Memory Products For Sale - PDF - Integrated Circuits (ICs)

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Surface Mount	Material	Number of Terminals	Access Time-Max	Adjustment range (amperage)	Amperage adjustment range (max.)	Amperage adjustment range (min.)	Base Product Number	Clock Frequency-Max (fCLK)	Content	Diameter after shrinkage	Diameter before shrinkage	Diameter of protected wire (cable)	Dim	Gross weight	Ihs Manufacturer	Manufacturer	Manufacturer Part Number	Max. temperature	Mfr	Min. temperature	No. of pins	Number of auxiliary contacts as normally closed contact	Number of auxiliary contacts as normally open contact	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Rated permanent current Iu	Reflow Temperature-Max (s)	Risk Rank	Rohs Code	RoHS-compliant	Supply Voltage-Nom (Vsup)	Switching voltage (max.)	Transport packaging size/quantity	Usage Level	Voltage, Rating	Wall thickness after shrinkage	Wall thickness before shrinkage	Packaging	Series	Tolerance	ECCN Code	Temperature Coefficient	Type	Resistance	Max Operating Temperature	Min Operating Temperature	Composition	Color	Additional Feature	HTS Code	Power Rating	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Depth	Reach Compliance Code	JESD-30 Code	Qualification Status	Working voltage	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Number of Ports	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Operating temperature range	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Shrink temperature	Alternate Memory Width	Refresh Cycles	Access Mode	Self Refresh	Shrink ratio	Height	Length	Width

Изображение	Тип	Марка	Объяснение	Количество	Surface Mount	Material	Number of Terminals	Access Time-Max	Adjustment range (amperage)	Amperage adjustment range (max.)	Amperage adjustment range (min.)	Base Product Number	Clock Frequency-Max (fCLK)	Content	Diameter after shrinkage	Diameter before shrinkage	Diameter of protected wire (cable)	Dim	Gross weight	Ihs Manufacturer	Manufacturer	Manufacturer Part Number	Max. temperature	Mfr	Min. temperature	No. of pins	Number of auxiliary contacts as normally closed contact	Number of auxiliary contacts as normally open contact	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Rated permanent current Iu	Reflow Temperature-Max (s)	Risk Rank	Rohs Code	RoHS-compliant	Supply Voltage-Nom (Vsup)	Switching voltage (max.)	Transport packaging size/quantity	Usage Level	Voltage, Rating	Wall thickness after shrinkage	Wall thickness before shrinkage	Packaging	Series	Tolerance	ECCN Code	Temperature Coefficient	Type	Resistance	Max Operating Temperature	Min Operating Temperature	Composition	Color	Additional Feature	HTS Code	Power Rating	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Depth	Reach Compliance Code	JESD-30 Code	Qualification Status	Working voltage	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Number of Ports	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Operating temperature range	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Shrink temperature	Alternate Memory Width	Refresh Cycles	Access Mode	Self Refresh	Shrink ratio	Height	Length	Width
	Mfr. Тип 24AA04TSN Anlielectronics Тип	Microsemi	- Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
24AA04TSN Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип EDI88130CS55CB Anlielectronics Тип	Microsemi	Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
