Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page35

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Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width
	Mfr. Тип M2S050-1FCSG325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-1FCSG325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325	325-FCBGA (11x11)	325	M2S050	ARM Cortex M3	64 kB	-	176	MICROSEMI CORP	-	-	M2S050-1FCSG325	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	SMD/SMT	200	4695 LAB	56340 LE	85 °C	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	-	5.76	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	40	S-PBGA-B325	200	Not Qualified	1.2 V	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	1	FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm
M2S050-1FCSG325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1VF256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-1VF256 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	VFPBGA-256	-	-	256-FPBGA (14x14)	-	M2S025	ARM Cortex M3	64 kB	-	119	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	138	2308 LAB	27696 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025T-1VF256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-1FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-1FG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	-	484-FPBGA (23x23)	484	M2S050	ARM Cortex M3	64 kB	-	60	MICROSEMI CORP	-	-	M2S050TS-1FG484	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	267	4695 LAB	56340 LE	85 °C	-	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.87	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 50K Logic Modules	56340	1 Core	256KB	23 mm	23 mm
M2S050TS-1FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-VF400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-VF400I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	VFPBGA-400	YES	-	400-VFBGA (17x17)	400	M2S050	ARM Cortex M3	64 kB	-	90	MICROSEMI CORP	-	-	M2S050T-VF400I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	207	4695 LAB	56340 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.81	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B400	207	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 50K Logic Modules	56340	1 Core	256KB	17 mm	17 mm
M2S050T-VF400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-1VF256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-1VF256 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 1 month ago)	VFPBGA-256	YES	-	256-FPBGA (14x14)	256	M2S010	ARM Cortex M3	64 kB	-	119	MICROSEMI CORP	-	-	M2S010TS-1VF256	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	138	1007 LAB	12084 LE	85 °C	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-256	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.87	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B256	138	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm
M2S010TS-1VF256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	-	484-FPBGA (23x23)	484	M2S050	ARM Cortex M3	64 kB	-	60	MICROSEMI CORP	-	-	M2S050T-FGG484	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	267	4695 LAB	56340 LE	85 °C	-	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	40	5.76	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	STD	FPGA - 50K Logic Modules	56340	1 Core	256KB	23 mm	23 mm
M2S050T-FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025TS-FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	-	-	484-FPBGA (23x23)	-	M2S025	ARM Cortex M3	64 kB	-	60	-	-	-	-	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	-	-	267	2308 LAB	27696 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	STD	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025TS-FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-FC1152I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150TS-FC1152I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-1152	YES	-	1152-FCBGA (35x35)	1152	M2S150	ARM Cortex M3	64 kB	-	24	MICROSEMI CORP	-	-	M2S150TS-FC1152I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	574	12177 LAB	146124 LE	-	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA1152,34X34,40	BGA1152,34X34,40	SQUARE	GRID ARRAY	Active	Active	30	5.83	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B1152	574	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	574	2.9 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 150K Logic Modules	146124	1 Core	512KB	35 mm	35 mm
M2S150TS-FC1152I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-1FG484M Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-484	YES	-	484-FPBGA (23x23)	484	M2S060	ARM Cortex M3	64 kB	1314 kbit	60	MICROSEMI CORP	-	-	M2S060T-1FG484M	166 MHz	-	+ 125 C	Microchip Technology	-	- 55 C	-	3	SMD/SMT	267 I/O	4710 LAB	56520 LE	125 °C	-55 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	-	SQUARE	GRID ARRAY	Active	Active	30	5.84	-	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0	Yes	3A001.A.2.C	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	-	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B484	-	-	1.2 V	-	MILITARY	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 60K Logic Modules	-	1 Core	256KB	23 mm	23 mm
