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- Integrated Circuits (ICs)
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- Embedded - System On Chip (SoC)
| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXCZU2CG-L1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 625 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B625 | - | - | 0.742V | - | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-L1SFVA625I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-L1FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 328 | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B1156 | - | - | 0.742V | - | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU9CG-L1FFVB1156I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU5EV-1FBVB900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU5EV-1FBVB900I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4CG-2FBVB900IAnlielectronics Тип | Xilinx Inc. |
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 900 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | NOT SPECIFIED | - | R-PBGA-B900 | - | - | 0.876V | - | 0.825V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU4CG-2FBVB900I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU3EG-1SFVA625QAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 128 | -40°C~125°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 625 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B625 | - | - | - | - | - | 500MHz, 1.2GHz | 1.8MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 3.43mm | 21mm | 21mm | ROHS3 Compliant | ||
| XAZU3EG-1SFVA625Q | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-1FFVC1760IAnlielectronics Тип | Xilinx Inc. |
FPGA Zynq UltraScale Family 653100 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | - | 512 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU11EG-1FFVC1760I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип10AS057N2F40I2LGAnlielectronics Тип | Intel |
IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 588 | -40°C~100°C TJ | Tray | - | Arria 10 SX | - | Active | 3 (168 Hours) | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | - | S-PBGA-B1517 | 588 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 570K Logic Elements | 570000 | 3.5mm | 40mm | 40mm | RoHS Compliant | ||
| 10AS057N2F40I2LG | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-L2FFVB1517EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | YES | 644 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B1517 | - | - | 0.742V | - | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-L2FFVB1517E | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-1FFVD1760IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | - | 308 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-1FFVD1760I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5CSEBA5U23I7SNAnlielectronics Тип | Intel |
IC SOC CORTEX-A9 800MHZ 672UBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | - | Active | 3 (168 Hours) | 672 | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
| 5CSEBA5U23I7SN | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип10AS066H4F34E3SGAnlielectronics Тип | Intel |
FPGA Arria® 10 SX Family 660000 Cells 20nm Technology 0.9V Medical 1152-Pin FBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 492 | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | Active | 3 (168 Hours) | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | - | S-PBGA-B1152 | 492 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.65mm | 35mm | 35mm | RoHS Compliant | ||
| 10AS066H4F34E3SG | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | - | 180 | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-1SFVA625I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6EG-L2FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 900 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B900 | - | - | 0.742V | - | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU6EG-L2FFVC900E | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6EG-3FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU6EG-3FFVC900E | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-L1FFVC1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 360 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B1156 | - | - | 0.742V | - | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU7CG-L1FFVC1156I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-L1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 625 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B625 | - | - | 0.742V | - | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-L1SFVA625I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-2FFVB1517EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | - | 644 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-2FFVB1517E | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-L1FFVC900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 900 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B900 | - | - | 0.742V | - | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU9CG-L1FFVC900I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU15EG-L1FFVC900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 900 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B900 | - | - | 0.742V | - | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU15EG-L1FFVC900I | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5CSEBA5U19C8SNAnlielectronics Тип | Intel |
FPGA Cyclone® V SE Family 85000 Cells 28nm Technology 1.1V 484-Pin UFBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | Active | 3 (168 Hours) | 484 | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.9mm | 19mm | 19mm | RoHS Compliant | ||
| 5CSEBA5U19C8SN |
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