EDI88130CS55CB Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип WE512K8-150CIA Anlielectronics Тип	Microsemi	EEPROM Memory Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	MERCURY SYSTEMS INC	-	WE512K8-150CIA	-	-	-	-	-	-	-	-	-	-	-	-	-	,	-	-	-	Active	-	-	-	5.69	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	unknown	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	EEPROM MODULE	5 V	-	-	-	-	-	-	-	-	-
WE512K8-150CIA Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MAX24310EXG PROG Anlielectronics Тип	Microsemi	Clock Generators & Support Products 10 Out Any-Rate Timing IC W/EEPROM Programmed Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MAX24310EXG PROG Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип WSF512K32-29G2TIA Anlielectronics Тип	Microsemi	SRAM Memory Сборник данных Сравнение	Min.:1 Mult.:1	YES	-	68	-	-	-	-	-	-	-	-	-	-	-	-	MERCURY SYSTEMS INC	Miscellaneous	WSF512K32-29G2TIA	-	-	-	-	-	-	524288 words	512000	85 °C	-40 °C	-	CERAMIC, METAL-SEALED COFIRED	QFP	QFP,	-	SQUARE	FLATPACK	Obsolete	-	-	-	5.66	No	-	5 V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	SRAM IS ORGANISED AS 512K X 32	8542.32.00.71	-	CMOS	QUAD	GULL WING	-	1	1.27 mm	-	unknown	S-CQFP-G68	-	-	5.5 V	INDUSTRIAL	4.5 V	-	ASYNCHRONOUS	-	512KX32	-	4.57 mm	32	-	-	16777216 bit	-	-	-	MEMORY CIRCUIT	-	-	-	-	-	-	-	-	22.36 mm	22.36 mm
WSF512K32-29G2TIA Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W3H128M72E-400SBM Anlielectronics Тип	Microsemi	DRAM Memory Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	40 - 100 A	100A	40A	-	-	1pc(s)	-	-	-	(W x H x D) 105 x 198 x 86 mm	-	-	-	-	+70°C	-	-25°C	3-pin	0	0	-	-	-	-	-	-	-	-	-	-	-	-	-	100A	-	-	-	Yes	-	600V AC	-	-	-	-	-	-	-	-	-	-	3VA6210-6JT31-0AA0	-	-	-	-	-	-	-	-	-	-	-	-	-	-	86mm	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	198mm	-	105mm
W3H128M72E-400SBM Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MAX24710EXG PROG Anlielectronics Тип	Microsemi	Clock Synthesizer / Jitter Cleaner 10GbE Any Freq. Line Card w/EEPROM Programmable Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MAX24710EXG PROG Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип 93AA46CI/MS Anlielectronics Тип	Microsemi	- Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	150 V	-	-	-	-	0.5 %	-	100 ppm/°C	-	2.7 Ω	155 °C	-55 °C	Thin Film	-	-	-	500 mW	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	650 µm	-	-
93AA46CI/MS Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип WS512K32N-17H1QA Anlielectronics Тип	Microsemi	SRAM Memory Сборник данных Сравнение	Min.:1 Mult.:1	NO	-	66	17 ns	-	-	-	DTS20Z11	-	-	-	-	-	-	-	WHITE MICROELECTRONICS	White Microelectronics	WS512K32N-17H1QA	-	TE Connectivity Deutsch Connectors	-	-	-	-	524288 words	512000	125 °C	-55 °C	Bag	CERAMIC, METAL-SEALED COFIRED	-	CERAMIC, HIP-66	-	SQUARE	IN-LINE	Transferred	Active	-	-	5.55	-	-	5 V	-	-	Military grade	-	-	-	-	*	-	-	-	-	-	-	-	-	-	USER CONFIGURABLE AS 2M X 8	-	-	CMOS	HEX	PIN/PEG	-	1	-	-	unknown	S-CHIP-P66	Not Qualified	-	5.5 V	MILITARY	4.5 V	-	ASYNCHRONOUS	-	512KX32	-	-	32	-	-	16777216 bit	MIL-STD-883	PARALLEL	-	SRAM MODULE	-	-	16	-	-	-	-	-	-	-
WS512K32N-17H1QA Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W3H32M72E-400SBM Anlielectronics Тип	Microsemi Corporation	DDR DRAM Module, 32MX72, 0.6ns, CMOS, PBGA208, Сборник данных Сравнение	Min.:1 Mult.:1	YES	synthetic polyolefin	208	0.6 ns	-	-	-	-	200 MHz	-	5.0 mm	10.5 mm	5.2…9.0 mm	-	1245.00	MICROSEMI CORP	-	-	-	-	-	-	-	-	33554432 words	32000000	125 °C	-55 °C	-	PLASTIC/EPOXY	BGA	BGA, BGA208,11X19,40	BGA208,11X19,40	RECTANGULAR	GRID ARRAY	Transferred	-	-	-	-	-	-	1.8 V	-	464650/10	-	-	0.6 mm	0.3 mm	spool 100 m	-	-	EAR99	-	Heat shrink tubing without adhesive	-	-	-	-	black	-	8542.32.00.36	-	-	BOTTOM	BALL	-	-	1 mm	-	compliant	R-PBGA-B208	Not Qualified	600 V	-	MILITARY	-	-	-	1.7 mA	32MX72	3-STATE	-	72	-55…+125 °C	0.035 A	2415919104 bit	-	-	COMMON	DDR DRAM MODULE	-	+70…+120 °C	-	8192	-	-	2 : 1	-	-	-
