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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Material | Body Material | Number of Terminals | Mounting Hole Diameter | Package Quantity | Base Product Number | Brand | Center Frequency | Clock Frequency-Max | Data RAM Size | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Frequency Aging | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Method | Mounting Orientation | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Special Features | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Color | Additional Feature | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency Stability | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Load Capacitance | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Includes | Total RAM Bits | Number of Gates | Speed Grade | Resistance Tolerance | Primary Attributes | Number of CLBs | Number of Logic Cells | Finish | Number of Cores | Number of Equivalent Gates | Output Level | Overall Length | Flash Size | Pin Diameter | Product Category | Length | Width |
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![]() | Mfr. ТипM2S005-1FGG484IAnlielectronics Тип | Microchip |
FPGA SmartFusion2 6060 Cells 166MHz 65nm Technology 1.2V 484-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 484-BGA | YES | 484-FPBGA (23x23) | - | - | 484 | - | - | M2S005 | - | - | - | 64 kB | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-1FGG484I | 166 MHz | - | - | Microchip Technology | - | - | - | 3 | - | - | - | SMD/SMT | MSL 3 - 168 hours | 209 | - | 6060 LE | - | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.79 | - | Yes | - | - | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | - | -40 to 100 °C | - | SmartFusion®2 | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 209 | Not Qualified | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 191Kbit | - | 1 | - | FPGA - 5K Logic Modules | - | 6060 | - | 1 Core | - | - | - | 128KB | - | - | 23 mm | 23 mm | ||
| M2S005-1FGG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S005-TQ144Anlielectronics Тип | Microchip |
IC SOC CORTEX-M3 166MHZ 144TQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 144-LQFP | YES | 144-TQFP (20x20) | - | - | 144 | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-TQ144 | - | - | - | Microchip Technology | - | - | - | 3 | - | - | - | - | - | 84 | - | - | 85 °C | - | - | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.85 | - | No | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e0 | - | - | - | Tin/Lead (Sn/Pb) | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | - | CMOS | QUAD | GULL WING | 240 | 0.5 mm | - | not_compliant | - | - | S-PQFP-G144 | 84 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | - | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | FPGA - 5K Logic Modules | - | 6060 | - | - | - | - | - | 128KB | - | - | 20 mm | 20 mm | ||
| M2S005-TQ144 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S005S-VFG256IAnlielectronics Тип | Microchip |
SoC FPGA M2S005S-VFG256I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | VFPBGA-256 | YES | 256-FPBGA (17x17) | - | - | 256 | - | - | M2S005 | Microchip Technology / Atmel | - | - | 64 kB | - | - | 119 | - | MICROSEMI CORP | - | - | Microchip | M2S005S-VFG256I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | - | - | SMD/SMT | - | 161 | 505 LAB | 6060 LE | - | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 2.4 | Details | Yes | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 50 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | - | - | 8.06 | Tin/Silver/Copper (Sn/Ag/Cu) | - | LG-MIN, WD-MIN | 8542.39.00.01 | SOC - Systems on a Chip | 0.125 W | CMOS | BOTTOM | BALL | 250 | 0.8 mm | General Purpose | compliant | - | - | S-PBGA-B256 | 161 | Not Qualified | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | - | - | - | 1 | FPGA - 5K Logic Modules | - | 6060 | - | 1 Core | - | - | - | 128KB | - | SoC FPGA | 14 mm | 14 mm | ||
| M2S005S-VFG256I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S010-FGG484Anlielectronics Тип | Microchip |
FPGA SmartFusion2 12084 Cells 65nm Technology 1.2V 484-Pin FPBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 484-BGA | - | 484-FPBGA (23x23) | - | - | - | - | - | M2S010 | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | - | - | - | - | - | SMD/SMT | - | 233 | - | 12084 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | 1.2000 V | - | - | 0 to 85 °C | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | STD | - | FPGA - 10K Logic Modules | - | - | - | 1 Core | - | - | - | 256KB | - | - | - | - | ||
