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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Temperature Grade | Propagation Delay | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Screening Level | Output Function | Number of Macro Cells | JTAG BST | Number of Dedicated Inputs | In-System Programmable | Number of Product Terms | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипPZ3128IS12BP-TAnlielectronics Тип | AMD Xilinx |
EE PLD, 14.5ns, CMOS, PQFP100, 14 X 14 MM, 1 MM HEIGHT, PLASTIC, TQFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 69 MHz | XILINX INC | - | 80 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 128 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | unknown | - | 100 | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 14 mm | 14 mm | ||
| PZ3128IS12BP-T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7272-30WC84IAnlielectronics Тип | AMD Xilinx |
UV PLD, 48ns, 72-Cell, CMOS, CQCC84,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 84 | - | XILINX INC | - | - | 85 °C | -40 °C | CERAMIC | QCCJ | - | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | - | - | - | - | NO | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-XQCC-J84 | - | Not Qualified | INDUSTRIAL | 48 ns | - | - | - | - | UV PLD | - | - | 72 | NO | - | NO | - | - | - | ||
| XC7272-30WC84I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7272A-16WC84IAnlielectronics Тип | AMD Xilinx |
UV PLD, 25ns, 72-Cell, CMOS, CQCC84, WINDOWED, CERAMIC, MO-087, LCC-84
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 84 | 55 MHz | XILINX INC | 1 | 42 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | WQCCJ, LDCC84,1.2SQ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QFJ | No | 5.5 V | 4.5 V | 5 V | - | - | - | - | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 84 | S-CQCC-J84 | - | Not Qualified | INDUSTRIAL | 25 ns | - | - | 12 DEDICATED INPUTS, 42 I/O | 4.826 mm | UV PLD | - | MACROCELL | 72 | NO | 12 | NO | - | 29.21 mm | 29.21 mm | ||
| XC7272A-16WC84I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPZ5032-6A44-TAnlielectronics Тип | AMD Xilinx |
Description: EE PLD, 8ns, CMOS, PQCC44, PLASTIC, MO-047AC, LCC-44
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 44 | 105 MHz | XILINX INC | - | 32 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LPCC | - | 5.25 V | 4.75 V | 5 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | COMMERCIAL | 8 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm | ||
| PZ5032-6A44-T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAMPAL16H8LDCAnlielectronics Тип | AMD |
OT PLD, 35ns, PAL-Type, TTL, CDIP20, HERMETIC SEALED, CERAMIC, DIP-20
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 20 | - | ADVANCED MICRO DEVICES INC | - | 6 | 75 °C | - | CERAMIC, GLASS-SEALED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-GDIP-T20 | 8 | Not Qualified | COMMERCIAL EXTENDED | 35 ns | PAL-TYPE | 16 | 10 DEDICATED INPUTS, 6 I/O | - | OT PLD | - | COMBINATORIAL | - | - | 10 | - | 64 | - | - | ||
| AMPAL16H8LDC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC9572XV-7CSG48IAnlielectronics Тип | AMD Xilinx |
Description: Flash PLD, 7.5ns, 72-Cell, CMOS, PBGA48, CSP-48
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 48 | 125 MHz | XILINX INC | 3 | 38 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA48,7X7,32 | BGA48,7X7,32 | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | BGA | Yes | 2.62 V | 2.37 V | 2.5 V | e1 | - | - | TIN SILVER COPPER | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8 mm | compliant | 30 | 48 | S-PBGA-B48 | - | Not Qualified | INDUSTRIAL | 7.5 ns | - | - | 0 DEDICATED INPUTS, 38 I/O | 1.8 mm | FLASH PLD | - | MACROCELL | 72 | YES | - | YES | - | 7 mm | 7 mm | ||
| XC9572XV-7CSG48I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипEP22416001Anlielectronics Тип | TE Connectivity |
-
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| EP22416001 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7372-7PC68IAnlielectronics Тип | AMD Xilinx |
OT PLD, 7.5ns, 72-Cell, CMOS, PQCC68
