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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Packing Method | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипPZ3320C10EBAnlielectronics Тип | Philips Semiconductors |
Loadable PLD, 12.5ns, 320-Cell, CMOS, PBGA256
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 256 | - | PHILIPS SEMICONDUCTORS | - | - | 70 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,20X20,50 | BGA256,20X20,50 | SQUARE | GRID ARRAY | Transferred | - | No | - | - | 3.3 V | e0 | - | - | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | - | BOTTOM | BALL | - | 1.27 mm | unknown | - | - | S-PBGA-B256 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | - | - | LOADABLE PLD | - | 320 | YES | - | YES | - | - | - | ||
| PZ3320C10EB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPZ3320C10EBAnlielectronics Тип | AMD Xilinx |
Loadable PLD, 12.5ns, 320-Cell, CMOS, PBGA256,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 256 | - | XILINX INC | 3 | - | 70 °C | - | PLASTIC | BGA | - | BGA256,20X20,50 | SQUARE | GRID ARRAY | Obsolete | - | No | - | - | 3.3 V | e0 | - | - | TIN LEAD | YES | 8542.39.00.01 | - | BOTTOM | BALL | 225 | 1.27 mm | not_compliant | 30 | - | S-PBGA-B256 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | - | - | LOADABLE PLD | - | 320 | YES | - | YES | - | - | - | ||
| PZ3320C10EB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC95432-10HQG304CAnlielectronics Тип | AMD Xilinx |
Description: Flash PLD, 10ns, CMOS, PQFP304, HEAT SINK, PLASTIC, QFP-304
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 304 | - | XILINX INC | - | 232 | 70 °C | - | PLASTIC/EPOXY | HFQFP | HFQFP, | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | - | - | - | 5 V | e3 | - | 3A991.D | MATTE TIN | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | unknown | - | 304 | S-PQFP-G304 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 0 DEDICATED INPUTS, 232 I/O | 4.5 mm | FLASH PLD | MACROCELL | - | - | - | - | - | 40 mm | 40 mm | ||
| XC95432-10HQG304C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXH95180-7PQ160CAnlielectronics Тип | AMD |
Description: Mask PLD, CMOS, PQFP160, PLASTIC, QFP-160
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 160 | - | ADVANCED MICRO DEVICES INC | 3 | 133 | - | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | QFP160,1.2SQ | SQUARE | FLATPACK | Obsolete | - | No | - | - | 5 V | e0 | - | - | TIN LEAD | - | - | - | QUAD | GULL WING | - | 0.65 mm | compliant | - | - | S-PQFP-G160 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 133 I/O | 3.94 mm | MASK PLD | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
| XH95180-7PQ160C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPZ3032I10BCAnlielectronics Тип | NXP Semiconductors |
EE PLD, 16ns, PQFP44, 10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 44 | 58.8 MHz | NXP SEMICONDUCTORS | - | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | 10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44 | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.8 mm | unknown | - | 44 | S-PQFP-G44 | - | Not Qualified | INDUSTRIAL | 16 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
| PZ3032I10BC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипEPM9560WC208-15Anlielectronics Тип | Altera Corporation |
EE PLD, 16.6ns, 560-Cell, CMOS, CQFP208, POWER, CQFP-208
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 208 | 117.6 MHz | ALTERA CORP | - | 153 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | e0 | No | - | TIN LEAD | 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | - | QUAD | GULL WING | 220 | 0.5 mm | unknown | - | 208 | S-CQFP-G208 | - | Not Qualified | COMMERCIAL | 16.6 ns | - | - | 0 DEDICATED INPUTS, 153 I/O | 4.1 mm | EE PLD | MACROCELL | 560 | YES | - | YES | - | 28 mm | 28 mm | ||
| EPM9560WC208-15 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипEPM9560WC208-20CAnlielectronics Тип | Altera Corporation |
EE PLD, 23.6ns, 560-Cell, CMOS, CQFP208, POWER, CQFP-208