| M2S010-FGG484 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S005S-1VFG256IAnlielectronics Тип | Microchip |
IC SOC CORTEX-M3 166MHZ 256FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 256-LBGA | - | 256-FPBGA (17x17) | - | - | - | - | - | M2S005 | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | - | - | - | - | - | SMD/SMT | - | 161 | - | 6060 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | FPGA - 5K Logic Modules | - | - | - | 1 Core | - | - | - | 128KB | - | - | - | - | ||
| M2S005S-1VFG256I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S005-VFG400Anlielectronics Тип | Microchip |
FPGA SmartFusion2 Family 6060 Cells 166MHz 65nm Technology 2.5V/3.3V 400-Pin F-BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 400-LFBGA | YES | 400-VFBGA (17x17) | - | - | 400 | - | - | M2S005 | - | - | - | 64 kB | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-VFG400 | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | - | 3 | - | - | - | SMD/SMT | - | 169 | - | 6060 LE | 85 °C | - | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.28 | - | Yes | - | - | 1.26 V | 1.14 V | 1.2 V | - | 2.5, 3.3 V | - | - | 0 to 85 °C | - | SmartFusion®2 | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | - | CMOS | BOTTOM | BALL | 250 | 0.8 mm | - | compliant | - | - | S-PBGA-B400 | 171 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | STD | - | FPGA - 5K Logic Modules | - | 6060 | - | 1 Core | - | - | - | 128KB | - | - | 17 mm | 17 mm | ||
| M2S005-VFG400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA2F500M3G-FGG484IAnlielectronics Тип | Microchip |
FPGA SmartFusion 500K Gates 80MHz 130nm (CMOS) Technology 1.5V 484-Pin FPBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | FPBGA-484 | YES | 484-FPBGA (23x23) | - | - | 484 | - | - | A2F500 | Microchip Technology / Atmel | - | 80 MHz | 64 kB | - | - | 60 | - | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484I | 80 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | - | - | - | SMD/SMT | - | 204 I/O | - | 6000 LE | 100 °C | -40 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.22 | Details | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | 0.062696 oz | - | -40°C ~ 100°C (TJ) | Tray | A2F500 | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | SOC - Systems on a Chip | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 16.5 mA | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | - | 500000 | STD | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | - | 1 Core | 500000 | - | - | 512KB | - | SoC FPGA | 23 mm | 23 mm | ||
| A2F500M3G-FGG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S025-VFG400Anlielectronics Тип | Microchip |
ACLM2S025-VFG400
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 400-LFBGA | - | 400-VFBGA (17x17) | - | - | - | - | - | M2S025 | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | 207 | - | 27696 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | - | 1 Core | - | - | - | 256KB | - | - | - | - | ||
| M2S025-VFG400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA2F500M3G-1FGG484Anlielectronics Тип | Microchip |
FPGA SmartFusion Family 500K Gates 100MHz 130nm (CMOS) Technology 1.5V 484-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 484-BGA | YES | 484-FPBGA (23x23) | - | - | 484 | - | - | A2F500 | Microchip Technology / Atmel | - | 100 MHz | 64 kB | - | - | 60 | - | MICROSEMI CORP | - | - | Microchip | A2F500M3G-1FGG484 | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | - | - | - | SMD/SMT | - | MCU - 41, FPGA - 128 | - | 6000 LE | 85 °C | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.36 | Details | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0.534969 oz | - | 0 to 85 °C | Tray | SmartFusion® | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | SOC - Systems on a Chip | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | - | 500000 | 1 | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | - | 1 Core | 500000 | - | - | 512KB | - | SoC FPGA | 23 mm | 23 mm | ||
| A2F500M3G-1FGG484 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S025-FGG484Anlielectronics Тип | Microchip |