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 68 | - | XILINX INC | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | - | e0 | - | - | TIN LEAD | NO | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | - | S-PQCC-J68 | - | Not Qualified | INDUSTRIAL | 7.5 ns | - | - | - | - | OT PLD | - | - | 72 | NO | - | NO | - | - | - | ||
| XC7372-7PC68I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипDPLD610-25Anlielectronics Тип | Intel Corporation |
Description: UV PLD, 25ns, PAL-Type, CMOS, CDIP24, 0.300 INCH, CERDIP-24
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 24 | 33.3 MHz | INTEL CORP | - | 16 | 70 °C | - | CERAMIC, GLASS-SEALED | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | PAL WITH MACROCELLS; 16 MACROCELLS; 2 EXTERNAL CLOCKS; ASYNCHRONOUS CLOCKS | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | compliant | - | 24 | R-GDIP-T24 | 16 | Not Qualified | COMMERCIAL | 25 ns | PAL-TYPE | 20 | 4 DEDICATED INPUTS, 16 I/O | 5.72 mm | UV PLD | - | MACROCELL | - | - | 4 | - | 160 | 32.07 mm | 7.62 mm | ||
| DPLD610-25 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипEPM7256MC208-25Anlielectronics Тип | Altera Corporation |
OT PLD, 25ns, 256-Cell, CMOS, MQFP208, METAL, QFP-208
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 208 | 40 MHz | ALTERA CORP | - | 160 | 70 °C | - | METAL | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 5.25 V | 4.75 V | 5 V | e0 | - | - | TIN LEAD | 256 MACROCELLS; SHARED INPUT/CLOCK | 8542.39.00.01 | QUAD | GULL WING | 220 | 0.5 mm | compliant | - | 208 | S-MQFP-G208 | - | Not Qualified | COMMERCIAL | 25 ns | - | - | 0 DEDICATED INPUTS, 160 I/O | 3.96 mm | OT PLD | - | MACROCELL | 256 | NO | - | NO | - | 27.69 mm | 27.69 mm | ||
| EPM7256MC208-25 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7272-30PC84CAnlielectronics Тип | AMD Xilinx |
OT PLD, 48ns, 72-Cell, CMOS, PQCC84
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 84 | - | XILINX INC | 3 | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | - | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | - | - | 5 V | e0 | - | - | TIN LEAD | NO | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | unknown | 30 | - | S-PQCC-J84 | - | Not Qualified | COMMERCIAL | 48 ns | - | - | - | - | OT PLD | - | - | 72 | NO | - | NO | - | - | - | ||
| XC7272-30PC84C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC95144XV-4TQ100IAnlielectronics Тип | AMD Xilinx |
Description: Flash PLD, 4ns, PQFP100, PLASTIC, TQFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | - | XILINX INC | 3 | 81 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | PLASTIC, TQFP-100 | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 2.6 V | 2.4 V | 2.5 V | e0 | - | - | TIN LEAD | - | 8542.39.00.01 | QUAD | GULL WING | - | 0.5 mm | compliant | - | 100 | S-PQFP-G100 | - | Not Qualified | INDUSTRIAL | 4 ns | - | - | 0 DEDICATED INPUTS, 81 I/O | 1.6 mm | FLASH PLD | - | REGISTERED | - | - | - | - | - | 14 mm | 14 mm | ||
| XC95144XV-4TQ100I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCR3064A-10CP56IAnlielectronics Тип | AMD Xilinx |
EE PLD, 10ns, 64-Cell, CMOS, PBGA56, PLASTIC, CHIP SCALE, BGA-56
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 56 | 90 MHz | XILINX INC | 3 | 44 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | PLASTIC, CHIP SCALE, BGA-56 | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | No | 3.6 V | 2.7 V | 3 V | e0 | - | - | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | 30 | 56 | S-PBGA-B56 | - | Not Qualified | INDUSTRIAL | 10 ns | - | - | 2 DEDICATED INPUTS, 44 I/O | 1.35 mm | EE PLD | - | MACROCELL | 64 | YES | 2 | YES | - | 6 mm | 6 mm | ||
| XCR3064A-10CP56I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPALC22V10B-15KMBAnlielectronics Тип | Cypress Semiconductor |
Description: OT PLD, 15ns, PAL-Type, CMOS, CDFP24, CERPACK-24
