Memory Products For Sale - PDF - Integrated Circuits (ICs) -Page21

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Factory Lead Time	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Access Time-Max	Base Product Number	Brand	Clock Frequency-Max (fCLK)	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Temperature	Moisture Sensitive	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Supply Voltage	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Interface	Memory Size	Number of Ports	Nominal Supply Current	Operating Mode	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Max Frequency	Access Time (Max)	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Serial Bus Type	Endurance	Data Retention Time-Min	Write Protection	Alternate Memory Width	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Product Category	Memory Organization	Height Seated (Max)	Length	Width	RoHS Status

Изображение	Тип	Марка	Объяснение	Количество	Factory Lead Time	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Access Time-Max	Base Product Number	Brand	Clock Frequency-Max (fCLK)	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Temperature	Moisture Sensitive	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Supply Voltage	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Interface	Memory Size	Number of Ports	Nominal Supply Current	Operating Mode	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Max Frequency	Access Time (Max)	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Serial Bus Type	Endurance	Data Retention Time-Min	Write Protection	Alternate Memory Width	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Product Category	Memory Organization	Height Seated (Max)	Length	Width	RoHS Status
	Mfr. Тип W25Q64FVTCIP Anlielectronics Тип	Winbond Electronics	IC FLASH 64M SPI 104MHZ 24TFBGA Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	24-TBGA	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	-	SpiFlash®	-	-	Obsolete	3 (168 Hours)	24	-	-	-	-	-	-	-	-	-	2.7V~3.6V	BOTTOM	-	-	1	3V	1mm	-	-	-	R-PBGA-B24	Not Qualified	-	3.6V	3/3.3V	-	2.7V	-	64Mb 8M x 8	-	-	SYNCHRONOUS	104MHz	-	-	FLASH	SPI - Quad I/O, QPI	-	64MX1	-	-	1	50μs, 3ms	-	-	-	0.000025A	67108864 bit	-	-	SERIAL	-	-	3V	SPI	100000 Write/Erase Cycles	20	HARDWARE/SOFTWARE	-	-	-	-	-	-	-	-	1.2mm	8mm	6mm	ROHS3 Compliant
W25Q64FVTCIP Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W25Q128FVCIG Anlielectronics Тип	Winbond Electronics	IC FLASH 128MBIT 104MHZ 24TFBGA Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	24-TBGA	YES	24	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	2012	SpiFlash®	-	-	Discontinued	3 (168 Hours)	24	3A991.B.1.A	-	-	-	-	-	8542.32.00.51	-	-	2.7V~3.6V	BOTTOM	-	-	1	3V	1mm	-	-	24	-	Not Qualified	-	3.6V	3/3.3V	-	2.7V	SPI, Serial	128Mb 16M x 8	-	-	SYNCHRONOUS	104MHz	-	-	FLASH	SPI - Quad I/O, QPI	-	128MX1	-	-	1	50μs, 3ms	-	-	-	0.00002A	134217728 bit	-	-	-	-	-	3V	SPI	100000 Write/Erase Cycles	20	HARDWARE/SOFTWARE	-	-	-	-	-	-	-	-	1.2mm	8mm	6mm	ROHS3 Compliant