FPGA SmartFusion2 27696 Cells 65nm Technology 1.2V 484-Pin FPBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 484-BGA | - | 484-FPBGA (23x23) | - | - | - | - | - | M2S025 | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | - | - | - | - | - | SMD/SMT | - | 267 | - | 27696 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | 1.2000 V | - | 25 V | 0 to 85 °C | - | SmartFusion®2 | - | 200 ppm/°C | - | 6.8 | - | - | - | - | - | 0.05 W | - | - | - | - | - | General Purpose | - | - | - | - | - | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | STD | 1 | FPGA - 25K Logic Modules | - | - | - | 1 Core | - | - | - | 256KB | - | - | - | - | ||
| M2S025-FGG484 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S010T-FGG484Anlielectronics Тип | Microchip |
ACLM2S010T-FGG484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 484-BGA | - | 484-FPBGA (23x23) | - | - | - | - | - | M2S010 | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | - | + 85 C | Microchip Technology | - | 0 C | - | - | - | - | - | SMD/SMT | - | 233 | - | 12084 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | STD | - | FPGA - 10K Logic Modules | - | - | - | 1 Core | - | - | - | 256KB | - | - | - | - | ||
| M2S010T-FGG484 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S010TS-1VFG256IAnlielectronics Тип | Microchip |
M2S Series 400 kb RAM 138 I/O Auto IGLOO2 & SmartFusion2 SoC FPGA - FPBGA-256
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | - | 256-FPBGA (17x17) | - | - | - | - | - | M2S010 | Microchip Technology / Atmel | - | - | 64 kB | - | - | 119 | - | - | - | - | Microchip | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | - | - | SMD/SMT | - | 138 | 1007 LAB | 12084 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Compliant | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | SOC - Systems on a Chip | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | SoC FPGA | - | - | - | - | - | FPGA - 10K Logic Modules | - | - | - | 1 Core | - | - | - | 256KB | - | SoC FPGA | - | - | ||
| M2S010TS-1VFG256I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA2F500M3G-FGG484Anlielectronics Тип | Microchip |
FPGA SmartFusion 500K Gates 80MHz 130nm (CMOS) Technology 1.5V 484-Pin FPBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | FPBGA-484 | YES | 484-FPBGA (23x23) | - | - | 484 | - | - | A2F500 | Microchip Technology / Atmel | 40 MHz | 80 MHz | 64 kB | 500000 | 500000 | 60 | ±2.8(20th) ppm/Year | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484 | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | Surface Mount | - | - | SMD/SMT | - | 204 I/O | - | 6000 LE | 85 °C | - | 40 MHz | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.37 | Details | Yes | This product may require additional documentation to export from the United States. | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | - | - | -20 to 70 °C | Tray | A2F500 | e1 | - | Temperature Compensated Crystal Oscillator (TCXO) | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | SOC - Systems on a Chip | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | 4.6 ppm | 10 | S-PBGA-B484 | 128 | Not Qualified | 3.0000 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | 10 pF | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | - | 500000 | STD | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | - | 1 Core | 500000 | Clipped Sinewave | - | 512KB | - | SoC FPGA | 23 mm | 23 mm | ||
| A2F500M3G-FGG484 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S050TS-FG484Anlielectronics Тип | Microchip |
IC SOC CORTEX-M3 166MHZ 484FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 484-BGA | - | 484-FPBGA (23x23) | - | - | - | - | - | M2S050 | - | - | - | 64 kB | - | - | - | - | - | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | 267 | - | 56340 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Non-Compliant | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | - | - | 1 Core | - | - | - | 256KB | - | - | - | - | ||
| M2S050TS-FG484 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S060T-FGG484Anlielectronics Тип | Microchip |
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | - | - | 484 | - | - | M2S060 | - | - | - | 64 kB | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-FGG484 | 166 MHz | - | - | Microchip Technology | - | - | - | 3 | - | - | - | - | - | 267 | - | 56520 LE | 85 °C | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Non-Compliant | Yes | - | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | Field Programmable Gate Arrays | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | 56520 | - | 1 Core | - | - | - | 256KB | - | - | 23 mm | 23 mm | ||
