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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
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![]() | Mfr. ТипXCZU5EG-1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU5EG-1SFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z014S-2CLG484IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 766MHZ 484BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | - | 484-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 484 | Matte Tin (Sn) | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B484 | - | - | - | 1.05V | - | - | 0.95V | 766MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | YES | - | 256000 | Artix™-7 FPGA, 65K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 19mm | 19mm | ROHS3 Compliant | ||
| XC7Z014S-2CLG484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S025T-FCSG325Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S025T-FCSG325
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S025 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025T-FCSG325 | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | MSL 3 - 168 hours | 180 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | 0.111027 oz | 0 to 85 °C | Tray | - | SmartFusion2 | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 0.5 mm | compliant | - | - | S-PBGA-B325 | 180 | Not Qualified | - | - | 1.2 V | OTHER | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | 592Kbit | - | STD | - | FPGA - 25K Logic Modules | 27696 | 1 Core | - | 256KB | - | 11 mm | 11 mm | - | ||
| M2S025T-FCSG325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EG-3FFVC1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 360 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 600MHz, 667MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU7EG-3FFVC1156E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-1FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU9CG-1FFVB1156I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU15EG-2FFVC900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU15EG-2FFVC900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5CSEMA4U23C8NAnlielectronics Тип | Intel |
FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 40K Logic Elements | 40000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
| 5CSEMA4U23C8N | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S025-VFG256IAnlielectronics Тип | Atmel (Microchip Technology) |
SoC FPGA M2S025-VFG256I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | ARM Cortex M3 | 64 kB | 119 | - | - | - | - | 166 MHz | + 100 C | - | - 40 C | Yes | - | SMD/SMT | - | 138 I/O | 2308 LAB | 27696 LE | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | - | - | - | - | 0.241494 oz | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | ||
| M2S025-VFG256I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-1SFVA625EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 625-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 180 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU2EG-1SFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип10AS027E3F29E2SGAnlielectronics Тип | Intel |
IC SOC CORTEX-A9 1.5GHZ 780FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | 780-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 360 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | 780 | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | NOT SPECIFIED | - | S-PBGA-B780 | 360 | Not Qualified | - | 0.93V | 0.9V | - | 0.87V | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 270K Logic Elements | 270000 | - | - | - | 3.35mm | 29mm | 29mm | RoHS Compliant | ||
| 10AS027E3F29E2SG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5CSEMA5F31I7NAnlielectronics Тип | Intel |
FPGA Cyclone® V SE Family 85000 Cells 28nm Technology 1.1V 896-Pin FBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | - | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | NOT SPECIFIED | 5CSEMA5 | S-PBGA-B896 | 288 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | 85000 | - | - | - | 2mm | 31mm | 31mm | RoHS Compliant | ||
| 5CSEMA5F31I7N | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-L1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 784-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 784 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B784 | - | - | - | 0.742V | - | - | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU2EG-L1SFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5CSEMA6F31C7NAnlielectronics Тип | Intel |
FPGA Cyclone® V SE Family 110000 Cells 28nm Technology 1.1V 896-Pin FBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | - | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | NOT SPECIFIED | 5CSEMA6 | S-PBGA-B896 | 288 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 110K Logic Elements | 110000 | - | - | - | 2mm | 31mm | 31mm | RoHS Compliant | ||
| 5CSEMA6F31C7N | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EV-1FBVB900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU7EV-1FBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3EG-1SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU3EG-1SFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9EG-L1FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 1156-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Bulk | 2013 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B1156 | - | - | - | 0.742V | - | - | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU9EG-L1FFVB1156I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-L1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 784-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 784 | - | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | S-PBGA-B784 | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-L1SFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5CSEBA5U19A7NAnlielectronics Тип | Intel |
IC SOC CORTEX-A9 700MHZ 484UBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | - | - | Active | 3 (168 Hours) | 484 | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | 700MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | 85000 | - | - | - | 1.9mm | 19mm | 19mm | RoHS Compliant | ||
| 5CSEBA5U19A7N | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU15EG-2FFVB1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU15EG-2FFVB1156E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z014S-2CLG400EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 766MHZ 400BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | - | 400-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 125 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 400 | Matte Tin (Sn) | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B400 | - | - | - | 1.05V | - | - | 0.95V | 766MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | YES | - | 256000 | Artix™-7 FPGA, 65K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||
| XC7Z014S-2CLG400E |
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