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 208 | 100 MHz | ALTERA CORP | - | 153 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | FQFP | FQFP, HQFP208,1.2SQ,20 | HQFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | 560 MACROCELLS; 35 LABS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | - | QUAD | GULL WING | 220 | 0.5 mm | unknown | - | 208 | S-CQFP-G208 | - | Not Qualified | COMMERCIAL | 23.6 ns | - | - | 0 DEDICATED INPUTS, 153 I/O | 4.1 mm | EE PLD | MACROCELL | 560 | YES | - | YES | - | 28 mm | 28 mm | ||
| EPM9560WC208-20C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXH95216-10HQ208IAnlielectronics Тип | AMD Xilinx |
Mask PLD, CMOS, PQFP208, HEAT SINK, QFP-208
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 208 | - | XILINX INC | 3 | 168 | - | - | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Transferred | QFP | No | - | - | 5 V | e0 | No | - | TIN LEAD | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
| XH95216-10HQ208I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCR3256XL-7.5CSG280CAnlielectronics Тип | AMD |
EE PLD, 7.5ns, CMOS, PBGA280, CHIP SCALE, BGA-280
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 280 | 167 MHz | ADVANCED MICRO DEVICES INC | 3 | 160 | 70 °C | - | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | - | Yes | 3.6 V | 3 V | 3.3 V | e1 | - | - | TIN SILVER COPPER | - | - | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B280 | - | Not Qualified | COMMERCIAL | 7.5 ns | - | - | 160 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | - | - | - | 16 mm | 16 mm | ||
| XCR3256XL-7.5CSG280C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCR3256XL-7.5CSG280CAnlielectronics Тип | AMD Xilinx |
EE PLD, 7.5ns, CMOS, PBGA280, CHIP SCALE, BGA-280
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 280 | 167 MHz | XILINX INC | 3 | 160 | 70 °C | - | PLASTIC/EPOXY | TFBGA | CHIP SCALE, BGA-280 | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3.6 V | 3 V | 3.3 V | e1 | Yes | - | TIN SILVER COPPER | - | 8542.39.00.01 | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | 280 | S-PBGA-B280 | - | Not Qualified | COMMERCIAL | 7.5 ns | - | - | 160 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | - | - | - | 16 mm | 16 mm | ||
| XCR3256XL-7.5CSG280C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипATV750B-25PCAnlielectronics Тип | Atmel Corporation |
OT PLD, 25ns, 10-Cell, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 24 | 29 MHz | ATMEL CORP | - | 10 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | TIN LEAD | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 8542.39.00.01 | - | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 24 | R-PDIP-T24 | - | Not Qualified | COMMERCIAL | 25 ns | - | - | 11 DEDICATED INPUTS, 10 I/O | 5.06 mm | OT PLD | MACROCELL | 10 | NO | 11 | NO | - | 32 mm | 7.62 mm | ||
| ATV750B-25PC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPZ3064-12BB1-SAnlielectronics Тип | AMD Xilinx |
EE PLD, 14.5ns, 64-Cell, CMOS, PQFP100, 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 67 MHz | XILINX INC | 3 | 64 | 70 °C | - | PLASTIC/EPOXY | QFP | 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100 | QFP100,.7X.9 | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 3.63 V | 2.97 V | 3.3 V | e0 | - | - | TIN LEAD | 64 MACROCELLS | 8542.39.00.01 | TRAY | QUAD | GULL WING | 225 | 0.65 mm | not_compliant | 30 | 100 | R-PQFP-G100 | - | Not Qualified | COMMERCIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 64 I/O | 3.4 mm | EE PLD | MACROCELL | 64 | NO | 2 | NO | - | 20 mm | 14 mm | ||
| PZ3064-12BB1-S | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCR5064-12VQ44IAnlielectronics Тип | AMD Xilinx |
EE PLD, 12ns, 64-Cell, CMOS, PQFP44, PLASTIC, VQFP-44
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 44 | 67 MHz | XILINX INC | 3 | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP, TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | - | - | TIN LEAD | NO | 8542.39.00.01 | - | QUAD | GULL WING | 240 | 0.8 mm | not_compliant | 30 | 44 | S-PQFP-G44 | - | Not Qualified | INDUSTRIAL | 12 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | MACROCELL | 64 | NO | 2 | NO | - | 10 mm | 10 mm | ||
| XCR5064-12VQ44I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCR3128-10PQ100CAnlielectronics Тип | AMD Xilinx |
