Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page18

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Embedded - System On Chip (SoC)

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Factory Lead Time	Lifecycle Status	Mount	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of I/Os	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Memory Size	Operating Supply Current	Speed	RAM Size	Core Processor	Peripherals	Connectivity	Data Rate	Architecture	Number of Inputs	Organization	Programmable Logic Type	Number of Logic Elements/Cells	Core Architecture	Number of Gates	Number of Logic Blocks (LABs)	Primary Attributes	Number of Logic Cells	Number of Equivalent Gates	Flash Size	Height Seated (Max)	Length	Width	RoHS Status

Изображение	Тип	Марка	Объяснение	Количество	Factory Lead Time	Lifecycle Status	Mount	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of I/Os	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Memory Size	Operating Supply Current	Speed	RAM Size	Core Processor	Peripherals	Connectivity	Data Rate	Architecture	Number of Inputs	Organization	Programmable Logic Type	Number of Logic Elements/Cells	Core Architecture	Number of Gates	Number of Logic Blocks (LABs)	Primary Attributes	Number of Logic Cells	Number of Equivalent Gates	Flash Size	Height Seated (Max)	Length	Width	RoHS Status
	Mfr. Тип M2S050T-FCSG325I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	-	325-TFBGA, CSPBGA	YES	-	-	200	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	Active	3 (168 Hours)	325	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	200	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	200	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 50K Logic Modules	56340	-	256KB	1.01mm	11mm	11mm	RoHS Compliant
M2S050T-FCSG325I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-FGG676 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 676FBGA Сборник данных Сравнение	Min.:1 Mult.:1	11 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	676-BGA	YES	-	-	387	0°C~85°C TJ	Tray	2015	SmartFusion®2	e3	Active	3 (168 Hours)	676	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	-	-	NOT SPECIFIED	-	S-PBGA-B676	387	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	387	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 60K Logic Modules	56520	-	256KB	2.44mm	27mm	27mm	RoHS Compliant
M2S060-FGG676 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-1FCS325 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	-	325-TFBGA, CSPBGA	YES	-	-	200	0°C~85°C TJ	Tray	2015	SmartFusion®2	e0	Active	3 (168 Hours)	325	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B325	200	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	200	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 60K Logic Modules	56520	-	256KB	1.01mm	11mm	11mm	Non-RoHS Compliant
M2S060TS-1FCS325 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-FG484I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	484-BGA	YES	-	-	267	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e0	Active	3 (168 Hours)	484	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B484	267	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	267	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 25K Logic Modules	27696	-	256KB	2.44mm	23mm	23mm	Non-RoHS Compliant
M2S025TS-FG484I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-FCSG325I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	-	325-TFBGA, CSPBGA	YES	-	-	200	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	Active	3 (168 Hours)	325	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	200	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	200	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 60K Logic Modules	56520	-	256KB	1.01mm	11mm	11mm	RoHS Compliant
M2S060TS-FCSG325I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1FGG484I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	-	484-BGA	-	-	484-FPBGA (23x23)	267	-40°C~100°C TJ	Tray	2009	SmartFusion®2	-	Active	3 (168 Hours)	-	-	100°C	-40°C	-	-	-	-	-	-	-	-	166MHz	-	M2S025T	-	-	-	-	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	-	-	-	-	ARM	-	-	FPGA - 25K Logic Modules	-	-	256KB	-	-	-	RoHS Compliant
M2S025T-1FGG484I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-VFG400 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	8 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	-	400-LFBGA	-	400	400-VFBGA (17x17)	207	0°C~85°C TJ	Tray	2009	SmartFusion®2	-	Active	3 (168 Hours)	-	-	85°C	0°C	-	-	-	-	-	-	-	-	166MHz	-	M2S050T	-	-	-	-	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	-	-	-	-	ARM	-	-	FPGA - 50K Logic Modules	-	-	256KB	-	-	-	RoHS Compliant
M2S050T-VFG400 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-VF256I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	256-LFBGA	YES	-	-	138	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e0	Active	3 (168 Hours)	256	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B256	138	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	138	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.56mm	14mm	14mm	Non-RoHS Compliant
M2S025T-VF256I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1FGG484 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	-	484-BGA	-	-	484-FPBGA (23x23)	267	0°C~85°C TJ	Tray	2009	SmartFusion®2	-	Active	3 (168 Hours)	-	-	85°C	0°C	-	-	-	-	-	-	-	-	166MHz	-	M2S025T	-	-	-	-	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	-	-	-	-	ARM	-	-	FPGA - 25K Logic Modules	-	-	256KB	-	-	-	RoHS Compliant
M2S025T-1FGG484 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-1FG484 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	484-BGA	-	-	484-FPBGA (23x23)	267	0°C~85°C TJ	Tray	-	SmartFusion®2	-	Active	3 (168 Hours)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	-	-	-	-	-	-	-	FPGA - 25K Logic Modules	-	-	256KB	-	-	-	Non-RoHS Compliant
