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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Material | Shape | Package Cooled | Material Finish | Colour | Designed for | Factory Pack QuantityFactory Pack Quantity | Fin Height | Fin Style | Gross weight | Heatsink Material | Heatsink shape | Material finishing | Mfr | Mounting | Mounting Styles | Package | Plate thickness | Product Status | RoHS | Thermal resistance @200 LFM | Type of heatsink | Packaging | Series | Part Status | Moisture Sensitivity Level (MSL) | Type | Color | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Power Dissipation @ Temperature Rise | Product | Thermal resistance | Thermal Resistance | Diameter | Height | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. ТипHSE11-B20-NPAnlielectronics Тип | CUI Devices |
Heat Sinks heat sink, extrusion, TO-218/TO-220, 25 x 12 x 4.5 mm, M3
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Aluminum Alloy | Rectangular | TO-218, TO-220 | Black Anodized | - | TO-220 | - | - | - | - | Aluminum | - | - | CUI Devices | - | PCB | Bag | - | Active | Details | - | - | - | HSE | - | - | Extruded Heatsink | Black | Bolt On | - | 21.40°C/W @ 200 LFM | 38.90°C/W | 1.93W @ 75°C | Heatsinks | - | 42 C/W | - | 4.5 mm | 25 mm | 12 mm | - | ||
| HSE11-B20-NP | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSS21-B20-P53Anlielectronics Тип | CUI Devices |
Heat Sinks heat sink, stamping, TO-218/TO-220, 24.4 x 25.4 x 12.7 mm, solder pin
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Aluminum Alloy | Rectangular, Fins | TO-218, TO-220 | Black Anodized | - | TO-220 | - | - | Extruded Axial Fin | - | Aluminum | - | - | CUI Devices | - | PCB | Box | - | Active | Details | - | - | - | HSS | - | - | Stamped Heatsink | Black | PC Pin | - | 10.10°C/W @ 200 LFM | 20.93°C/W | 3.58W @ 75°C | Heatsinks | - | 24.3 C/W | - | 12.7 mm | 25.4 mm | 24.4 mm | - | ||
| HSS21-B20-P53 | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSS25-B20-P51Anlielectronics Тип | CUI Devices |
Heat Sinks heat sink, stamping, TO-218/TO-220, 42.5 x 25.4 x 25.4 mm, solder pin
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Aluminum Alloy | Square, Fins | TO-218, TO-220 | Black Anodized | - | TO-220 | - | - | Extruded Axial Fin | - | Aluminum | - | - | CUI Devices | - | PCB | Box | - | Active | Details | - | - | - | HSS | - | - | Stamped Heatsink | Black | PC Pin | - | 6.30°C/W @ 200 LFM | 12.75°C/W | 5.88W @ 75°C | Heatsinks | - | 16.2 C/W | - | 25.4 mm | 42.5 mm | 25.4 mm | - | ||
| HSS25-B20-P51 | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSE02-173213PAnlielectronics Тип | CUI Devices |
Heat Sinks heat sink, extrusion, 17 x 31.9 x 12.5 mm, T411 pad
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Aluminum Alloy | Square, Angled Fins | - | Blue Anodized | - | - | - | - | Angled Fin | - | Aluminum | - | - | CUI Devices | - | PCB | Box | - | Active | Details | - | - | - | HSE | - | - | Extruded Heatsink | Blue | Thermal Tape, Adhesive (Included) | - | 6.70°C/W @ 200 LFM | 21.44°C/W | 3.5W @ 75°C | Heatsinks | - | 26.1 C/W | - | 12.5 mm | 31.9 mm | 17 mm | - | ||
| HSE02-173213P | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSE09-755028Anlielectronics Тип | CUI Devices |
Heat Sinks heat sink, extrusion, TO-218/TO-220, 75 x 50 x 28 mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Aluminum Alloy | Rectangular, Angled Fins | TO-218, TO-220 | Black Anodized | - | TO-220, TO-218 | 200 | - | Angled Fin | - | Aluminum | - | - | CUI Devices | - | PCB | Bag | - | Active | Details | - | - | - | HSE | - | - | Extruded Heatsink | Black | Clip | - | 2.50°C/W @ 200 LFM | 5.66°C/W | 13.26W @ 75°C | Heatsinks | - | 5.2 C/W | - | 28 mm | 70 mm | 50 mm | - | ||
| HSE09-755028 | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSE08-505028Anlielectronics Тип | CUI Devices |
