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- Embedded - PLDs (Programmable Logic Device)
| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. ТипPAL16R8DMJ/883BAnlielectronics Тип | AMD |
OT PLD, 12ns, PAL-Type, TTL, CDIP20, CERAMIC, DIP-20
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 20 | 37 MHz | ADVANCED MICRO DEVICES INC | - | - | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-GDIP-T20 | 8 | Not Qualified | MILITARY | 12 ns | PAL-TYPE | 8 | 8 DEDICATED INPUTS, 0 I/O | - | OT PLD | 38535Q/M;38534H;883B | REGISTERED | - | - | 8 | - | 64 | - | - | ||
| PAL16R8DMJ/883B | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXH95180-10HQG208IAnlielectronics Тип | AMD |
Description: Mask PLD, CMOS, PQFP208, HEAT SINK, QFP-208
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 208 | - | ADVANCED MICRO DEVICES INC | 3 | 168 | - | - | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | - | Yes | - | - | 5 V | e3 | - | - | MATTE TIN | - | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | 30 | - | S-PQFP-G208 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | - | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
| XH95180-10HQG208I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипP3Z22V10-DDHAnlielectronics Тип | AMD Xilinx |
Description: EE PLD, 10ns, PAL-Type, CMOS, PDSO24
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 24 | 80 MHz | XILINX INC | - | - | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP24,.25 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | DUAL | GULL WING | - | 0.635 mm | unknown | - | - | R-PDSO-G24 | 10 | Not Qualified | COMMERCIAL | 10 ns | PAL-TYPE | 22 | - | - | EE PLD | - | MACROCELL | - | - | - | - | 132 | - | - | ||
| P3Z22V10-DDH | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипP3Z22V10-DDHAnlielectronics Тип | NXP Semiconductors |
EE PLD, 10ns, PDSO24, 4.40 MM, PLASTIC, SOT-355-1, TSSOP-24
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 24 | 83 MHz | NXP SEMICONDUCTORS | - | 10 | 70 °C | - | PLASTIC/EPOXY | TSSOP | 4.40 MM, PLASTIC, SOT-355-1, TSSOP-24 | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | DUAL | GULL WING | - | 0.65 mm | unknown | - | 24 | R-PDSO-G24 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 1.1 mm | EE PLD | - | MACROCELL | - | - | 11 | - | - | 7.8 mm | 4.4 mm | ||
| P3Z22V10-DDH | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Тип5962-87539023AAnlielectronics Тип | Teledyne e2v |
UV PLD, 30ns, PAL-Type, CMOS, CQCC28,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 28 | 25 MHz | TELEDYNE E2V (UK) LTD | - | 10 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCN | - | LCC28,.45SQ | SQUARE | CHIP CARRIER, WINDOW | Active | - | - | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 8542.39.00.01 | QUAD | NO LEAD | - | 1.27 mm | compliant | - | - | S-CQCC-N28 | 10 | Qualified | MILITARY | 30 ns | PAL-TYPE | 22 | 11 DEDICATED INPUTS, 10 I/O | 2.8956 mm | UV PLD | 38535Q/M;38534H;883B | MACROCELL | - | - | 11 | - | 132 | 11.43 mm | 11.43 mm | ||
| 5962-87539023A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Тип5962-87539023AAnlielectronics Тип | Cypress Semiconductor |
UV PLD, 30ns, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 28 | 25 MHz | CYPRESS SEMICONDUCTOR CORP | - | 10 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCN | WQCCN, | - | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QLCC | - | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 8542.39.00.01 | QUAD | NO LEAD | - | 1.27 mm | unknown | - | 28 | S-CQCC-N28 | - | Not Qualified | MILITARY | 30 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 2.8956 mm | UV PLD | - | MACROCELL | - | - | 11 | - | - | 11.43 mm | 11.43 mm | ||
| 5962-87539023A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипPZ3128IS12BP-TAnlielectronics Тип | NXP Semiconductors |
EE PLD, 14.5ns, PQFP100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 66 MHz | NXP SEMICONDUCTORS | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Transferred | - | - | 3.6 V | 3 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
| PZ3128IS12BP-T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипPZ3128IS12BP-TAnlielectronics Тип | AMD Xilinx |
EE PLD, 14.5ns, CMOS, PQFP100, 14 X 14 MM, 1 MM HEIGHT, PLASTIC, TQFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 69 MHz | XILINX INC | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | 100 | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
| PZ3128IS12BP-T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXC7272-30WC84IAnlielectronics Тип | AMD Xilinx |
UV PLD, 48ns, 72-Cell, CMOS, CQCC84,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 84 | - | XILINX INC | - | - | 85 °C | -40 °C | CERAMIC | QCCJ | - | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | - | - | - | - | NO | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-XQCC-J84 | - | Not Qualified | INDUSTRIAL | 48 ns | - | - | - | - | UV PLD | - | - | 72 | NO | - | NO | - | - | - | ||
| XC7272-30WC84I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXC7272A-16WC84IAnlielectronics Тип | AMD Xilinx |
UV PLD, 25ns, 72-Cell, CMOS, CQCC84, WINDOWED, CERAMIC, MO-087, LCC-84
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 84 | 55 MHz | XILINX INC | 1 | 42 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC84,1.2SQ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QFJ | No | 5.5 V | 4.5 V | 5 V | - | - | - | - | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 84 | S-CQCC-J84 | - | Not Qualified | INDUSTRIAL | 25 ns | - | - | 12 DEDICATED INPUTS, 42 I/O | 4.826 mm | UV PLD | - | MACROCELL | 72 | NO | 12 | NO | - | 29.21 mm | 29.21 mm | ||
| XC7272A-16WC84I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипPZ5032-6A44-TAnlielectronics Тип | AMD Xilinx |
Description: EE PLD, 8ns, CMOS, PQCC44, PLASTIC, MO-047AC, LCC-44
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 44 | 105 MHz | XILINX INC | - | 32 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LPCC | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | COMMERCIAL | 8 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm | ||
| PZ5032-6A44-T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипAMPAL16H8LDCAnlielectronics Тип | AMD |
OT PLD, 35ns, PAL-Type, TTL, CDIP20, HERMETIC SEALED, CERAMIC, DIP-20
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 20 | - | ADVANCED MICRO DEVICES INC | - | 6 | 75 °C | - | CERAMIC, GLASS-SEALED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-GDIP-T20 | 8 | Not Qualified | COMMERCIAL EXTENDED | 35 ns | PAL-TYPE | 16 | 10 DEDICATED INPUTS, 6 I/O | - | OT PLD | - | COMBINATORIAL | - | - | 10 | - | 64 | - | - | ||
| AMPAL16H8LDC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипPZ5128NS10BEAnlielectronics Тип | Philips Semiconductors |
EE PLD, 12ns, 128-Cell, CMOS, PQFP128,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 128 | - | PHILIPS SEMICONDUCTORS | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | - | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK | Transferred | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | - | R-PQFP-G128 | - | Not Qualified | INDUSTRIAL | 12 ns | - | - | - | - | EE PLD | - | - | 128 | YES | - | YES | - | - | - | ||
| PZ5128NS10BE | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипEPM2210F324I4NAnlielectronics Тип | Altera Corporation |
Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 324 | - | ALTERA CORP | 3 | 272 | - | - | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Transferred | BGA | Yes | 2.625 V | 2.375 V | 2.5 V | e1 | Yes | 3A991.D | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | - | 324 | S-PBGA-B324 | - | Not Qualified | - | 9.1 ns | - | - | 0 DEDICATED INPUTS, 272 I/O | 2.2 mm | FLASH PLD | - | MACROCELL | 1700 | YES | - | YES | - | 19 mm | 19 mm | ||
| EPM2210F324I4N | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипEPM2210F324I4NAnlielectronics Тип | Intel Corporation |