M2S025TS-1FG484 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-VF400 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	400-LFBGA	YES	-	-	207	0°C~85°C TJ	Tray	2015	SmartFusion®2	e0	Active	3 (168 Hours)	400	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B400	207	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	207	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.51mm	17mm	17mm	Non-RoHS Compliant
M2S025TS-VF400 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-FCS325I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	325-TFBGA, CSPBGA	YES	-	-	180	-40°C~100°C TJ	Tray	-	SmartFusion®2	e0	Active	3 (168 Hours)	325	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B325	180	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	180	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.01mm	11mm	11mm	Non-RoHS Compliant
M2S025TS-FCS325I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-PQ208I Anlielectronics Тип	Microsemi Corporation	IC FPGA 500K GATES 512KB 208QFP Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	-	-	208-BFQFP	YES	208	-	MCU - 22, FPGA - 66	-40°C~100°C TJ	Tray	2013	SmartFusion®	e0	Obsolete	3 (168 Hours)	208	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	QUAD	GULL WING	225	1.5V	0.5mm	-	80MHz	20	A2F500M3G	-	66	Not Qualified	-	1.575V	1.51.82.53.3V	1.425V	Ethernet, I2C, SPI, UART, USART	-	-	-	-	-	64KB	ARM® Cortex®-M3	DMA, POR, WDT	Ethernet, I2C, SPI, UART/USART	-	MCU, FPGA	-	11520 CLBS, 500000 GATES	FIELD PROGRAMMABLE GATE ARRAY	-	ARM	-	24	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	500000	512KB	4.1mm	28mm	28mm	Non-RoHS Compliant
A2F500M3G-PQ208I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F060M3E-FGG256 Anlielectronics Тип	Microsemi Corporation	IC FPGA 60K GATES 128KB 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	2 Weeks	-	Surface Mount	256-LBGA	-	256	-	MCU - 26, FPGA - 66	0°C~85°C TJ	Tray	2015	SmartFusion®	e1	Obsolete	3 (168 Hours)	256	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	BOTTOM	BALL	250	1.5V	1mm	-	80MHz	30	A2F060M3E	-	-	-	1.5V	-	-	-	EBI/EMI, I2C, SPI, UART, USART	1.575V	1.425V	4.5kB	3mA	-	16KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	400 kbps	MCU, FPGA	-	-	FIELD PROGRAMMABLE GATE ARRAY	660	ARM	60000	-	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	-	-	128KB	1.7mm	17mm	17mm	RoHS Compliant
A2F060M3E-FGG256 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-VFG400I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	8 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	-	400-LFBGA	YES	-	-	207	-40°C~100°C TJ	Tray	2014	SmartFusion®2	e3	Active	3 (168 Hours)	400	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	-	-	NOT SPECIFIED	-	S-PBGA-B400	207	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	207	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 50K Logic Modules	56340	-	256KB	1.51mm	17mm	17mm	RoHS Compliant
M2S050T-VFG400I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-FG484 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	484-BGA	YES	-	-	267	0°C~85°C TJ	Tray	2015	SmartFusion®2	e0	Active	3 (168 Hours)	484	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B484	267	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	267	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 50K Logic Modules	56340	-	256KB	2.44mm	23mm	23mm	Non-RoHS Compliant
M2S050TS-FG484 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-1FGG676 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 676FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	676-BGA	YES	-	-	387	0°C~85°C TJ	Tray	2015	SmartFusion®2	e3	Active	3 (168 Hours)	676	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	-	-	NOT SPECIFIED	-	S-PBGA-B676	387	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	387	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 60K Logic Modules	56520	-	256KB	2.44mm	27mm	27mm	RoHS Compliant
M2S060-1FGG676 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-VF400I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	400-LFBGA	YES	-	-	207	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e0	Active	3 (168 Hours)	400	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B400	207	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	207	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 50K Logic Modules	56340	-	256KB	1.51mm	17mm	17mm	Non-RoHS Compliant
M2S050TS-VF400I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-FGG484 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	-	484-BGA	YES	-	-	267	0°C~85°C TJ	Tray	2015	SmartFusion®2	e3	Active	3 (168 Hours)	484	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	-	-	NOT SPECIFIED	-	S-PBGA-B484	267	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	267	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 60K Logic Modules	56520	-	256KB	2.44mm	23mm	23mm	RoHS Compliant
M2S060TS-FGG484 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FG676 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 676FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	-	676-BGA	YES	-	-	387	0°C~85°C TJ	Tray	2015	SmartFusion®2	e0	Active	3 (168 Hours)	676	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B676	387	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	-	MCU, FPGA	387	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 60K Logic Modules	56520	-	256KB	2.44mm	27mm	27mm	Non-RoHS Compliant
M2S060T-1FG676 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S050T-FCSG325I,M2S060-FGG676,M2S060TS-1FCS325,M2S025TS-FG484I,M2S060TS-FCSG325I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 760 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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