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- Integrated Circuits (ICs)
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- Embedded - System On Chip (SoC)
| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Propagation Delay | Connectivity | Turn On Delay Time | Architecture | Core Architecture | Boundary Scan | RAM (words) | Primary Attributes | Number of Registers | Bus Compatibility | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. ТипXCZU19EG-2FFVC1760EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1760-BBGA, FCBGA | - | - | - | 512 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-2FFVC1760E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXCZU5EV-1SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | 784-FCBGA (23x23) | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU5EV-1SFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU5CG-2SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU5CG-2SFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXCZU3EG-2SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 625-BFBGA, FCBGA | YES | - | - | 180 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 625 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | NOT SPECIFIED | R-PBGA-B625 | 0.876V | 0.825V | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU3EG-2SFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXC7Z045-L2FBG676IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 800MHZ 676FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | - | - | 676-BBGA, FCBGA | YES | - | - | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 27mm | ROHS3 Compliant | ||
| XC7Z045-L2FBG676I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXC7Z035-2FBG676EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 800MHZ 676FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | - | - | 676-BBGA, FCBGA | YES | - | - | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 275K Logic Cells | - | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 27mm | ROHS3 Compliant | ||
| XC7Z035-2FBG676E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXCZU9EG-3FFVB1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | 328 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU9EG-3FFVB1156E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU11EG-1FFVC1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU11EG-1FFVC1156E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXCZU6CG-2FFVC900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 900-BBGA, FCBGA | YES | - | - | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 900 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | NOT SPECIFIED | R-PBGA-B900 | 0.876V | 0.825V | - | - | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU6CG-2FFVC900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXCZU2CG-2SBVA484EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 484-BFBGA, FCBGA | - | - | - | 82 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-2SBVA484E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU3EG-2SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU3EG-2SFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU3EG-1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 625-BFBGA, FCBGA | - | - | - | 180 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU3EG-1SFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU6EG-L1FFVC900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 900-BBGA, FCBGA | YES | - | - | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 900 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU6EG-L1FFVC900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU7EV-1FBVB900EAnlielectronics Тип | Xilinx Inc. |
XILINX - XCZU7EV-1FBVB900E - MPSOC, ARM CORTEX-A53/R5, FCBGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 900-BBGA, FCBGA | - | - | - | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU7EV-1FBVB900E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU5EV-2SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU5EV-2SFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU2EG-1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 625-BFBGA, FCBGA | - | - | - | 180 | -40°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU2EG-1SFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU19EG-2FFVB1517IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1517-BBGA, FCBGA | - | - | - | 644 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-2FFVB1517I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU2CG-1SFVA625EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 625-BFBGA, FCBGA | - | - | - | 180 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | e1 | - | Active | 4 (72 Hours) | - | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-1SFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXC7Z100-L2FFG1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 KINTEX7 1156BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 1156-BBGA, FCBGA | - | 1156 | - | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | - | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 120 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 120 ps | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 444K Logic Cells | 554800 | CAN; ETHERNET; I2C; SPI; UART; USB | 3.1mm | 35mm | 35mm | ROHS3 Compliant | ||
| XC7Z100-L2FFG1156I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU5CG-L2SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | YES | - | - | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 784 | - | - | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | BOTTOM | BALL | - | 0.72V | - | - | - | S-PBGA-B784 | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU5CG-L2SFVC784E |
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