Description: Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 324 | 172.4 MHz | INTEL CORP | - | 272 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | - | Yes | 2.625 V | 2.375 V | 2.5 V | e1 | - | 3A991.D | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B324 | 272 | Not Qualified | - | 9.1 ns | - | 272 | 0 DEDICATED INPUTS, 272 I/O | 2.2 mm | FLASH PLD | - | MACROCELL | 1700 | YES | - | YES | - | 19 mm | 19 mm | ||
| EPM2210F324I4N | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXH95432-10HQ304CAnlielectronics Тип | AMD Xilinx |
Mask PLD, CMOS, PQFP304, HEAT SINK, QFP-304
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 304 | - | XILINX INC | 3 | 232 | - | - | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-304 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Transferred | QFP | No | - | - | 5 V | e0 | No | 3A991.D | TIN LEAD | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | compliant | - | 304 | S-PQFP-G304 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 232 I/O | 4.5 mm | MASK PLD | - | MACROCELL | - | - | - | - | - | 40 mm | 40 mm | ||
| XH95432-10HQ304C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Тип5962-8983904RAAnlielectronics Тип | Teledyne e2v |
EE PLD, 10ns, PAL-Type, CMOS, CDIP20,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 20 | 58.8 MHz | TELEDYNE E2V (UK) LTD | - | 8 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | - | DIP20,.3 | RECTANGULAR | IN-LINE | Active | - | - | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | 1 EXTERNAL CLOCK; REGISTER PRELOAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | compliant | - | - | R-GDIP-T20 | 8 | Qualified | MILITARY | 10 ns | PAL-TYPE | 18 | 8 DEDICATED INPUTS, 8 I/O | 5.08 mm | EE PLD | 38535Q/M;38534H;883B | MACROCELL | - | - | 8 | - | 64 | 25.27 mm | 7.62 mm | ||
| 5962-8983904RA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипPEEL18LV8ZJ-25LAnlielectronics Тип | Anachip Corporation |
EE PLD, 30ns, PAL-Type, CMOS, PQCC20,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 20 | 33.3 MHz | ANACHIP CORP | - | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC20,.4SQ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Transferred | - | Yes | - | - | - | - | - | - | - | - | 8542.39.00.01 | QUAD | J BEND | 260 | 1.27 mm | unknown | - | - | S-PQCC-J20 | 8 | Not Qualified | COMMERCIAL | 30 ns | PAL-TYPE | 18 | - | - | EE PLD | - | MACROCELL | - | - | - | - | 113 | - | - | ||
| PEEL18LV8ZJ-25L | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипPEEL18LV8ZJ-25LAnlielectronics Тип | Diodes Incorporated |
EE PLD, 25ns, PAL-Type, CMOS, PQCC20, LEAD FREE, PLASTIC, LCC-20
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 20 | 25 MHz | DIODES INC | 3 | 10 | 70 °C | - | PLASTIC/EPOXY | QCCJ | LEAD FREE, PLASTIC, LCC-20 | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | Yes | 3.6 V | 2.7 V | 3 V | e3 | - | EAR99 | MATTE TIN | - | 8542.39.00.01 | QUAD | J BEND | 260 | 1.27 mm | unknown | - | 20 | S-PQCC-J20 | 8 | Not Qualified | COMMERCIAL | 25 ns | PAL-TYPE | 18 | 7 DEDICATED INPUTS, 10 I/O | 4.369 mm | EE PLD | - | MACROCELL | - | - | 7 | - | 113 | 8.9662 mm | 8.9662 mm | ||
| PEEL18LV8ZJ-25L | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипEPM5128AGC-20Anlielectronics Тип | Altera Corporation |
UV PLD, 33ns, 128-Cell, CMOS, CPGA68, WINDOWED, CERAMIC, PGA-68
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 68 | 66.7 MHz | ALTERA CORP | 1 | 52 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | WPGA | WPGA, PGA68,11X11 | PGA68,11X11 | SQUARE | GRID ARRAY, WINDOW | Obsolete | PGA | No | 5.25 V | 4.75 V | 5 V | e0 | No | - | TIN LEAD | LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 220 | 2.54 mm | unknown | - | 68 | S-CPGA-P68 | - | Not Qualified | COMMERCIAL | 33 ns | - | - | 7 DEDICATED INPUTS, 52 I/O | 3.81 mm | UV PLD | - | MACROCELL | 128 | NO | 7 | NO | - | 27.94 mm | 27.94 mm | ||
| EPM5128AGC-20 |
Индекс :
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