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 24 | 50 MHz | CYPRESS SEMICONDUCTOR CORP | - | 10 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DFP | DFP, FL24,.4 | FL24,.4 | RECTANGULAR | FLATPACK | Obsolete | DFP | No | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 8542.39.00.01 | DUAL | FLAT | - | 1.27 mm | not_compliant | - | 24 | R-GDFP-F24 | 10 | Not Qualified | MILITARY | 15 ns | PAL-TYPE | 22 | 11 DEDICATED INPUTS, 10 I/O | 2.286 mm | OT PLD | 38535Q/M;38534H;883B | MACROCELL | - | - | 11 | - | 132 | 15.367 mm | 9.652 mm | ||
| PALC22V10B-15KMB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPALC22V10B-15KMBAnlielectronics Тип | Teledyne e2v |
Description: Programmable Logic Device
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | E2V TECHNOLOGIES PLC | - | - | - | - | - | - | , | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| PALC22V10B-15KMB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPZ3032CS10A44-TAnlielectronics Тип | AMD Xilinx |
Description: EE PLD, 13ns, CMOS, PQCC44, PLASTIC, MO-047AC, LCC-44
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 44 | 57 MHz | XILINX INC | - | 32 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LPCC | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | - | 1.27 mm | unknown | - | 44 | S-PQCC-J44 | - | Not Qualified | COMMERCIAL | 13 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 4.57 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 16.5862 mm | 16.5862 mm | ||
| PZ3032CS10A44-T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPAL16R6AMJ/883BAnlielectronics Тип | Rochester Electronics LLC |
OT PLD, 30ns, TTL, CDIP20, CERAMIC, DIP-20
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 20 | 20 MHz | ROCHESTER ELECTRONICS LLC | - | 2 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | CERAMIC, DIP-20 | DIP20,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | DIP | No | 5.5 V | 4.5 V | 5 V | - | No | 3A001.A.2.C | - | PAL; REGISTER PRELOAD; POWER-UP RESET | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | unknown | NOT SPECIFIED | 20 | R-CDIP-T20 | - | Not Qualified | MILITARY | 30 ns | - | - | 8 DEDICATED INPUTS, 2 I/O | 5.08 mm | OT PLD | - | MIXED | - | - | 8 | - | - | 24.257 mm | 7.62 mm | ||
| PAL16R6AMJ/883B | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPAL16R6AMJ/883BAnlielectronics Тип | AMD |
Description: OT PLD, 30ns, PAL-Type, TTL, CDIP20, CERAMIC, DIP-20
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 20 | 20 MHz | ADVANCED MICRO DEVICES INC | - | 2 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | CERAMIC, DIP-20 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.5 V | 4.5 V | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | PAL; REGISTER PRELOAD; POWER-UP RESET | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 20 | R-CDIP-T20 | 6 | Not Qualified | MILITARY | 30 ns | PAL-TYPE | 10 | 8 DEDICATED INPUTS, 2 I/O | 5.08 mm | OT PLD | 38535Q/M;38534H;883B | MIXED | - | - | 8 | - | 64 | 24.257 mm | 7.62 mm | ||
| PAL16R6AMJ/883B | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPZ3064-12BB1-TAnlielectronics Тип | AMD Xilinx |
EE PLD, 14.5ns, CMOS, PQFP100, 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 67 MHz | XILINX INC | - | 64 | 70 °C | - | PLASTIC/EPOXY | QFP | QFP, | - | RECTANGULAR | FLATPACK | Obsolete | QFP | - | 3.63 V | 2.97 V | 3.3 V | - | - | - | - | 64 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | - | 0.65 mm | unknown | - | 100 | R-PQFP-G100 | - | Not Qualified | COMMERCIAL | 14.5 ns | - | - | 2 DEDICATED INPUTS, 64 I/O | 3.4 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 20 mm | 14 mm | ||
| PZ3064-12BB1-T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипPZ3032CS8BC-SAnlielectronics Тип | NXP Semiconductors |
Description: EE PLD, 10ns, PQFP44
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 44 | 91 MHz | NXP SEMICONDUCTORS | - | 32 | 70 °C | - | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Transferred | - | - | 3.63 V | 3 V | 3.3 V | - | - | - | - | 32 MACROCELLS | 8542.39.00.01 | QUAD | GULL WING | - | 0.8 mm | unknown | - | - | S-PQFP-G44 | - | Not Qualified | COMMERCIAL | 10 ns | - | - | 2 DEDICATED INPUTS, 32 I/O | 1.2 mm | EE PLD | - | MACROCELL | - | - | 2 | - | - | 10 mm | 10 mm | ||
| PZ3032CS8BC-S |
Индекс :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ





