| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Mounting Type | Package / Case | Supplier Device Package | Base Product Number | Brand | Factory Pack QuantityFactory Pack Quantity | Interface Type | Manufacturer | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Package | Product Status | RoHS | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Operating Temperature | Packaging | Series | Type | Subcategory | Voltage - Supply | Operating Supply Voltage | Memory Size | Speed | Clock Frequency | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Write Cycle Time - Word, Page | Product Type | Memory Density | Product Category | Temperature | Memory Organization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипW25N02KVTBIU TRAnlielectronics Тип | Winbond Electronics |
IC FLASH 2GBIT SPI/QUAD 24TFBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 24-TBGA | 24-TFBGA (8x6) | W25N02 | Winbond | 2000 | Serial | Winbond | 104 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | - | SMD/SMT | Tape & Reel (TR) | Active | - | 3.6 V | 2.7 V | 2.7V - 3.6V | -40°C ~ 85°C (TA) | - | - | QspiNAND Flash | Memory & Data Storage | 2.7V ~ 3.6V | - | 2Gbit | 104MHz | 104 MHz | 7 ns | FLASH | SPI - Quad I/O | - | High Quality Single Level Cell (SLC) Technology Standard Serial Interface with x1/x2/x4 Bus Width | 700μs | NAND Flash | 2Gb | NAND Flash | 40ºC ~ 85ºC | 256M x 8 | ||
| W25N02KVTBIU TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW25N02KVTBIR TRAnlielectronics Тип | Winbond Electronics |
IC FLASH 2GBIT SPI/QUAD 24TFBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 24-TBGA | 24-TFBGA (8x6) | W25N02 | Winbond | 2000 | Serial | Winbond | 104 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | - | SMD/SMT | Tape & Reel (TR) | Active | - | 3.6 V | 2.7 V | 2.7V - 3.6V | -40°C ~ 85°C (TA) | - | - | QspiNAND Flash | Memory & Data Storage | 2.7V ~ 3.6V | - | 2Gbit | 104MHz | 104 MHz | 7 ns | FLASH | SPI - Quad I/O | - | High Quality Single Level Cell (SLC) Technology Standard Serial Interface with x1/x2/x4 Bus Width | 700μs | NAND Flash | 2Gb | NAND Flash | 40ºC ~ 85ºC | 256M x 8 | ||
| W25N02KVTBIR TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW25N02KVZEIR TRAnlielectronics Тип | Winbond Electronics |
IC FLASH 2GBIT SPI/QUAD 8WSON
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) | W25N02 | Winbond | 4000 | Serial | Winbond | 104 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | - | SMD/SMT | Tape & Reel (TR) | Active | - | 3.6 V | 2.7 V | 2.7V - 3.6V | -40°C ~ 85°C (TA) | - | - | QspiNAND Flash | Memory & Data Storage | 2.7V ~ 3.6V | - | 2Gbit | 104MHz | 104 MHz | 7 ns | FLASH | SPI - Quad I/O | - | High Quality Single Level Cell (SLC) Technology Standard Serial Interface with x1/x2/x4 Bus Width | 700μs | NAND Flash | 2Gb | NAND Flash | 40ºC ~ 85ºC | 256M x 8 | ||
| W25N02KVZEIR TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW971GG6NB-25 TRAnlielectronics Тип | Winbond Electronics |
IC DRAM 1GBIT PARALLEL 84WBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 84-TFBGA | 84-TFBGA (8x12.5) | W971GG6 | Winbond | 2500 | - | Winbond | - | + 85 C | Volatile | Winbond Electronics | 0 C | Yes | SMD/SMT | - | Active | Details | 1.9 V | 1.7 V | - | 0°C ~ 85°C (TC) | Cut Tape | - | SDRAM - DDR2 | Memory & Data Storage | 1.7V ~ 1.9V | 1.8 V | 1Gbit | - | 400 MHz | 400 ps | DRAM | SSTL_18 | - | 8 M x 16 | 15ns | DRAM | - | DRAM | - | 64M x 16 | ||
| W971GG6NB-25 TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW971GG6NB25I TRAnlielectronics Тип | Winbond Electronics |
IC DRAM 1GBIT PARALLEL 84WBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 84-TFBGA | 84-TFBGA (8x12.5) | W971GG6 | Winbond | 2500 | - | Winbond | - | + 95 C | Volatile | Winbond Electronics | - 40 C | - | SMD/SMT | Tape & Reel (TR) | Active | Details | 1.9 V | 1.7 V | - | -40°C ~ 95°C (TC) | Reel | - | SDRAM - DDR2 | Memory & Data Storage | 1.7V ~ 1.9V | 1.8 V | 1Gbit | - | 800 MHz | 400 ps | DRAM | SSTL_18 | - | 8 M x 16 | 15ns | DRAM | - | DRAM | - | 64M x 16 | ||
| W971GG6NB25I TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW631GG6NB-15 TRAnlielectronics Тип | Winbond Electronics |
IC DRAM 1GBIT PARALLEL 96VFBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) | W631GG6 | Winbond | 3000 | - | Winbond | 667 MHz | - | Volatile | Winbond Electronics | - | Yes | SMD/SMT | - | Active | Details | 1.5 V | 1.5 V | - | 0°C ~ 95°C (TC) | Cut Tape | - | SDRAM - DDR3 | Memory & Data Storage | 1.425V ~ 1.575V | 1.5 V | 1Gbit | - | 667 MHz | 20 ns | DRAM | SSTL_15 | - | 64 M x 16 | 15ns | DRAM | - | DRAM | - | 64M x 16 | ||
| W631GG6NB-15 TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW66CQ2NQUAGJ TRAnlielectronics Тип | Winbond Electronics |
4GB LPDDR4X, DDP, X32, 1866MHZ,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) | W66CQ2 | - | - | - | - | 1.866 GHz | + 105 C | Volatile | Winbond Electronics | - 40 C | - | SMD/SMT | Tape & Reel (TR) | Active | - | 1.95 V | 1.06 V | - | -40°C ~ 105°C (TC) | - | - | SDRAM - LPDDR4X | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | - | 4Gbit | - | 1.866 GHz | 3.5 ns | DRAM | LVSTL_11 | 32 bit | 128 M x 32 | 18ns | - | - | - | - | 128M x 32 | ||
| W66CQ2NQUAGJ TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW66BL6NBUAGJ TRAnlielectronics Тип | Winbond Electronics |
2GB LPDDR4, X16, 1866MHZ, -40C~1
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) | W66BL6 | - | - | - | - | - | - | Volatile | Winbond Electronics | - | - | - | Tape & Reel (TR) | Not For New Designs | - | - | - | - | -40°C ~ 105°C (TC) | - | - | - | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | - | 2Gbit | - | 1.866 GHz | 3.5 ns | DRAM | LVSTL_11 | - | - | 18ns | - | - | - | - | 128M x 16 | ||
| W66BL6NBUAGJ TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW66CM2NQUAGJAnlielectronics Тип | Winbond Electronics |
4GB LPDDR4X, DDP, X32, 1866MHZ,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) | W66CM2 | Winbond | 144 | - | Winbond | 1.866 GHz | + 105 C | Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tray | Not For New Designs | Details | 1.95 V | 1.06 V | - | -40°C ~ 105°C (TC) | Tray | - | SDRAM - LPDDR4X | Memory & Data Storage | 1.06V ~ 1.17V, 1.7V ~ 1.95V | - | 4Gbit | - | 1.866 GHz | 3.5 ns | DRAM | LVSTL_11 | 32 bit | 128 M x 32 | 18ns | DRAM | - | DRAM | - | 128M x 32 | ||