W3H32M72E-400SBM Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип EDI88512CA-55CB Anlielectronics Тип	Microsemi	Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Сборник данных Сравнение	Min.:1 Mult.:1	NO	-	32	55 ns	-	-	-	-	-	-	-	-	-	-	-	MERCURY SYSTEMS INC	Mercury Systems Inc	EDI88512CA55CB	-	-	-	-	-	-	524288 words	512000	125 °C	-55 °C	-	CERAMIC, METAL-SEALED COFIRED	DIP	DIP,	-	RECTANGULAR	IN-LINE	Obsolete	-	-	-	5.58	-	-	5 V	-	-	-	-	-	-	-	-	-	3A001.A.2.C	-	-	-	-	-	-	-	-	8542.32.00.41	-	CMOS	DUAL	THROUGH-HOLE	-	1	2.54 mm	-	unknown	R-CDIP-T32	-	-	5.5 V	MILITARY	4.5 V	-	ASYNCHRONOUS	-	512KX8	-	3.937 mm	8	-	-	4194304 bit	-	PARALLEL	-	STANDARD SRAM	-	-	-	-	-	-	-	-	40.64 mm	15.24 mm
EDI88512CA-55CB Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W3H32M64E-400SBI Anlielectronics Тип	Microsemi	DDR DRAM, 32MX64, 0.6ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 Сборник данных Сравнение	Min.:1 Mult.:1	YES	-	208	0.6 ns	-	-	-	-	-	-	-	-	-	-	-	MERCURY SYSTEMS INC	Mercury Systems Inc	W3H32M64E-400SBI	-	-	-	-	-	-	33554432 words	32000000	85 °C	-40 °C	-	PLASTIC/EPOXY	BGA	BGA,	-	RECTANGULAR	GRID ARRAY	Contact Manufacturer	-	-	30	5.18	-	-	1.8 V	-	-	-	-	-	-	-	-	-	EAR99	-	-	-	-	-	-	-	AUTO/SELF REFRESH	8542.32.00.36	-	CMOS	BOTTOM	BALL	225	1	-	-	unknown	R-PBGA-B208	Not Qualified	-	1.9 V	INDUSTRIAL	1.7 V	1	SYNCHRONOUS	-	32MX64	-	-	64	-	-	2147483648 bit	-	-	-	DDR DRAM	-	-	-	-	FOUR BANK PAGE BURST	YES	-	-	-	-
W3H32M64E-400SBI Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип 5962-9318706H5A Anlielectronics Тип	Microsemi	- Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
5962-9318706H5A Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип EDI8L32512C15AC Anlielectronics Тип	Microsemi	SRAM Module, 512KX32, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
EDI8L32512C15AC Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип EDI8L32512C17AI Anlielectronics Тип	Microsemi	SRAM Module, 512KX32, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
EDI8L32512C17AI Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W332M64V-133BI Anlielectronics Тип	Microsemi	Synchronous DRAM, 32MX64, 5.5ns, CMOS, PBGA219, 25 X 25 MM, PLASTIC, BGA-219 Сборник данных Сравнение	Min.:1 Mult.:1	YES	-	219	5.5 ns	-	-	-	-	-	-	-	-	-	-	-	MERCURY SYSTEMS INC	Mercury Systems Inc	W332M64V-133BI	-	-	-	-	-	-	33554432 words	32000000	85 °C	-40 °C	-	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Active	-	-	30	5.37	-	-	3.3 V	-	-	-	-	-	-	-	-	-	EAR99	-	-	-	-	-	-	-	AUTO/SELF REFRESH	8542.32.00.36	-	CMOS	BOTTOM	BALL	225	1	-	-	unknown	S-PBGA-B219	Not Qualified	-	3.6 V	INDUSTRIAL	3 V	1	SYNCHRONOUS	-	32MX64	-	-	64	-	-	2147483648 bit	-	-	-	SYNCHRONOUS DRAM	-	-	-	-	FOUR BANK PAGE BURST	YES	-	-	-	-
W332M64V-133BI Microsemi RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Memory definition: Memory is a component used to store programs and various data information. A memory cell is actually a type of sequential logic circuit. A m... Memory Product Listing: 24AA04TSN,EDI88130CS55CB,WE512K8-150CIA,MAX24310EXG PROG,WSF512K32-29G2TIA.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Memory has 16 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)