M2S060T-1FG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FGG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-1FGG676 Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-676	-	-	676-FBGA (27x27)	-	M2S060	ARM Cortex M3	64 kB	1314 kbit	40	-	-	-	-	166 MHz	-	+ 85 C	Microchip Technology	-	0 C	-	-	SMD/SMT	387 I/O	4710 LAB	56520 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060T-1FGG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010S-1TQG144 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010S-1TQG144 Сборник данных Сравнение	Min.:1 Mult.:1	-	TQFP-144	-	-	144-TQFP (20x20)	-	M2S010	ARM Cortex M3	64 kB	400 kbit	60	-	-	-	-	166 MHz	-	+ 85 C	Microchip Technology	-	0 C	-	-	SMD/SMT	84 I/O	1007 LAB	12084 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 10K Logic Modules	-	1 Core	256KB	-	-
M2S010S-1TQG144 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-FCSG158I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-FCSG158I Сборник данных Сравнение	Min.:1 Mult.:1	-	TFBGA-158	-	-	158-FCBGA	-	-	ARM Cortex M3	64 kB	-	260	-	-	-	-	166 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	-	-	27696 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.14 V to 1.26 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025T-FCSG158I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1FCSG158I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-1FCSG158I Сборник данных Сравнение	Min.:1 Mult.:1	-	TFBGA-158	-	-	158-FCBGA	-	-	ARM Cortex M3	64 kB	-	260	-	-	-	-	166 MHz	-	+ 125 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	-	-	27696 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.14 V to 1.26 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025T-1FCSG158I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS160T-FCSG536E Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS160T-FCSG536E Сборник данных Сравнение	Min.:1 Mult.:1	-	FCSG-536	-	-	536-LFBGA	-	-	RV64GC, RV64IMAC	-	-	1	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	0 C	-	-	SMD/SMT	312 I/O	-	161000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 100°C	Tray	PolarFire™	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	1.4125MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	FPGA - 161K Logic Modules	-	5 Core	128kB	-	-
MPFS160T-FCSG536E Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS160TL-FCVG484E Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS160TL-FCVG484E Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-484	-	-	484-FCBGA (19x19)	-	-	RV64GC, RV64IMAC	-	-	1	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	0 C	-	-	SMD/SMT	312 I/O	-	161000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 100°C	Tray	PolarFire™	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	1.4125MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	FPGA - 161K Logic Modules	-	5 Core	128kB	-	-
MPFS160TL-FCVG484E Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS095TS-1FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS095TS-1FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-325	-	-	325-LFBGA (11x14.5)	-	-	RV64GC, RV64IMAC	-	-	1	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	276 I/O	-	93000 LE	-	-	Bulk	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-40°C ~ 100°C	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	857.6kB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	FPGA - 93K Logic Modules	-	5 Core	128KB	-	-
MPFS095TS-1FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS160T-1FCVG484E Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS160T-1FCVG484E Сборник данных Сравнение	Min.:1 Mult.:1	-	FCVG-484	-	-	484-FCBGA (19x19)	-	-	RV64GC, RV64IMAC	-	-	1	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	0 C	-	-	SMD/SMT	312 I/O	-	161000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 100°C	Tray	PolarFire®	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	1.4125MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	FPGA - 161K Logic Modules	-	5 Core	128kB	-	-
MPFS160T-1FCVG484E Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS160T-FCVG484E Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS160T-FCVG484E Сборник данных Сравнение	Min.:1 Mult.:1	-	FCVG-484	-	-	484-FCBGA (19x19)	-	-	RV64GC, RV64IMAC	-	-	1	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	0 C	-	-	SMD/SMT	312 I/O	-	161000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 100°C	Tray	PolarFire™	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	1.4125MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	FPGA - 161K Logic Modules	-	5 Core	128kB	-	-
MPFS160T-FCVG484E Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS095TLS-FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS095TLS-FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-325	-	-	325-LFBGA (11x14.5)	-	-	RV64GC, RV64IMAC	-	-	1	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	276 I/O	-	93000 LE	-	-	Bulk	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-40°C ~ 100°C	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	857.6kB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	FPGA - 93K Logic Modules	-	5 Core	128KB	-	-
MPFS095TLS-FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS250T-FCVG484I Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS250T-FCVG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCVG-484	-	-	484-FCBGA (19x19)	-	-	RV64GC, RV64IMAC	-	-	1	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	0 C	-	-	SMD/SMT	372 I/O	-	254000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-40°C ~ 100°C	Tray	PolarFire™	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	2.2MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	FPGA - 254K Logic Modules	-	5 Core	128kB	-	-
MPFS250T-FCVG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S050-1FCSG325,M2S025T-1VF256,M2S050TS-1FG484,M2S050T-VF400I,M2S010TS-1VF256.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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