| W66CM2NQUAGJ | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW634GU8QB11I TRAnlielectronics Тип | Winbond Electronics |
4GB DDR3L 1.35V SDRAM, X8, 933MH
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) | W634GU8 | Winbond | 2000 | - | Winbond | 933 MHz | + 95 C | Volatile | Winbond Electronics | 0 C | Yes | SMD/SMT | Tape & Reel (TR) | Active | Details | 1.95 V | 1.06 V | - | -40°C ~ 95°C (TC) | Reel | - | SDRAM - DDR3L | Memory & Data Storage | 1.283V ~ 1.45V | - | 4Gbit | - | 933 MHz | 20 ns | DRAM | Parallel | 8 bit | 64 M x 8 | 15ns | DRAM | - | DRAM | - | 512M x 8 | ||
| W634GU8QB11I TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW634GU6QB11I TRAnlielectronics Тип | Winbond Electronics |
4GB DDR3L 1.35V SDRAM, X16, 933M
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) | W634GU6 | - | - | - | - | - | - | Volatile | Winbond Electronics | - | - | - | Tape & Reel (TR) | Active | - | - | - | - | -40°C ~ 95°C (TC) | - | - | - | - | 1.283V ~ 1.45V | - | 4Gbit | - | 933 MHz | 20 ns | DRAM | Parallel | - | - | 15ns | - | - | - | - | 256M x 16 | ||
| W634GU6QB11I TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW66BL6NBUAHJ TRAnlielectronics Тип | Winbond Electronics |
2GB LPDDR4, X16, 2133MHZ, -40C~1
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) | W66BL6 | Winbond | 2500 | - | Winbond | 2.133 GHz | + 105 C | Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tape & Reel (TR) | Not For New Designs | Details | 1.95 V | 1.06 V | - | -40°C ~ 105°C (TC) | Reel | - | SDRAM - LPDDR4 | Memory & Data Storage | 1.06V ~ 1.17V, 1.7V ~ 1.95V | - | 2Gbit | - | 2.133 GHz | 3.5 ns | DRAM | LVSTL_11 | 16 bit | 128 M x 16 | 18ns | DRAM | - | DRAM | - | 128M x 16 | ||
| W66BL6NBUAHJ TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW66CQ2NQUAFJAnlielectronics Тип | Winbond Electronics |
4GB LPDDR4X, DDP, X32, 1600MHZ,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) | W66CQ2 | Winbond | 1 | - | Winbond | 1.6 GHz | + 105 C | Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tray | Active | Details | 1.95 V | 1.06 V | - | -40°C ~ 105°C (TC) | Tray | - | SDRAM - LPDDR4X | Memory & Data Storage | 1.06V ~ 1.17V, 1.7V ~ 1.95V | - | 4Gbit | - | 2.133 GHz | 3.5 ns | DRAM | LVSTL_11 | 32 bit | 128 M x 32 | - | DRAM | - | DRAM | - | 128M x 32 | ||
| W66CQ2NQUAFJ | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW66BQ6NBUAGJ TRAnlielectronics Тип | Winbond Electronics |
2GB LPDDR4X, X16, 1866MHZ, -40C~
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) | W66BQ6 | - | - | - | - | 1.866 GHz | + 105 C | Volatile | Winbond Electronics | - 40 C | - | SMD/SMT | Tape & Reel (TR) | Active | - | 1.95 V | 1.06 V | - | -40°C ~ 105°C (TC) | - | - | SDRAM - LPDDR4X | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | - | 2Gbit | - | 1.866 GHz | 3.5 ns | DRAM | LVSTL_11 | 16 bit | 128 M x 16 | 18ns | - | - | - | - | 128M x 16 | ||
| W66BQ6NBUAGJ TR | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW634GU6QB-11Anlielectronics Тип | Winbond Electronics |
4GB DDR3L 1.35V SDRAM, X16, 933M