EE PLD, 10ns, 128-Cell, CMOS, PQFP100, PLASTIC, QFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 77 MHz | XILINX INC | 3 | 80 | 70 °C | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-100 | QFP100,.7X.9 | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 3.63 V | 2.97 V | 3.3 V | e0 | - | - | TIN LEAD | YES | 8542.39.00.01 | - | QUAD | GULL WING | 225 | 0.65 mm | not_compliant | 30 | 100 | R-PQFP-G100 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 3.4 mm | EE PLD | MACROCELL | 128 | YES | 2 | YES | - | 20 mm | 14 mm | ||
| XCR3128-10PQ100C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPZ5064-10BC-TAnlielectronics Тип | NXP Semiconductors |
EE PLD, 12.5ns, PQFP44
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 44 | 77 MHz | NXP SEMICONDUCTORS | - | 32 | 70 °C | - | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Transferred | - | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 12.5 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
| PZ5064-10BC-T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXH95180-7HQG208IAnlielectronics Тип | AMD Xilinx |
Mask PLD, CMOS, PQFP208, HEAT SINK, QFP-208
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 208 | - | XILINX INC | 3 | 168 | - | - | PLASTIC/EPOXY | HFQFP | HEAT SINK, QFP-208 | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Transferred | QFP | Yes | - | - | 5 V | e3 | Yes | - | MATTE TIN | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | compliant | - | 208 | S-PQFP-G208 | - | Not Qualified | - | - | - | - | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | MASK PLD | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
| XH95180-7HQG208I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7236A-20WC44MAnlielectronics Тип | AMD Xilinx |
Description: UV PLD, 32ns, 36-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, MO-087, LCC-44
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 44 | 40 MHz | XILINX INC | 1 | 30 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QFJ | No | 5.5 V | 4.5 V | 5 V | - | - | 3A001.A.2.C | - | PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-CQCC-J44 | - | Not Qualified | MILITARY | 32 ns | - | - | 2 DEDICATED INPUTS, 30 I/O | 4.826 mm | UV PLD | MACROCELL | 36 | NO | 2 | NO | - | 16.51 mm | 16.51 mm | ||
| XC7236A-20WC44M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPZ5128-S12BB1-TAnlielectronics Тип | AMD Xilinx |
EE PLD, 14.5ns, CMOS, PQFP100, 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 63 MHz | XILINX INC | - | 80 | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Obsolete | QFP | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.65 mm | unknown | - | 100 | R-PQFP-G100 | - | Not Qualified | COMMERCIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 3.4 mm | EE PLD | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm | ||
| PZ5128-S12BB1-T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCR3256XL-12PQG208QAnlielectronics Тип | AMD Xilinx |
Description: EE PLD, 12ns, CMOS, PQFP208, PLASTIC, QFP-208
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 208 | - | XILINX INC | 3 | 164 | 125 °C | -40 °C | PLASTIC/EPOXY | FQFP | FQFP, | - | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | Yes | 3.6 V | 3 V | 3.3 V | e3 | Yes | - | Matte Tin (Sn) | - | 8542.39.00.01 | - | QUAD | GULL WING | 245 | 0.5 mm | compliant | 30 | 208 | S-PQFP-G208 | - | Not Qualified | AUTOMOTIVE | 12 ns | - | - | 0 DEDICATED INPUTS, 164 I/O | 4.1 mm | EE PLD | MACROCELL | - | - | - | - | - | 28 mm | 28 mm | ||
| XCR3256XL-12PQG208Q | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGAL16V8-10LVCAnlielectronics Тип | Texas Instruments |
IC,SIMPLE-EEPLD,PAL-TYPE,CMOS,LDCC,20PIN,PLASTIC
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 20 | 58.8 MHz | NATIONAL SEMICONDUCTOR CORP | - | - | 70 °C | - | PLASTIC | QCCJ | QCCJ, LDCC20,.4SQ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | e0 | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | - | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J20 | 8 | Not Qualified | COMMERCIAL | 10 ns | PAL-TYPE | 18 | - | - | EE PLD | MACROCELL | - | - | - | - | 64 | - | - | ||
| GAL16V8-10LVC |
Индекс :
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