Heat Sinks heat sink, extrusion, TO-218/TO-220, 50 x 50 x 28 mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Aluminum Alloy | Rectangular, Angled Fins | TO-218, TO-220 | Black Anodized | - | TO-220, TO-218 | - | - | Angled Fin | - | Aluminum | - | - | CUI Devices | - | PCB | Bag | - | Active | Details | - | - | - | HSE | - | - | Extruded Heatsink | Black | Clip | - | 2.70°C/W @ 200 LFM | 7.13°C/W | 10.53W @ 75°C | Heatsinks | - | 7.6 C/W | - | 28 mm | 50 mm | 50 mm | - | ||
| HSE08-505028 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипHSB37-404023Anlielectronics Тип | CUI Devices |
HEAT SINK, BGA, 40 X 40 X 23 MM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Aluminum Alloy | Square, Pin Fins | BGA | Black Anodized | - | - | - | 0.905" (23.00mm) | - | - | - | - | - | CUI Devices | - | - | - | - | - | - | - | - | Box | HSB | Active | - | Top Mount | - | Adhesive (Not Included) | - | 2.10°C/W @ 200 LFM | 6.43°C/W | 11.7W @ 75°C | - | - | - | - | - | 1.575" (40.00mm) | 1.575" (40.00mm) | - | ||
| HSB37-404023 | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSB43-454515PAnlielectronics Тип | CUI Devices |
Heatsink: extruded; grilled; black; L: 45mm; W: 45mm; H: 15mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | aluminium | - | - | - | black | - | - | - | - | 25 g | - | grilled | anodized | - | retaining spring | - | - | 3mm | - | - | 3.2°C/W | extruded | - | - | - | - | - | - | - | - | - | - | - | - | max. 10.2°C/W | - | - | 15mm | 45mm | 45mm | - | ||
| HSB43-454515P | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSB45-383818Anlielectronics Тип | CUI Devices |
Heatsink: extruded; grilled; natural; L: 38.1mm; W: 38.1mm; H: 18mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | copper | - | - | - | natural | - | - | - | - | 71.88 g | - | grilled | raw | - | for back plate | - | - | 2.2mm | - | - | 2.9°C/W | extruded | - | - | - | - | - | - | - | - | - | - | - | - | max. 13.5°C/W | - | - | 18mm | 38.1mm | 38.1mm | - | ||
| HSB45-383818 | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSB41-303014PAnlielectronics Тип | CUI Devices |
Heatsink: extruded; grilled; black; L: 30mm; W: 45mm; H: 14mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | aluminium | - | - | - | black | - | - | - | - | 15.15 g | - | grilled | anodized | - | retaining spring | - | - | 2.5mm | - | - | 4.3°C/W | extruded | - | - | - | - | - | - | - | - | - | - | - | - | max. 15.1°C/W | - | - | 14mm | 30mm | 45mm | - | ||
| HSB41-303014P | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSB36-353510Anlielectronics Тип | CUI Devices |
Heatsink: extruded; grilled; black; L: 35mm; W: 35mm; H: 10mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | aluminium | - | - | - | black | - | - | - | - | 10.94 g | - | grilled | anodized | - | for back plate | - | - | 1.5mm | - | - | 4.3°C/W | extruded | - | - | - | - | - | - | - | - | - | - | - | - | max. 15°C/W | - | - | 10mm | 35mm | 35mm | - | ||
| HSB36-353510 | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSB32-232318Anlielectronics Тип | CUI Devices |
Heatsink: extruded; grilled; black; L: 23mm; W: 23mm; H: 18mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | aluminium | - | - | - | black | - | - | - | - | 14.2 g | - | grilled | anodized | - | for back plate | - | - | 1.5mm | - | - | 4.4°C/W | extruded | - | - | - | - | - | - | - | - | - | - | - | - | max. 17.2°C/W | - | - | 18mm | 23mm | 23mm | - | ||
| HSB32-232318 | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSB33-272710Anlielectronics Тип | CUI Devices |
Heatsink: extruded; grilled; black; L: 27mm; W: 27mm; H: 10mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | aluminium | - | - | - | black | - | - | - | - | 6.25 g | - | grilled | anodized | - | for back plate | - | - | 1.5mm | - | - | 5.3°C/W | extruded | - | - | - | - | - | - | - | - | - | - | - | - | max. 20.7°C/W | - | - | 10mm | 27mm | 27mm | - | ||
