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Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Distributed RAM	Embedded Block RAM - EBR	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	MSL	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Operating Temperature	Packaging	Series	JESD-609 Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Total RAM Bits	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Distributed RAM	Embedded Block RAM - EBR	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	MSL	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Operating Temperature	Packaging	Series	JESD-609 Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Total RAM Bits	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width
	Mfr. Тип M2S025T-1FCSG325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-1FCSG325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	-	325-FCBGA (11x11)	-	M2S025	ARM Cortex M3	64 kB	-	-	176	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	180	2308 LAB	27696 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025T-1FCSG325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-FCS325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-FCS325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S025	ARM Cortex M3	64 kB	-	-	176	MICROSEMI CORP	-	-	M2S025T-FCS325	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	MSL 3 - 168 hours	180	2308 LAB	27696 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	S-PBGA-B325	180	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	592Kbit	-	FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S025T-FCS325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-1FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-1FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	M2S050	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	267	4695 LAB	56340 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	1	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-
M2S050T-1FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-FG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-FG676 Сборник данных Сравнение	Min.:1 Mult.:1	-	676-BGA	-	676-FBGA (27x27)	-	M2S060	ARM Cortex M3	64 kB	-	-	40	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	387	4710 LAB	56520 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060TS-FG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-1FG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	M2S025	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	-	SMD/SMT	-	267	2308 LAB	27696 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-40 to 100 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	1	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025T-1FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-1FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-1FG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	M2S090	ARM Cortex M3	64 kB	-	-	60	MICROSEMI CORP	-	-	M2S090TS-1FG484	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	-	267	7193 LAB	86316 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	S-PBGA-B484	267	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S090TS-1FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-VF400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025-VF400I Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S025	ARM Cortex M3	64 kB	-	-	90	MICROSEMI CORP	-	-	M2S025-VF400I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	207	2308 LAB	27696 LE	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	S-PBGA-B400	207	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	1 Core	256KB	17 mm	17 mm
M2S025-VF400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-1FC1152I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150TS-1FC1152I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-1152	YES	1152-FCBGA (35x35)	1152	M2S150	ARM Cortex M3	64 kB	-	-	24	MICROSEMI CORP	-	-	M2S150TS-1FC1152I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	574	12177 LAB	146124 LE	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA1152,34X34,40	BGA1152,34X34,40	SQUARE	GRID ARRAY	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	S-PBGA-B1152	574	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	574	2.9 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 150K Logic Modules	146124	1 Core	512KB	35 mm	35 mm
M2S150TS-1FC1152I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-VFG256I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-VFG256I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	VFPBGA-256	-	256-FPBGA (17x17)	-	M2S010	ARM Cortex M3	64 kB	-	-	119	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	138	1007 LAB	12084 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	FPGA - 10K Logic Modules	-	1 Core	256KB	-	-
M2S010TS-VFG256I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-VF256I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025-VF256I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	256-LFBGA	-	256-FPBGA (14x14)	-	M2S025	ARM Cortex M3	64 kB	-	-	119	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	138	2308 LAB	27696 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025-VF256I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-FCSG325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-FCSG325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S050	ARM Cortex M3	64 kB	-	-	176	MICROSEMI CORP	-	-	M2S050-FCSG325	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	-	-	200	4695 LAB	56340 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.76	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	S-PBGA-B325	200	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	STD	FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm
M2S050-FCSG325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-1VFG256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-1VFG256 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-256	-	256-FPBGA (17x17)	-	M2S005	ARM Cortex M3	64 kB	-	-	119	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	161	505 LAB	6060 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-
M2S005S-1VFG256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-FCSG325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025-FCSG325 Сборник данных Сравнение	Min.:1 Mult.:1	-	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S025	ARM Cortex M3	64 kB	-	-	176	MICROSEMI CORP	-	-	M2S025-FCSG325	166 MHz	1.26 V	-	Microchip Technology	-	-	Yes	3	-	-	180	2308 LAB	27696 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.78	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	S-PBGA-B325	180	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S025-FCSG325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-1FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-1FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	M2S005	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	MSL 3 - 168 hours	209	505 LAB	6060 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	191Kbit	-	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-
M2S005-1FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010-1FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010-1FG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	M2S010	ARM Cortex M3	64 kB	-	-	60	MICROSEMI CORP	-	-	M2S010-1FG484	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	SMD/SMT	-	233	1007 LAB	12084 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	S-PBGA-B484	233	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	1	FPGA - 10K Logic Modules	9744	1 Core	256KB	23 mm	23 mm
M2S010-1FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-1FG676 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	676-BGA	YES	676-FBGA (27x27)	676	M2S060	ARM Cortex M3	64 kB	-	-	40	MICROSEMI CORP	-	-	M2S060T-1FG676	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	-	387	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-676	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	Active	30	5.88	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	S-PBGA-B676	387	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	387	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 60K Logic Modules	56520	1 Core	256KB	27 mm	27 mm
M2S060T-1FG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-1FG484I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	-	484-FPBGA (23x23)	-	M2S060	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	267	4710 LAB	56520 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060T-1FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-VFG256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025-VFG256 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	256-LBGA	YES	256-FPBGA (17x17)	256	M2S025	ARM Cortex M3	64 kB	-	-	119	MICROSEMI CORP	-	-	M2S025-VFG256	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	-	138	2308 LAB	27696 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-256	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.78	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	S-PBGA-B256	138	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	-	STD	FPGA - 25K Logic Modules	27696	1 Core	256KB	14 mm	14 mm
M2S025-VFG256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-FG896 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-FG896 Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-896	-	896-FBGA (31x31)	-	M2S050	ARM Cortex M3	64 kB	1.314 Mbit	64 kB	27	-	-	-	-	166 MHz	-	+ 85 C	Microchip Technology	-	0 C	Yes	-	SMD/SMT	-	377 I/O	4695 LAB	56340 LE	-	Tray	-	-	-	-	-	-	-	Obsolete	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	STD	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-
M2S050T-FG896 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-FG484 Anlielectronics Тип	Microchip	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	-	484-FPBGA (23x23)	-	M2S050	-	64 kB	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	-	-	-	-	267	-	56340 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Non-Compliant	-	-	-	-	-	-	-	0°C ~ 85°C (TJ)	-	SmartFusion®2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-
M2S050TS-FG484 Microchip RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S025T-1FCSG325,M2S025T-FCS325,M2S050T-1FGG484,M2S060TS-FG676,M2S025T-1FG484I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)