W25Q128FVCIG Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W25Q32JVDAIQ Anlielectronics Тип	Winbond Electronics	IC FLASH 32M SPI 133MHZ 8DIP Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	-	Through Hole	8-DIP (0.300, 7.62mm)	NO	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	2014	SpiFlash®	e3	yes	Active	1 (Unlimited)	8	-	-	Matte Tin (Sn)	-	-	2.7V NOMINAL AVAILABLE WITH 104MHZ	-	-	-	2.7V~3.6V	DUAL	-	NOT SPECIFIED	1	3.3V	2.54mm	-	NOT SPECIFIED	-	R-PDIP-T8	-	-	3.6V	-	-	3V	SPI, Serial	32Mb 4M x 8	-	-	SYNCHRONOUS	133MHz	-	-	FLASH	SPI - Quad I/O	-	4MX8	-	-	8	3ms	-	-	-	-	33554432 bit	-	-	-	-	-	3V	-	-	-	-	1	-	-	-	-	-	-	-	5.33mm	9.27mm	7.62mm	ROHS3 Compliant
W25Q32JVDAIQ Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W632GU6MB-11 Anlielectronics Тип	Winbond Electronics	IC DRAM 2G PARALLEL 933MHZ Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	96-VFBGA	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0°C~95°C TC	Tray	-	-	-	-	Obsolete	3 (168 Hours)	96	EAR99	-	-	-	-	AUTO/SELF REFRESH	-	-	-	1.283V~1.45V	BOTTOM	-	NOT SPECIFIED	1	1.35V	0.8mm	-	NOT SPECIFIED	-	R-PBGA-B96	-	-	1.45V	-	-	1.283V	-	2Gb 128M x 16	1	-	SYNCHRONOUS	933MHz	-	20ns	DRAM	Parallel	-	128MX16	-	-	16	-	-	-	-	-	2147483648 bit	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1mm	13mm	7.5mm	ROHS3 Compliant
W632GU6MB-11 Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W9812G6JH-6 Anlielectronics Тип	Winbond	Synchronous DRAM, 8MX16, 5ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT,TSOP2-54 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	54	5 ns	-	-	166 MHz	-	WINBOND ELECTRONICS CORP	Winbond Electronics Corp	W9812G6JH-6	-	-	-	-	-	-	-	8388608 words	8000000	70 °C	-	-	PLASTIC/EPOXY	TSOP2	TSOP2, TSOP54,.46,32	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	-	NOT SPECIFIED	5.33	-	Yes	-	-	3.3 V	-	-	-	-	e3	Yes	-	-	-	EAR99	-	Tin (Sn)	-	-	AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	-	DUAL	GULL WING	260	1	-	0.8 mm	unknown	-	54	R-PDSO-G54	Not Qualified	-	3.6 V	3.3 V	COMMERCIAL	3 V	-	-	1	-	SYNCHRONOUS	-	0.075 mA	-	-	-	-	8MX16	3-STATE	1.2 mm	16	-	-	-	-	0.002 A	134217728 bit	-	-	-	COMMON	SYNCHRONOUS DRAM	-	-	-	-	-	-	4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	-	-	-	22.22 mm	10.16 mm	-
W9812G6JH-6 Winbond RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W25Q32FVTCIG Anlielectronics Тип	Winbond Electronics	IC FLASH 32M SPI 104MHZ 24TFBGA Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	24-TBGA	YES	24	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	2016	SpiFlash®	-	-	Obsolete	3 (168 Hours)	24	-	-	-	-	-	-	-	-	-	2.7V~3.6V	BOTTOM	-	-	1	3V	1mm	-	-	-	-	Not Qualified	-	3.6V	3/3.3V	-	2.7V	SPI, Serial	32Mb 4M x 8	-	-	SYNCHRONOUS	104MHz	-	-	FLASH	SPI - Quad I/O, QPI	-	32MX1	-	-	1	50μs, 3ms	-	-	-	0.00002A	33554432 bit	-	-	-	-	-	2.7V	SPI	100000 Write/Erase Cycles	20	HARDWARE/SOFTWARE	-	-	-	-	-	-	-	-	1.2mm	8mm	6mm	ROHS3 Compliant
W25Q32FVTCIG Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W632GG8KB-15 Anlielectronics Тип	Winbond Electronics	IC SDRAM 2GBIT 667MHZ 78BGA Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	78-TFBGA	YES	78	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	0°C~95°C TC	Tray	2016	-	-	-	Discontinued	3 (168 Hours)	78	-	-	-	-	-	AUTO/SELF REFRESH	-	-	-	1.425V~1.575V	BOTTOM	-	NOT SPECIFIED	1	1.5V	0.8mm	-	NOT SPECIFIED	-	-	Not Qualified	-	1.575V	1.5V	-	1.425V	-	2Gb 256M x 8	1	-	SYNCHRONOUS	667MHz	-	20ns	DRAM	Parallel	-	256MX8	3-STATE	-	8	-	-	-	-	0.019A	2147483648 bit	-	-	-	COMMON	-	-	-	-	-	-	-	8192	48	48	-	-	-	-	1.2mm	10.5mm	8mm	ROHS3 Compliant