| M2S060T-FGG484 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S150-1FC1152Anlielectronics Тип | Microchip |
SMARTFUSION2
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | Stainless Steel | Stainless Steel | 1152 | 6.5 X 12 mm X 2 | 1 | M2S150 | - | - | - | 64 kB | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150-1FC1152 | 166 MHz | - | - | Microchip Technology | - | - | - | - | - | Screw, Weld | Universal | SMD/SMT | - | 574 | - | 146124 LE | 85 °C | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | - | No | - | Concealed, Removable | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e0 | - | - | - | Tin/Lead (Sn/Pb) | Natural | - | 8542.39.00.01 | Field Programmable Gate Arrays | - | CMOS | BOTTOM | BALL | 240 | 1 mm | - | not_compliant | - | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | - | Fasteners not included | - | - | - | - | FPGA - 150K Logic Modules | - | 146124 | Natural | 1 Core | - | - | 60.0 mm | 512KB | 5.0 mm | - | 35 mm | 35 mm | ||
| M2S150-1FC1152 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA2F200M3F-FGG256IAnlielectronics Тип | Microchip |
FPGA SmartFusion 200K Gates 80MHz 130nm (CMOS) Technology 1.5V 256-Pin FPBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | FPBGA-256 | YES | 256-FPBGA (17x17) | - | - | 256 | - | - | A2F200 | Microchip Technology / Atmel | - | 80 MHz | 64 kB | 200000 | 200000 | 90 | - | MICROSEMI CORP | - | - | Microchip | A2F200M3F-FGG256I | 80 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | 3 | - | - | - | SMD/SMT | - | 117 I/O | - | 2000 LE | 100 °C | -40 °C | - | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.33 | Details | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0.690329 oz | - | -40 to 100 °C | Tray | A2F200 | e3 | - | - | - | Matte Tin (Sn) | - | - | 8542.39.00.01 | SOC - Systems on a Chip | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B256 | 66 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 7 mA | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | - | 200000 | STD | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | - | 1 Core | 200000 | - | - | 256KB | - | SoC FPGA | 17 mm | 17 mm | ||
| A2F200M3F-FGG256I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA2F060M3E-FGG256Anlielectronics Тип | Microchip |
FPGA SmartFusion Family 60K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | YES | - | - | - | 256 | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | Microsemi Corporation | A2F060M3E-FGG256 | - | - | - | - | - | - | - | 3 | - | - | - | - | - | - | - | - | 85 °C | - | - | - | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | - | 30 | 5.82 | - | Yes | - | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e1 | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.39.00.01 | - | - | CMOS | BOTTOM | BALL | 250 | 1 mm | - | compliant | - | - | S-PBGA-B256 | - | - | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | 1536 | - | - | - | 60000 | - | - | - | - | - | 17 mm | 17 mm | ||
| A2F060M3E-FGG256 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипMPFS095TS-FCVG484IAnlielectronics Тип | Microchip |
MPFS095TS-FCVG484I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 484-BFBGA, FCBGA | - | 484-FCBGA (19x19) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4 x 32 kB | 16 kB, 4 x 32 kB | - | - | 667 MHz, 667 MHz | - | + 100 C | Microchip Technology | - | - 40 C | - | - | - | - | - | SMD/SMT | - | MCU - 136, FPGA - 276 | - | 93000 LE | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 100°C | - | PolarFire® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 V | - | - | - | - | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | - | - | - | - | - | - | - | - | - | FPGA - 93K Logic Modules | - | - | - | 5 Core | - | - | - | 128kB | - | - | - | - | ||
| MPFS095TS-FCVG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA2F200M3F-CS288Anlielectronics Тип | Microchip |
A2F200M3F-CS288
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 288-TFBGA, CSPBGA | - | 288-CSP (11x11) | - | - | - | - | - | A2F200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | MCU - 31, FPGA - 78 | - | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion® | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | - | - | - | - | - | 256KB | - | - | - | - | ||
| A2F200M3F-CS288 |
Индекс :
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