 49152 | Automotive grade | -40°C~125°C TA | Tray | 2008 | HCS12 | - | Active | 3 (168 Hours) | 48 | - | - | - | 8542.31.00.01 | QUAD | GULL WING | - | 5V | 0.5mm | - | S9S12G48 | S-PQFP-G48 | Not Qualified | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | - | 16 | YES | NO | YES | - | - | 1.5K x 8 | - | CPU12 | AEC-Q100 | - | - | 7mm | 7mm | ROHS3 Compliant | ||
| S9S12G48F0MLF | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMK22FN1M0AVMC12Anlielectronics Тип | NXP USA Inc. |
MCU 32-Bit K22 ARM Cortex M4 RISC 1MB Flash 3.3V 121-Pin MAPBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 38x16b; D/A 2x12b | 64 | - | - | - | -40°C~105°C TA | Tray | 2015 | Kinetis K20 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | - | S-PBGA-B121 | - | 3.6V | - | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | - | - | - | - | - | - | 8mm | 8mm | ROHS3 Compliant | ||
| MK22FN1M0AVMC12 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMC9RS08KA1CSCRAnlielectronics Тип | NXP USA Inc. |
IC MCU 8BIT 1KB FLASH 8SOIC
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | - | 4 | - | - | - | -40°C~85°C TA | Tape & Reel (TR) | 2004 | RS08 | e3 | Active | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | - | - | DUAL | GULL WING | 260 | 3V | 1.27mm | 40 | MC9RS08KA1 | R-PDSO-G8 | Not Qualified | 5.5V | 2/5V | 1.8V | Internal | 10MHz | 63 x 8 | 1.8V~5.5V | MICROCONTROLLER | - | LVD, POR, WDT | - | FLASH | 8-Bit | 1KB 1K x 8 | - | - | 8 | NO | NO | NO | NO | - | - | - | - | - | - | 1.75mm | - | 3.9mm | ROHS3 Compliant | ||
| MC9RS08KA1CSCR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMKL27Z64VDA4Anlielectronics Тип | NXP USA Inc. |
NXP MKL27Z64VDA4 32 Bit Microcontroller, Kinetis L Series Ultra Low Power, ARM Cortex-M0 , 48 MHz, 64 KB, 16 KB
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 13 Weeks | Surface Mount | 36-XFBGA | YES | A/D 14x16b | 30 | - | - | - | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e1 | Active | 3 (168 Hours) | 36 | 3A991.A.2 | TIN SILVER COPPER | DIFFERENTIAL ANALOG CHANNEL INPUTS: 3-CH 16-BIT | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 0.5mm | 40 | - | S-PBGA-B36 | - | 3.6V | - | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, FlexIO, SPI, UART/USART, USB | - | 32 | YES | YES | YES | NO | - | - | - | - | - | - | 0.5mm | 3.5mm | 3.5mm | ROHS3 Compliant | ||
| MKL27Z64VDA4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMK10DX32VLF5Anlielectronics Тип | NXP USA Inc. |
ARM Microcontrollers - MCU Kinetis 32K Flex
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 13 Weeks | Surface Mount | 48-LQFP | YES | A/D 16x16b | 33 | - | 32768 | - | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | MATTE TIN | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DX32 | S-PQFP-G48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART | - | 32 | YES | YES | YES | YES | - | 2K x 8 | - | CORTEX-M4 | - | - | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||
| MK10DX32VLF5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипS9S08AW16AE0CLDAnlielectronics Тип | NXP USA Inc. |
IC MCU 8BIT 16KB FLASH 44LQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x10b | 34 | - | 16384 | Automotive grade | -40°C~85°C TA | Tray | 2007 | S08 | e3 | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | - | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.8mm | 40 | S9S08AW16 | S-PQFP-G44 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | - | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | 18.5mA | 8 | YES | NO | YES | NO | - | - | - | - | AEC-Q100 | - | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||
| S9S08AW16AE0CLD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMKE02Z64VLH2Anlielectronics Тип | NXP USA Inc. |
IC MCU 32BIT 64KB FLASH 64LQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 20 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x12b; D/A 2x6b | 57 | 4096 | 65536 | - | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | - | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | - | 32 | YES | NO | YES | NO | - | 256 x 8 | 8 | CORTEX-M0 | - | - | - | 10mm | 10mm | ROHS3 Compliant | ||
| MKE02Z64VLH2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMK20DX256VMC10Anlielectronics Тип | NXP USA Inc. |
ARM Microcontrollers - MCU Kinetis 2.x 256K
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 38x16b; D/A 2x12b | 70 | - | 262144 | - | -40°C~105°C TA | Tray | 2013 | Kinetis K20 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK20DX256 | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | - | 32 | YES | YES | YES | YES | - | 4K x 8 | - | CORTEX-M4 | - | - | 1.52mm | 8mm | 8mm | ROHS3 Compliant | ||
| MK20DX256VMC10 |
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