W632GG8KB-15 Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W25Q64CVZEIG Anlielectronics Тип	Winbond Electronics	IC FLASH 64M SPI 80MHZ 8WSON Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	8-WDFN Exposed Pad	YES	8	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	2011	SpiFlash®	-	-	Obsolete	3 (168 Hours)	8	3A991.B.1.A	-	-	-	-	-	-	-	-	2.7V~3.6V	DUAL	-	-	1	3V	1.27mm	unknown	-	8	-	Not Qualified	-	3.6V	3/3.3V	-	2.7V	SPI, Serial	64Mb 8M x 8	-	-	SYNCHRONOUS	80MHz	-	-	FLASH	SPI - Quad I/O	-	64MX1	-	-	1	50μs, 3ms	-	-	-	0.000005A	-	-	-	-	-	-	2.7V	SPI	100000 Write/Erase Cycles	20	HARDWARE/SOFTWARE	-	-	-	-	-	-	-	-	-	-	6mm	ROHS3 Compliant
W25Q64CVZEIG Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W25Q16CLSSIG Anlielectronics Тип	Winbond Electronics	IC FLASH 16M SPI 50MHZ 8SOIC Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	8-SOIC (0.209, 5.30mm Width)	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	Non-Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tube	2016	SpiFlash®	-	-	Obsolete	3 (168 Hours)	8	EAR99	-	-	-	-	-	8542.32.00.51	-	-	2.3V~3.6V	DUAL	-	-	1	3V	1.27mm	-	-	8	S-PDSO-G8	Not Qualified	-	3.6V	3/3.3V	-	2.3V	SPI, Serial	16Mb 2M x 8	-	-	SYNCHRONOUS	50MHz	-	-	FLASH	SPI - Quad I/O	-	16MX1	-	-	1	50μs, 3ms	-	-	-	0.000005A	16777216 bit	-	-	-	-	-	3V	SPI	100000 Write/Erase Cycles	20	HARDWARE/SOFTWARE	-	-	-	-	-	-	-	-	2.16mm	5.23mm	5.23mm	ROHS3 Compliant
W25Q16CLSSIG Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W25X40BLSNIG Anlielectronics Тип	Winbond	Flash, 4MX1, PDSO8, 0.150 INCH, GREEN, SOIC-8 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	8	-	-	-	50 MHz	-	WINBOND ELECTRONICS CORP	Winbond Electronics Corp	W25X40BLSNIG	-	-	-	-	-	-	-	4194304 words	4000000	85 °C	-40 °C	-	PLASTIC/EPOXY	SOP	0.150 INCH, GREEN, SOIC-8	SOP8,.25	RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	-	-	5.59	-	Yes	-	-	2.5 V	-	-	-	-	-	-	-	-	-	EAR99	NOR TYPE	-	-	-	ORGANIZED AS 2048 PAGES OF 256 BYTES, ALSO OPERATES WITH 2.3-3.6V SUPPLY AT 50 MHZ	8542.32.00.51	Flash Memories	CMOS	-	DUAL	GULL WING	-	1	-	1.27 mm	unknown	-	8	R-PDSO-G8	Not Qualified	-	3.6 V	2.5/3.3 V	INDUSTRIAL	2.3 V	-	-	-	-	SYNCHRONOUS	-	0.025 mA	-	-	-	-	4MX1	-	1.75 mm	1	-	-	-	-	0.000005 A	4194304 bit	-	-	SERIAL	-	FLASH	2.7 V	SPI	100000 Write/Erase Cycles	20	HARDWARE/SOFTWARE	-	-	-	-	-	-	-	-	-	4.9 mm	3.9 mm	-
W25X40BLSNIG Winbond RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W9712G6JB-25 Anlielectronics Тип	Winbond	DDR DRAM, 8MX16, 0.4ns, CMOS, PBGA84, 12.50 X 8 MM, ROHS COMPLIANT, WBGA-84 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	84	0.4 ns	-	-	400 MHz	-	WINBOND ELECTRONICS CORP	Winbond Electronics Corp	W9712G6JB-25	-	-	-	-	-	-	-	8388608 words	8000000	85 °C	-	-	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	-	NOT SPECIFIED	5.67	-	Yes	-	-	1.8 V	-	-	-	-	-	-	-	-	-	EAR99	-	-	-	-	AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	-	BOTTOM	BALL	NOT SPECIFIED	1	-	0.8 mm	compliant	-	84	R-PBGA-B84	Not Qualified	-	1.9 V	1.8 V	OTHER	1.7 V	-	-	1	-	SYNCHRONOUS	-	0.17 mA	-	-	-	-	8MX16	3-STATE	1.2 mm	16	-	-	-	-	0.005 A	134217728 bit	-	-	-	COMMON	DDR DRAM	-	-	-	-	-	-	4096	4,8	4,8	FOUR BANK PAGE BURST	YES	-	-	-	12.5 mm	8 mm	-