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) | W634GU6 | Winbond | 198 | - | Winbond | 933 MHz | + 105 C | Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tray | Active | Details | 1.95 V | 1.06 V | - | 0°C ~ 95°C (TC) | Tray | - | SDRAM - DDR3L | Memory & Data Storage | 1.283V ~ 1.45V | - | 4Gbit | - | 933 MHz | 20 ns | DRAM | Parallel | 16 bit | 64 M x 16 | 15ns | DRAM | - | DRAM | - | 256M x 16 | ||
| W634GU6QB-11 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW66BM6NBUAFJAnlielectronics Тип | Winbond Electronics |
2GB LPDDR4X, X16, 1600MHZ, -40C~
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) | W66BM6 | - | - | - | - | - | - | Volatile | Winbond Electronics | - | - | - | Tray | Not For New Designs | - | - | - | - | -40°C ~ 105°C (TC) | - | - | - | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | - | 2Gbit | - | 1.6 GHz | 3.5 ns | DRAM | LVSTL_11 | - | - | 18ns | - | - | - | - | 128M x 16 | ||
| W66BM6NBUAFJ | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW66CP2NQUAHJAnlielectronics Тип | Winbond Electronics |
4GB LPDDR4, DDP, X32, 2133MHZ, -
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) | W66CP2 | Winbond | 144 | - | Winbond | 2.133 GHz | + 105 C | Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tray | Active | Details | 1.95 V | 1.06 V | - | -40°C ~ 105°C (TC) | Tray | - | SDRAM - LPDDR4 | Memory & Data Storage | 1.06V ~ 1.17V, 1.7V ~ 1.95V | - | 4Gbit | - | 2.133 GHz | 3.5 ns | DRAM | LVSTL_11 | 32 bit | 128 M x 32 | 18ns | DRAM | - | DRAM | - | 128M x 32 | ||
| W66CP2NQUAHJ | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW66CP2NQUAFJAnlielectronics Тип | Winbond Electronics |
4GB LPDDR4, DDP, X32, 1600MHZ, -
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) | W66CP2 | Winbond | 144 | - | Winbond | 1.6 GHz | + 105 C | Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tray | Active | Details | 1.95 V | 1.06 V | - | -40°C ~ 105°C (TC) | Tray | - | SDRAM - LPDDR4 | Memory & Data Storage | 1.06V ~ 1.17V, 1.7V ~ 1.95V | - | 4Gbit | - | 2.133 GHz | 3.5 ns | DRAM | LVSTL_11 | 32 bit | 128 M x 32 | - | DRAM | - | DRAM | - | 128M x 32 | ||
| W66CP2NQUAFJ | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW29N02KWDIBFAnlielectronics Тип | Winbond Electronics |
2G-BIT NAND FLASH, 1.8V, 4-BIT E
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 48-VFBGA | 48-VFBGA (8x6.5) | W29N02 | Winbond | 260 | - | Winbond | - | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | - | SMD/SMT | Tray | Active | - | 1.95 V | 1.7 V | - | -40°C ~ 85°C (TA) | - | - | - | Memory & Data Storage | 1.7V ~ 1.95V | - | 2Gbit | - | - | 22 ns | FLASH | Parallel | 16 bit | 128 M x 16 | 25ns | NAND Flash | - | NAND Flash | - | 128M x 16 | ||
| W29N02KWDIBF | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипW634GU6QB09IAnlielectronics Тип | Winbond Electronics |
4GB DDR3L 1.35V SDRAM, X16, 1066
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) | W634GU6 | Winbond | 198 | - | Winbond | 1.066 GHz | + 95 C | Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tray | Active | Details | 1.95 V | 1.06 V | - | -40°C ~ 95°C (TC) | Tray | - | SDRAM - DDR3L | Memory & Data Storage | 1.283V ~ 1.45V | - | 4Gbit | - | 1.06 GHz | 20 ns | DRAM | Parallel | 16 bit | 64 M x 16 | 15ns | DRAM | - | DRAM | - | 256M x 16 | ||
| W634GU6QB09I |
Индекс :
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