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- Integrated Circuits (ICs)
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- Embedded - System On Chip (SoC)
| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXA7Z030-1FBV484QAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 667MHZ 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | 484-BBGA, FCBGA | YES | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | - | - | Active | 4 (72 Hours) | 484 | EAR99 | - | - | 8542.39.00.01 | BOTTOM | BALL | - | - | - | - | - | S-PBGA-B484 | - | - | - | - | - | 667MHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Kintex™-7 FPGA, 125K Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XA7Z030-1FBV484Q | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-L2SFVA625EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 625 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B625 | - | - | 0.742V | - | 0.698V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-L2SFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-L1FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 328 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B1156 | - | - | 0.742V | - | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU6CG-L1FFVB1156I | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5CSEMA5F31C8NAnlielectronics Тип | Intel |
IC Soc CORTEX-A9 600MHZ 896FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | - | Active | 3 (168 Hours) | 896 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSEMA5 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 2mm | 31mm | 31mm | RoHS Compliant | ||
| 5CSEMA5F31C8N | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип10AS066K2F35I1HGAnlielectronics Тип | Intel |
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 1152-BBGA, FCBGA | - | 396 | - | -40°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | FPGA - 660K Logic Elements | - | - | - | - | RoHS Compliant | ||
| 10AS066K2F35I1HG | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5ASTFD5G3F35I3NAnlielectronics Тип | Intel |
IC SOC CORTEX-A9 1.05GHZ 1152BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | - | -40°C~100°C TJ | Tray | - | Arria V ST | e1 | - | Active | 3 (168 Hours) | - | - | TIN SILVER COPPER | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.15V | 1mm | NOT SPECIFIED | 5ASTFD5 | S-PBGA-B1152 | - | - | 1.18V | - | 1.12V | 1.05GHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | - | 2.7mm | 35mm | 35mm | RoHS Compliant | ||
| 5ASTFD5G3F35I3N | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-2SBVA484EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 484-BFBGA, FCBGA | - | 82 | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU2EG-2SBVA484E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-L2SFVA625EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 625 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B625 | - | - | 0.742V | - | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU2EG-L2SFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-2SFVA625EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | - | 180 | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU2EG-2SFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU5CG-L1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 784 | - | - | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | S-PBGA-B784 | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU5CG-L1SFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EG-3FFVF1517EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | - | 464 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 600MHz, 667MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU7EG-3FFVF1517E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EV-3FBVB900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU4EV-3FBVB900E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип10AS016E4F29E3SGAnlielectronics Тип | Intel |
IC SOC CORTEX-A9 1.5GHZ 780FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 780-BBGA, FCBGA | YES | 288 | - | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | 780 | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | - | S-PBGA-B780 | 288 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | 3.35mm | 29mm | 29mm | RoHS Compliant | ||
| 10AS016E4F29E3SG | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5CSEMA6F31I7NAnlielectronics Тип | Intel |
IC SOC CORTEX-A9 800MHZ 896FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | - | Active | 3 (168 Hours) | 896 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSEMA6 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 2mm | 31mm | 31mm | RoHS Compliant | ||
| 5CSEMA6F31I7N | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип5CSEBA2U19A7NAnlielectronics Тип | Intel |
FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | - | -40°C~125°C TJ | Tray | 2017 | Automotive, AEC-Q100, Cyclone® V SE | - | - | Active | 3 (168 Hours) | 484 | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.9mm | 19mm | 19mm | RoHS Compliant | ||
| 5CSEBA2U19A7N | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9EG-L2FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | - | 0°C~100°C TJ | Bulk | 2013 | Zynq® UltraScale+™ MPSoC EG | e1 | - | Active | 4 (72 Hours) | 900 | - | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B900 | - | - | 0.742V | - | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU9EG-L2FFVC900E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-L2FFVD1760EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | YES | 308 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B1760 | - | - | 0.742V | - | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-L2FFVD1760E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип10AS066N3F40I2SGAnlielectronics Тип | Intel |
IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 588 | - | -40°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | - | S-PBGA-B1517 | 588 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.5mm | 40mm | 40mm | RoHS Compliant | ||
| 10AS066N3F40I2SG | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-L2SBVA484EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 484-BFBGA, FCBGA | YES | 82 | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 484 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B484 | - | - | 0.742V | - | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU2EG-L2SBVA484E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2CG-L2SFVA625EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 625 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B625 | - | - | 0.742V | - | 0.698V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-L2SFVA625E |
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