W9712G6JB-25 Winbond RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W971GG8SB-25 Anlielectronics Тип	Winbond Electronics Corporation	- Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	TFBGA	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	DDR2 SDRAM, RAM	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	60	EAR99	-	-	85°C	0°C	AUTO/SELF REFRESH	-	-	-	-	BOTTOM	BALL	NOT SPECIFIED	1	1.8V	0.8mm	-	NOT SPECIFIED	-	R-PBGA-B60	-	-	1.9V	-	OTHER	1.7V	Parallel	-	1	-	SYNCHRONOUS	-	-	-	-	-	-	128MX8	-	-	8	-	-	-	-	-	1073741824 bit	-	0.4 ns	-	-	-	-	-	-	-	-	-	-	-	-	MULTI BANK PAGE BURST	-	-	-	1.2mm	12.5mm	8mm	RoHS Compliant
W971GG8SB-25 Winbond Electronics Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W971GG6JB-18 Anlielectronics Тип	Winbond	DDR DRAM, 64MX16, 0.35ns, CMOS, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	YES	-	-	84	0.35 ns	-	-	533 MHz	-	WINBOND ELECTRONICS CORP	Winbond Electronics Corp	W971GG6JB-18	-	-	-	-	-	-	-	67108864 words	64000000	85 °C	-	-	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	-	NOT SPECIFIED	5.46	-	Yes	-	-	1.8 V	-	-	-	-	-	-	-	-	-	EAR99	-	-	-	-	AUTO/SELF REFRESH	8542.32.00.32	DRAMs	CMOS	-	BOTTOM	BALL	NOT SPECIFIED	1	-	0.8 mm	compliant	-	84	R-PBGA-B84	Not Qualified	-	1.9 V	1.8 V	OTHER	1.7 V	-	-	1	-	SYNCHRONOUS	-	0.285 mA	-	-	-	-	64MX16	3-STATE	1.2 mm	16	-	-	-	-	0.01 A	1073741824 bit	-	-	-	COMMON	DDR DRAM	-	-	-	-	-	-	8192	4,8	4,8	MULTI BANK PAGE BURST	YES	-	-	-	12.5 mm	8 mm	-
W971GG6JB-18 Winbond RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W971GG8JB25I Anlielectronics Тип	Winbond Electronics	DRAM Chip DDR2 SDRAM 1G-Bit 128Mx8 1.8V 60-Pin WBGA Сборник данных Сравнение	Min.:1 Mult.:1	-	Surface Mount	Surface Mount	60-TFBGA	-	60	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~95°C TC	Tray	2013	-	-	-	Obsolete	3 (168 Hours)	60	EAR99	-	-	-	-	AUTO/SELF REFRESH	8542.32.00.36	-	-	1.7V~1.9V	BOTTOM	-	NOT SPECIFIED	1	1.8V	0.8mm	-	NOT SPECIFIED	60	-	Not Qualified	1.8V	1.9V	-	-	1.7V	-	1Gb 128M x 8	1	110mA	SYNCHRONOUS	200MHz	-	400ps	DRAM	Parallel	-	128MX16	3-STATE	-	16	15ns	17b	-	1 Gb	-	-	800MHz	-	-	COMMON	-	-	-	-	-	-	-	8192	48	48	-	-	-	-	1.2mm	12.5mm	-	ROHS3 Compliant
W971GG8JB25I Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W9412G6JH-5I Anlielectronics Тип	Winbond Electronics	IC DRAM 128M PARALLEL 66TSOP II Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	66-TSSOP (0.400, 10.16mm Width)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-40°C~85°C TA	Tray	2010	-	-	-	Obsolete	3 (168 Hours)	-	-	-	-	-	-	-	-	-	-	2.3V~2.7V	-	-	-	-	-	-	unknown	-	-	-	-	-	-	-	-	-	-	128Mb 8M x 16	-	-	-	200MHz	-	50ns	DRAM	Parallel	-	-	-	-	-	15ns	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	ROHS3 Compliant
W9412G6JH-5I Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W959D8NFYA4I Anlielectronics Тип	Winbond Electronics	512MB HYPERRAM X8, 200MHZ, IND T Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	24-TBGA	-	-	24-TFBGA, DDP (6x8)	-	-	W959D8	-	-	-	-	-	-	250 MHz	+ 85 C	Volatile	Winbond Electronics	- 40 C	-	SMD/SMT	-	-	-	-	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	2 V	1.7 V	-	-40°C ~ 85°C (TC)	-	-	-	-	-	-	-	-	-	HyperRAM	-	-	-	-	-	-	-	1.7V ~ 2V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	512Mbit	-	-	-	250 MHz	100 mA	28 ns	DRAM	HyperBus	8 bit	64 M x 8	-	-	-	35ns	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	64M x 8	-	-	-	-