| HSB33-272710 | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSB34-282811Anlielectronics Тип | CUI Devices |
Heatsink: extruded; grilled; black; L: 27.9mm; W: 27.9mm; H: 11.2mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | aluminium | - | - | - | black | - | - | - | - | 8.93 g | - | grilled | anodized | - | for back plate | - | - | 2mm | - | - | 5.1°C/W | extruded | - | - | - | - | - | - | - | - | - | - | - | - | max. 17.9°C/W | - | - | 11.2mm | 27.9mm | 27.9mm | - | ||
| HSB34-282811 | ||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHSB38-707025PAnlielectronics Тип | CUI Devices |
Heatsink: extruded; grilled; black; L: 69.7mm; W: 69.7mm; H: 25mm
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | aluminium | - | - | - | black | - | - | - | - | 119.05 g | - | grilled | anodized | - | retaining spring | - | - | 4.5mm | - | - | 1.2°C/W | extruded | - | - | - | - | - | - | - | - | - | - | - | - | max. 4.2°C/W | - | - | 25mm | 69.7mm | 69.7mm | - | ||
| HSB38-707025P | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипHSS-B20-NP-02Anlielectronics Тип | CUI Devices |
HEATSINK TO-220 3.6W ALUMINUM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | Aluminum | Rectangular, Fins | TO-220 | Black Anodized | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | HSS | Active | Not Applicable | Board Level | - | - | 0.394 10.00mm | 5.39°C/W @ 200 LFM | 20.59°C/W | 3.6W @ 75°C | - | - | - | - | - | 0.748 19.00mm | 0.830 21.08mm | RoHS Compliant | ||
| HSS-B20-NP-02 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипHSS-C52-NP-SMT-TRAnlielectronics Тип | CUI Devices |
HEAT SINK TO-252 COPPER
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | Copper | Rectangular, Fins | TO-252 (DPak) | Tin | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Tape & Reel (TR) | HSS | Active | Not Applicable | Top Mount | - | - | 0.400 10.16mm | 10.05°C/W @ 200 LFM | 35.71°C/W | 2.1W @ 75°C | - | - | - | - | - | 0.315 8.00mm | 0.900 22.86mm | RoHS Compliant | ||
| HSS-C52-NP-SMT-TR | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипHSE-B20254-056HAnlielectronics Тип | CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 25
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | Aluminum Alloy | Rectangular, Fins | TO-220 | Black Anodized | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | HSE | Active | Not Applicable | Board Level, Vertical | - | PC Pin | 0.500 12.70mm | 8.36°C/W @ 200 LFM | 13.64°C/W | 5.5W @ 75°C | - | - | - | - | - | 1.000 25.40mm | 1.378 35.00mm | RoHS Compliant | ||
| HSE-B20254-056H | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипHSE-B18254-0396HAnlielectronics Тип | CUI Devices |
HEAT SINK, EXTRUSION,TO-218, 25.
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | Aluminum Alloy | Rectangular, Fins | TO-218 | Black Anodized | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | HSE | Active | Not Applicable | Board Level, Vertical | - | PC Pin | 0.984 25.00mm | 2.29°C/W @ 200 LFM | 9.15°C/W | 8.2W @ 75°C | - | - | - | - | - | 1.000 25.40mm | 1.654 42.00mm | RoHS Compliant | ||
| HSE-B18254-0396H | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипHSE-B20254-035H-02Anlielectronics Тип | CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 25
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | Aluminum Alloy | Rectangular, Fins | TO-220 | Black Anodized | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | HSE | Active | Not Applicable | Board Level, Vertical | - | PC Pin | 0.500 12.70mm | 4.39°C/W @ 200 LFM | 13.64°C/W | 5.5W @ 75°C | - | - | - | - | - | 1.000 25.40mm | 1.378 35.00mm | RoHS Compliant | ||
| HSE-B20254-035H-02 |
Индекс :
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