W959D8NFYA4I Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W66BP6NBUAGJ Anlielectronics Тип	Winbond Electronics	2GB LPDDR4, X16, 1866MHZ, -40C~1 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	200-WFBGA	-	-	200-WFBGA (10x14.5)	-	-	W66BP6	Winbond	-	144	-	Winbond	-	1.866 GHz	+ 105 C	Volatile	Winbond Electronics	- 40 C	Yes	SMD/SMT	-	-	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	Details	-	1.95 V	1.06 V	-	-40°C ~ 105°C (TC)	Tray	-	-	-	-	-	-	-	-	SDRAM - LPDDR4	-	-	-	-	-	Memory & Data Storage	-	1.06V ~ 1.17V, 1.7V ~ 1.95V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2Gbit	-	-	-	1.866 GHz	-	3.5 ns	DRAM	LVSTL_11	16 bit	128 M x 16	-	-	-	18ns	-	DRAM	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	DRAM	128M x 16	-	-	-	-
W66BP6NBUAGJ Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W29N02KWDIBF TR Anlielectronics Тип	Winbond Electronics	2G-BIT NAND FLASH, 1.8V, 4-BIT E Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	48-VFBGA	-	-	48-VFBGA (8x6.5)	-	-	W29N02	Winbond	-	3500	-	Winbond	-	-	+ 85 C	Non-Volatile	Winbond Electronics	- 40 C	-	SMD/SMT	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	-	Active	-	-	-	-	1.95 V	1.7 V	-	-40°C ~ 85°C (TA)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	1.7V ~ 1.95V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2Gbit	-	-	-	-	-	22 ns	FLASH	Parallel	16 bit	128 M x 16	-	-	-	25ns	-	NAND Flash	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	NAND Flash	128M x 16	-	-	-	-
W29N02KWDIBF TR Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W634GU8QB09I Anlielectronics Тип	Winbond Electronics	4GB DDR3L 1.35V SDRAM, X8, 1066M Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	78-VFBGA	-	-	78-VFBGA (8x10.5)	-	-	W634GU8	-	-	-	-	-	-	-	-	Volatile	Winbond Electronics	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-40°C ~ 95°C (TC)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.283V ~ 1.45V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	4Gbit	-	-	-	1.06 GHz	-	20 ns	DRAM	Parallel	-	-	-	-	-	15ns	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	512M x 8	-	-	-	-
W634GU8QB09I Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип W77M26FJWFIE TR Anlielectronics Тип	Winbond Electronics	SECURE SPIFLASH, 1.8V, 32M-BIT, Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	16-SOIC (0.295", 7.50mm Width)	-	-	16-SOIC	-	-	W77M26	Winbond	-	1000	-	Winbond	-	-	-	Volatile	Winbond Electronics	-	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-40°C ~ 85°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.7V ~ 1.95V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	32Mbit	-	-	-	104 MHz	-	-	DRAM	SPI - Quad I/O, QPI, DTR	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Winbond Electronics Corporation	4M x 8	-	-	-	-
W77M26FJWFIE TR Winbond Electronics RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Memory definition: Memory is a component used to store programs and various data information. A memory cell is actually a type of sequential logic circuit. A m... Memory Product Listing: W25Q64FVTCIP,W25Q128FVCIG,W25Q32JVDAIQ,W632GU6MB-11,W9812G6JH-6.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Memory has 3184 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)